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CY2302SXC-1

Infineon Technologies

CY2302SXC-1 by Infineon Technologies

CY2302SXC-1 clock driver by Infineon has a propagation delay of 0.35 ns, operates at 3.3V, and offers 2 true outputs. Ideal for applications requiring precise timing control in commercial temperature environments. Package style is small outline with gull wing terminals for easy surface mounting.

Median Price

$4.075

Lifecycle Status

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19

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1k+

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Mouser Electronics

USA . 395 parts In-Stock

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$6.160

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$4.690

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$3.590

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$6.160

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Chip1Stop

Japan . 275 parts In-Stock

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$7.740

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$4.700

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$4.140

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Rochester

USA . 5,048 parts In-Stock

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$3.260

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$2.920

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$2.740

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Verical

USA . 4,138 parts In-Stock

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Flip Electronics (Authorized)

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DigiKey

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Nova Conductors

Japan . 61 parts In-Stock

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Digiode

USA . 749 parts In-Stock

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Vyrian

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PC Components Company LLC

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Bristol Electronics

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Prism Electronics

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Aranea Global

USA . 50 parts In-Stock

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$2.512

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50

$2.617

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Continental Prestige Electronics

USA . 2,823 parts In-Stock

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$2.670

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$2.617

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Argo Parts USA

USA . 2,613 parts In-Stock

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$2.670

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Ampacity Inc.

Singapore . 2,750 parts In-Stock

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Corphita

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Component Stockers USA

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Andel Nordic

Denmark . 1,660 parts In-Stock

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Aztec Data Supply Inc.

USA . 342 parts In-Stock

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South Africa . 648 parts In-Stock

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Modulus Dynamics

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Microchip USA

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Alle Elektronik GmbH

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GreenTree Electronics

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of precision timing with the CY2302SXC-1 clock driver & buffer from Infineon Technologies. Crafted with quality materials and cutting-edge technology, this small outline package delivers lightning-fast propagation delay at nominal supply voltage, making it ideal for a wide range of applications. With dual terminal position and standard input conditioning, this versatile component ensures reliable performance in any setup. Experience seamless synchronization and superior reliability with the CY2302SXC-1 - your key to efficient and high-performance clock management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability for the package, making it a good choice for long-term use.

Propagation Delay At Nominal Supply: 0.35 ns

The low propagation delay at nominal supply ensures fast and efficient operation of the clock driver, making it suitable for high-performance applications.

Surface Mount: YES

The surface mount feature enables easy installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in digital circuits, making this clock driver compatible with a wide range of systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this clock driver can withstand heat and operate reliably in various environmental conditions.

Technical Specifications

Clock Drivers & Buffers CY2302SXC-1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Additional Features:

IT ALSO OPERATES WITH 5V SUPPLY

Family:

23S

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.8985 mm

Minimum fmax:

133 MHz

Trade Compliance

CY2302SXC-1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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