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LMK00105SQE/NOPB

Texas Instruments

LMK00105SQE/NOPB by Texas Instruments

LMK00105SQE/NOPB by Texas Instruments is a Clock Driver & Buffer with 2.8 ns Propagation Delay, 3.3V Nominal Voltage, and 10 pF Load Capacitance. It is used in applications requiring precise timing control such as industrial automation systems or telecommunications equipment.

Median Price

$4.526

Lifecycle Status

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19

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1k+

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Rochester

USA . 369 parts In-Stock

1+ parts

$2.790

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$2.730

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$2.680

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369

$2.790

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Chip1Stop

Japan . 12 parts In-Stock

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$4.010

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Farnell

UK . 93 parts In-Stock

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$3.530

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Texas Instruments

USA . 148,844 parts In-Stock

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$4.591

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$3.743

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$2.495

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Arrow

USA . 131 parts In-Stock

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$6.958

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$4.079

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DigiKey

USA . 1,315 parts In-Stock

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$7.040

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$4.583

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$4.181

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$4.069

1,315

$7.040

$4.583

$4.181

$4.069

Mouser Electronics

USA . 1,189 parts In-Stock

1+ parts

$7.040

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$4.590

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$4.040

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$7.040

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$4.040

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Verical

USA . 131 parts In-Stock

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$4.079

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$4.079

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Distributors (In-Stock)

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Digiode

USA . 875 parts In-Stock

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$4.361

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875

$4.361

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Nova Conductors

Japan . 150 parts In-Stock

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$4.390

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$4.390

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NAC Semi

USA . 103 parts In-Stock

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$15.000

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Vyrian

USA . 24,998 parts In-Stock

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NexGen Digital

USA . 12,890 parts In-Stock

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Chip Stock

USA . 10,502 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,500 parts In-Stock

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Semtec, LLC

USA . 285 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 35 parts In-Stock

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Speed Components Ltd

Israel . 27 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 25,279 parts In-Stock

1+ parts

$2.720

100+ parts

$2.652

1k+ parts

$2.638

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$2.720

$2.652

$2.638

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Ampacity Inc.

Singapore . 24,943 parts In-Stock

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$2.720

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$2.720

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Corphita

USA . 335 parts In-Stock

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$4.132

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Argo Parts USA

USA . 2,153 parts In-Stock

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$4.390

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Continental Prestige Electronics

USA . 1,848 parts In-Stock

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$4.390

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$4.302

1,848

$4.390

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$4.302

Parana Technologies

USA . 1,166 parts In-Stock

1+ parts

$9.493

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$10.098

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$9.493

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$10.098

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DigiPath Technology Company

USA . 1,126 parts In-Stock

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$10.453

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$9.616

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$10.453

$9.616

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

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$10.666

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$10.133

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$9.599

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1,668

$10.666

$10.133

$9.599

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ChromeModa Solutions

Germany . 1,513 parts In-Stock

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$10.666

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$8.746

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$10.666

$8.746

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Corohmni

South Africa . 244 parts In-Stock

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$22.205

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Perfect Parts

USA . 11,359 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,729 parts In-Stock

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Lixinc

USA . 7,593 parts In-Stock

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Kepictronics

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S.R.D Solutions

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Alle Elektronik GmbH

Germany . 1,985 parts In-Stock

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Futuretech Components

Singapore . 1,668 parts In-Stock

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Assy Fe

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 50 parts In-Stock

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Bastille Electronics

Australia . 15 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 4 parts In-Stock

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Overview

Enhance your clock driver & buffer applications with the LMK00105SQE/NOPB by Texas Instruments. With a superior quality and reliability from a trusted manufacturer like Texas Instruments, this chip carrier package offers a seamless integration for your differential mux input conditioning needs. Delivering a low propagation delay of 2.8 ns, this square-shaped device operates at a wide temperature range from -40 to 85°C. Experience the benefits of precise timing, improved signal integrity, and efficient performance with the LMK00105SQE/NOPB, making it an essential component for industrial-grade applications.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 2.8 ns

The low propagation delay ensures efficient performance in time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort.

Input Conditioning: DIFFERENTIAL MUX

The input conditioning capability through a differential multiplexer enhances signal integrity and reliability.

Package Shape: SQUARE

The square package shape offers a compact and space-efficient design for tight PCB layouts.

Nominal Supply Voltage / Vsup: 3.3V

The compatibility with a common supply voltage of 3.3V makes it versatile for various electronic systems.

Load Capacitance (CL): 10 pF

The low load capacitance ensures minimal signal distortion and improves overall signal integrity.

Power Supplies (V): 2.5/3.3

The product accommodates both 2.5V and 3.3V power supplies, providing flexibility in design and compatibility.

No. of Terminals: 24

The ample number of terminals allows for connections to various components, enabling versatility in circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer different levels of thermal management and space-saving considerations for diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable operation even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a durable and corrosion-resistant surface for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and connectivity within circuit layouts.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a compact and space-saving design for crowded PCBs.

Width: 4 mm

The narrow width of 4mm enables the product to fit into tight spaces and compact designs.

Minimum Supply Voltage (Vsup): 2.375 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature reduces the risk of thermal damage during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust assembly processes without compromising product integrity.

Length: 4 mm

The compact length of 4mm contributes to a space-efficient design for compact electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of lead contamination.

Packing Method: TR

The TR packing method ensures secure and organized transportation and storage of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on PCBs, saving valuable space.

Maximum Same Edge Skew (tskwd): 0.025 ns

The minimal same edge skew enhances signal integrity and reduces timing errors in data transmission.

No. of True Outputs: 5

The multiple true outputs provide flexibility in routing signals and can potentially reduce the need for additional components.

Minimum fmax: 200 MHz

The high minimum fmax of 200MHz allows for fast signal processing and compatibility with high-frequency applications.

Maximum Supply Voltage (Vsup): 3.45 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 25 mA

The low maximum power supply current consumption minimizes power usage and reduces heat generation for efficient operation.

Technical Specifications

Clock Drivers & Buffers LMK00105SQE/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

00105

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Load Capacitance (CL):

10 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

2.8 ns

Propagation Delay (tpd):

2.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

200 MHz

Trade Compliance

LMK00105SQE/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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