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LMK04906BISQX/NOPB

Texas Instruments

LMK04906BISQX/NOPB by Texas Instruments

LMK04906BISQX/NOPB clock driver by Texas Instruments features 64 terminals, operates at a temperature range of -40 to 85°C, and has a max supply voltage of 3.45V. It is designed for applications requiring a differential mux input conditioning with a load capacitance of 5pF, making it suitable for industrial use in various electronic devices.

Median Price

$9.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,695 parts In-Stock

1+ parts

$9.480

100+ parts

$8.281

1k+ parts

$5.711

10k+ parts

-

8,695

$9.480

$8.281

$5.711

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$5.711

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-

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64

$5.711

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Digiode

USA . 2,288 parts In-Stock

1+ parts

$9.006

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2,288

$9.006

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Chip Stock

USA . 7,730 parts In-Stock

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7,730

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Vyrian

USA . 2,284 parts In-Stock

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2,284

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,970 parts In-Stock

1+ parts

$5.711

100+ parts

-

1k+ parts

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10k+ parts

$5.597

5,970

$5.711

-

-

$5.597

Andel Nordic

Denmark . 2,003 parts In-Stock

1+ parts

$5.988

100+ parts

-

1k+ parts

$5.749

10k+ parts

$5.749

2,003

$5.988

-

$5.749

$5.749

Vigor

Singapore . 1,782 parts In-Stock

1+ parts

$8.460

100+ parts

-

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1,782

$8.460

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Corphita

USA . 3,056 parts In-Stock

1+ parts

$8.532

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3,056

$8.532

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AZTECH Wire

Italy . 1,159 parts In-Stock

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$13.870

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1,159

$13.870

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$25.451

100+ parts

$23.160

1k+ parts

$20.870

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3,000

$25.451

$23.160

$20.870

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Parana Technologies

USA . 1,553 parts In-Stock

1+ parts

$26.374

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$26.967

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1,553

$26.374

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$26.967

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DigiPath Technology Company

USA . 2,099 parts In-Stock

1+ parts

$29.041

100+ parts

$26.718

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2,099

$29.041

$26.718

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ChromeModa Solutions

Germany . 5,507 parts In-Stock

1+ parts

$29.634

100+ parts

$24.300

1k+ parts

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5,507

$29.634

$24.300

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IDEA Electronic Components Group

UK . 774 parts In-Stock

1+ parts

$29.634

100+ parts

$28.152

1k+ parts

$26.671

10k+ parts

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774

$29.634

$28.152

$26.671

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Component Stockers USA

USA . 1,292 parts In-Stock

1+ parts

$101.360

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1,292

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 1,831 parts In-Stock

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1,831

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$5.597

1k+ parts

$5.425

10k+ parts

$5.311

100

-

$5.597

$5.425

$5.311

Overview

Enhance your electronic designs with the LMK04906BISQX/NOPB clock driver & buffer by Texas Instruments. With a reputation for top-quality products, TI delivers reliability and performance in every component. Ideal for applications requiring precise timing, this chip carrier boasts a very thin profile and operates flawlessly within industrial temperature ranges. Trust TI's innovative solutions to elevate your projects to new heights of efficiency and accuracy. Experience the advantage of superior clock drivers with the LMK04906BISQX/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and facilitating automated assembly processes.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning helps in signal conditioning and noise reduction, leading to improved signal integrity and overall performance.

Package Shape: SQUARE

Square package shape provides for efficient use of board space and easy integration into tight layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage, making it compatible with many existing systems and power sources.

Load Capacitance (CL): 5 pF

Low load capacitance minimizes signal distortion and ensures fast and accurate signal transmission.

No. of Terminals: 64

Ample number of terminals allow for versatile connections and compatibility with various circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in mounting options and thermal management, catering to different application requirements.

Maximum I (ol): 0.5 Amp

High output current capacity enables driving of multiple loads or high-current devices without the need for additional amplification circuitry.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliability in various environmental conditions, especially in industrial settings.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling bus sharing and preventing bus contention issues.

Minimum Operating Temperature: -40 °C

Excellent performance in extreme cold temperatures makes this product suitable for use in a variety of environments and applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring secure and durable connections.

Width: 9 mm

Compact width facilitates easy placement on a PCB and allows for efficient use of space in tight layouts.

Minimum Supply Voltage (Vsup): 3.15 V

Can operate at lower supply voltages, allowing for energy efficiency and compatibility with systems that have lower voltage requirements.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robustness during the assembly process, contributing to reliable and consistent performance.

Length: 9 mm

Compact length makes it suitable for applications where space constraints are present, without compromising on functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures operation in harsh conditions with reliability and stability, making it ideal for industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and offers better solder joint reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, making it suitable for applications with limited space availability.

No. of True Outputs: 6

Multiple true outputs provide flexibility in driving multiple components or signals, enhancing the versatility and functionality of the product.

Minimum fmax: 2600 MHz

High maximum operating frequency enables fast signal transmission and processing, suitable for demanding high-speed applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring careful handling during storage and assembly to maintain product integrity.

Maximum Supply Voltage (Vsup): 3.45 V

Wide supply voltage range accommodates variations in input power sources, ensuring compatibility and reliable operation in diverse systems.

Technical Specifications

Clock Drivers & Buffers LMK04906BISQX/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Minimum fmax:

2600 MHz

Trade Compliance

LMK04906BISQX/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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