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CY2309CSXC-1H

Infineon Technologies

CY2309CSXC-1H by Infineon Technologies

CY2309CSXC-1H clock driver by Infineon operates at 3.3V, with 8 true outputs and a max frequency of 133.33MHz. It has a propagation delay of 8.7ns, suitable for commercial temperature grade applications requiring precise timing control in compact designs.

Median Price

$11.602

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 260 parts In-Stock

1+ parts

$12.630

100+ parts

$9.700

1k+ parts

$9.290

10k+ parts

-

260

$12.630

$9.700

$9.290

-

Mouser Electronics

USA . 29 parts In-Stock

1+ parts

$13.610

100+ parts

$10.630

1k+ parts

$9.030

10k+ parts

-

29

$13.610

$10.630

$9.030

-

Flip Electronics (Authorized)

USA . 9,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,280

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-

-

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Rochester

USA . 6,028 parts In-Stock

1+ parts

-

100+ parts

$8.460

1k+ parts

$7.570

10k+ parts

$7.130

6,028

-

$8.460

$7.570

$7.130

Verical

USA . 2,681 parts In-Stock

1+ parts

-

100+ parts

$10.575

1k+ parts

$9.463

10k+ parts

$8.912

2,681

-

$10.575

$9.463

$8.912

DigiKey

USA . 867 parts In-Stock

1+ parts

-

100+ parts

$6.910

1k+ parts

-

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867

-

$6.910

-

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Chip1Stop

Japan . 260 parts In-Stock

1+ parts

-

100+ parts

$13.200

1k+ parts

$11.900

10k+ parts

-

260

-

$13.200

$11.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$8.375

100+ parts

-

1k+ parts

-

10k+ parts

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300

$8.375

-

-

-

Digiode

USA . 612 parts In-Stock

1+ parts

$8.958

100+ parts

-

1k+ parts

-

10k+ parts

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612

$8.958

-

-

-

Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

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8,000

-

-

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Vyrian

USA . 2,643 parts In-Stock

1+ parts

-

100+ parts

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2,643

-

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-

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Rapid Electronics

USA . 260 parts In-Stock

1+ parts

-

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-

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260

-

-

-

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IBS Electronics

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$11.554

1k+ parts

$11.097

10k+ parts

-

260

-

$11.554

$11.097

-

Ack Elektronik San.Tic.Ltd.Sti

. 143 parts In-Stock

1+ parts

-

100+ parts

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143

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

1+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,677 parts In-Stock

1+ parts

$8.020

100+ parts

-

1k+ parts

-

10k+ parts

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2,677

$8.020

-

-

-

Continental Prestige Electronics

USA . 2,409 parts In-Stock

1+ parts

$8.375

100+ parts

-

1k+ parts

-

10k+ parts

$8.208

2,409

$8.375

-

-

$8.208

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$8.375

100+ parts

$8.208

1k+ parts

$7.956

10k+ parts

$7.789

2,000

$8.375

$8.208

$7.956

$7.789

Corphita

USA . 831 parts In-Stock

1+ parts

$8.487

100+ parts

-

1k+ parts

-

10k+ parts

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831

$8.487

-

-

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Modulus Dynamics

Lithuania . 3,851 parts In-Stock

1+ parts

$18.886

100+ parts

$18.131

1k+ parts

$17.375

10k+ parts

-

3,851

$18.886

$18.131

$17.375

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Microchip USA

USA . 2,902 parts In-Stock

1+ parts

$25.806

100+ parts

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2,902

$25.806

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A-Z Elektronik GmbH

Germany . 6,081 parts In-Stock

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6,081

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Argo Parts USA

USA . 4,513 parts In-Stock

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4,513

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Alle Elektronik GmbH

Germany . 4,054 parts In-Stock

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4,054

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Kepictronics

USA . 200 parts In-Stock

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200

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Perfect Parts

USA . 1 parts In-Stock

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1

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Cyclops Electronics Ltd (Excess)

UK . 1 parts In-Stock

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1

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Overview

Unlock the power of precise clock timing with the CY2309CSXC-1H from Infineon Technologies. This clock driver & buffer offers unmatched quality and reliability, backed by the reputable manufacturer's expertise in semiconductor technology. Ideal for a variety of applications, this product ensures smooth operation and seamless synchronization in your systems. Experience the value of enhanced performance, reliable signal integrity, and simplified design with the CY2309CSXC-1H. Elevate your projects to new heights with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount

YES - Being surface mountable allows for easy and efficient integration into circuit boards, optimizing space usage.

Input Conditioning

STANDARD - Standard input conditioning ensures compatibility with a wide range of input signals, making the product versatile.

Package Shape

RECTANGULAR - The rectangular shape of the package provides a compact design, ideal for space-constrained applications.

Nominal Supply Voltage / Vsup (V)

3.3 - With a nominal supply voltage of 3.3V, the product is compatible with common power supply configurations, ensuring easy integration.

Power Supplies (V)

3.3 - The consistent power supply voltage of 3.3V ensures reliable performance and stability in various operating conditions.

No. of Terminals

16 - The high number of terminals allows for connections to multiple components, enhancing the functionality and versatility of the product.

Package Style (Meter)

SMALL OUTLINE - The small outline package style saves space on the circuit board, making it suitable for compact designs.

Maximum I (ol)

12 Amp - The high output current of 12A enables the product to drive multiple loads efficiently, making it a reliable choice for demanding applications.

Propagation Delay (tpd)

8.7 ns - The low propagation delay of 8.7ns ensures fast data transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature

70 °C - With a maximum operating temperature of 70°C, the product can withstand harsh environmental conditions, ensuring reliable performance.

Output Characteristics

3-STATE - The 3-state output characteristics provide flexibility in controlling the output signal, making the product versatile in various applications.

Minimum Operating Temperature

0 °C - The minimum operating temperature of 0°C ensures the product can function in a wide range of environments, making it suitable for various applications.

Terminal Finish

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish provides corrosion resistance and ensures reliable electrical connections, enhancing the product's longevity.

Terminal Position

DUAL - The dual terminal position allows for easy connection and secure attachment to the circuit board, ensuring reliable performance.

Technical Specifications

Clock Drivers & Buffers CY2309CSXC-1H attributes and parameters. Explore more Clock Drivers & Buffers devices from Infineon Technologies

Specs

Family:

2309

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.893 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.727 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.8985 mm

Minimum fmax:

133.33 MHz

Trade Compliance

CY2309CSXC-1H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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