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LMK04906BISQE/NOPB

Texas Instruments

LMK04906BISQE/NOPB by Texas Instruments

LMK04906BISQE/NOPB clock driver by Texas Instruments operates at 3.3V with 64 terminals in a square package. It features differential mux input conditioning, 6 true outputs up to 2600 MHz, and a max operating temperature of 85°C. Ideal for industrial applications requiring precise clock synchronization and signal buffering.

Median Price

$12.583

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 415 parts In-Stock

1+ parts

$11.110

100+ parts

$7.630

1k+ parts

-

10k+ parts

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415

$11.110

$7.630

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Texas Instruments

USA . 18,277 parts In-Stock

1+ parts

$11.376

100+ parts

$9.937

1k+ parts

$6.853

10k+ parts

-

18,277

$11.376

$9.937

$6.853

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Newark

USA . 415 parts In-Stock

1+ parts

$13.790

100+ parts

$10.700

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-

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415

$13.790

$10.700

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DigiKey

USA . 441 parts In-Stock

1+ parts

$16.960

100+ parts

$11.631

1k+ parts

$10.760

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-

441

$16.960

$11.631

$10.760

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Mouser Electronics

USA . 274 parts In-Stock

1+ parts

$16.960

100+ parts

$11.640

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$10.750

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274

$16.960

$11.640

$10.750

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$9.840

1k+ parts

$8.810

10k+ parts

$8.290

2

-

$9.840

$8.810

$8.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,916 parts In-Stock

1+ parts

$9.044

100+ parts

-

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4,916

$9.044

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.533

100+ parts

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50

$10.533

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Vyrian

USA . 4,746 parts In-Stock

1+ parts

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4,746

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Chip Stock

USA . 325 parts In-Stock

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325

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Semi Source

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 973 parts In-Stock

1+ parts

$4.499

100+ parts

-

1k+ parts

$4.319

10k+ parts

$4.319

973

$4.499

-

$4.319

$4.319

Ampacity Inc.

Singapore . 4,793 parts In-Stock

1+ parts

$8.090

100+ parts

-

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4,793

$8.090

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Corphita

USA . 1,477 parts In-Stock

1+ parts

$8.568

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1,477

$8.568

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$10.322

100+ parts

-

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$9.910

10k+ parts

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50

$10.322

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$9.910

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Continental Prestige Electronics

USA . 172 parts In-Stock

1+ parts

$10.533

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-

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$10.322

172

$10.533

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-

$10.322

Parana Technologies

USA . 1,069 parts In-Stock

1+ parts

$14.946

100+ parts

-

1k+ parts

$15.371

10k+ parts

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1,069

$14.946

-

$15.371

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ChromeModa Solutions

Germany . 3,384 parts In-Stock

1+ parts

$16.793

100+ parts

$13.770

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3,384

$16.793

$13.770

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

1+ parts

$16.793

100+ parts

$15.953

1k+ parts

$15.114

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1,657

$16.793

$15.953

$15.114

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Lixinc

USA . 10,654 parts In-Stock

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10,654

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iodParts Technologies Inc.

India . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 3,154 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,967 parts In-Stock

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$15.141

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1,967

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$15.141

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Perfect Parts

USA . 1,109 parts In-Stock

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Overview

Upgrade your clock driving and buffering needs with the LMK04906BISQE/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality clock drivers and buffers that are perfect for various applications. With its surface mount capability, differential mux input conditioning, and industrial temperature grade, this product offers unmatched value and benefits to customers. Trust in Texas Instruments to provide reliable solutions for all your clock driver and buffer requirements. Elevate your projects with the LMK04906BISQE/NOPB today!

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

The differential multiplexer input conditioning ensures accurate signal processing and noise reduction, resulting in reliable performance.

Package Shape: SQUARE

The square package shape offers a compact design, making it suitable for space-constrained applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage provides compatibility with a wide range of systems and ensures stable operation.

Load Capacitance (CL): 5 pF

With a low load capacitance, this product can drive capacitive loads without sacrificing signal integrity.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient power consumption and compatibility with standard voltage levels.

No. of Terminals: 64

The high number of terminals allows for versatile connections and compatibility with various circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides excellent thermal dissipation and mechanical stability, ideal for high-performance applications.

Maximum I (ol): 0.5 Amp

The high output current capability of 0.5A ensures reliable signal transmission and operation under heavy loads.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for flexible signal control, enabling tristate outputs for bus sharing applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides excellent solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers easy soldering and robust mechanical connections for enhanced durability.

Maximum Seated Height: 0.8 mm

The low maximum seated height ensures compatibility with slim designs and compact spaces.

Width: 9 mm

The 9mm width allows for easy integration in standard PCB layouts and rack-mounted systems.

Minimum Supply Voltage (Vsup): 3.15 V

The 3.15V minimum supply voltage ensures compatibility with low-power systems while maintaining stable operation.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering during assembly without damaging the component.

Length: 9 mm

The 9mm length provides a compact form factor suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature environments.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and offers environmentally friendly soldering options.

Packing Method: TR

The TR packing method ensures safe storage and transportation, protecting the product from damage.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting, saving space on the PCB and enabling complex circuit designs.

No. of True Outputs: 6

With 6 true outputs, this product offers versatile signal processing capabilities for complex applications.

Minimum fmax: 2600 MHz

The high minimum fmax of 2600 MHz ensures fast signal processing and compatibility with high-speed applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product can withstand moderate levels of moisture exposure without damage.

Maximum Supply Voltage (Vsup): 3.45 V

The 3.45V maximum supply voltage ensures compatibility with a wide range of power sources while maintaining safe operation limits.

Technical Specifications

Clock Drivers & Buffers LMK04906BISQE/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Minimum fmax:

2600 MHz

Trade Compliance

LMK04906BISQE/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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