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CDCLVD2108RGZR

Texas Instruments

CDCLVD2108RGZR by Texas Instruments

CDCLVD2108RGZR by Texas Instruments is a clock driver with 2.5 ns propagation delay, suitable for industrial applications. It features differential input conditioning, operates at 2.5V, and offers 8 true outputs with a min frequency of 800 MHz. The chip carrier package style has a square shape and measures 7mm in width and length, making it ideal for surface mount applications.

Median Price

$9.203

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 52,575 parts In-Stock

1+ parts

$9.203

100+ parts

$8.039

1k+ parts

$5.544

10k+ parts

-

52,575

$9.203

$8.039

$5.544

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.544

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$5.544

-

-

-

Digiode

USA . 79 parts In-Stock

1+ parts

$8.743

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$8.743

-

-

-

Martec Srl

Italy . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

-

Vyrian

USA . 8,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,022

-

-

-

-

Component Sense

UK . 3,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,223

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,601 parts In-Stock

1+ parts

$3.638

100+ parts

-

1k+ parts

$3.493

10k+ parts

$3.493

3,601

$3.638

-

$3.493

$3.493

Continental Prestige Electronics

USA . 6,886 parts In-Stock

1+ parts

$5.544

100+ parts

-

1k+ parts

-

10k+ parts

$5.433

6,886

$5.544

-

-

$5.433

Ampacity Inc.

Singapore . 52,427 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

-

10k+ parts

-

52,427

$7.820

-

-

-

Corphita

USA . 544 parts In-Stock

1+ parts

$8.283

100+ parts

-

1k+ parts

-

10k+ parts

-

544

$8.283

-

-

-

Parana Technologies

USA . 1,933 parts In-Stock

1+ parts

$10.118

100+ parts

-

1k+ parts

$10.664

10k+ parts

-

1,933

$10.118

-

$10.664

-

DigiPath Technology Company

USA . 1,959 parts In-Stock

1+ parts

$11.141

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

$11.141

-

-

-

ChromeModa Solutions

Germany . 5,468 parts In-Stock

1+ parts

$11.368

100+ parts

$9.322

1k+ parts

-

10k+ parts

-

5,468

$11.368

$9.322

-

-

IDEA Electronic Components Group

UK . 1,451 parts In-Stock

1+ parts

$11.368

100+ parts

$10.800

1k+ parts

$10.231

10k+ parts

-

1,451

$11.368

$10.800

$10.231

-

AZTECH Wire

Italy . 676 parts In-Stock

1+ parts

$11.680

100+ parts

-

1k+ parts

-

10k+ parts

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676

$11.680

-

-

-

Lixinc

USA . 2,557 parts In-Stock

1+ parts

-

100+ parts

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2,557

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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-

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Argo Parts USA

USA . 1,841 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,841

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$5.433

1k+ parts

$5.267

10k+ parts

$5.156

100

-

$5.433

$5.267

$5.156

Overview

Enhance the performance of your electronic designs with the CDCLVD2108RGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality clock drivers & buffers that guarantee precision and reliability. This chip carrier package offers differential input conditioning with 2.5ns propagation delay at nominal supply, making it ideal for a wide range of applications. With 8 true outputs and a maximum frequency of 800MHz, this industrial-grade product ensures optimal efficiency and functionality. Trust Texas Instruments to provide unmatched value and innovation for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 2.5 ns

Fast propagation delay ensures efficient operation and minimal delay in signal transmission.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps to minimize noise and interference, leading to more accurate signal processing.

No. of Functions: 2

Provides versatility and flexibility in clock driver and buffering capabilities, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard voltage level, ensuring compatibility with most systems and devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a factor.

Minimum Operating Temperature: -40 °C

Can operate in cold environments, providing reliability in varying temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Width: 7 mm

Compact size allows for easy integration into tight spaces or crowded circuit boards.

Technical Specifications

Clock Drivers & Buffers CDCLVD2108RGZR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

2.5 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.08 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCLVD2108RGZR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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