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CDCLVC1102PW

Texas Instruments

CDCLVC1102PW by Texas Instruments

CDCLVC1102PW by Texas Instruments is a Clock Driver & Buffer with 2 ns Propagation Delay, suitable for industrial applications. It operates at a Nominal Voltage of 2.5V and has a Max fmax of 250 MHz. This small outline package features Surface Mount technology and is designed for high-speed signal conditioning.

Median Price

$2.190

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 6 parts In-Stock

1+ parts

$0.594

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-

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6

$0.594

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Chip1Stop

Japan . 106 parts In-Stock

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$1.860

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$1.610

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$1.600

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106

$1.860

$1.610

$1.600

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Adafruit Industries

USA . 46 parts In-Stock

1+ parts

$2.275

100+ parts

$2.275

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$2.275

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46

$2.275

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$2.275

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Texas Instruments

USA . 121,754 parts In-Stock

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$2.567

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$2.250

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$1.271

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121,754

$2.567

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$1.271

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Mouser Electronics

USA . 2,017 parts In-Stock

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$3.450

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$2.100

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2,017

$3.450

$2.100

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DigiKey

USA . 653 parts In-Stock

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$3.450

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$2.383

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$1.952

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$1.817

653

$3.450

$2.383

$1.952

$1.817

RS (Exports)

UK . 745 parts In-Stock

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$2.104

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745

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$2.104

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Rochester

USA . 47 parts In-Stock

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$1.700

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$1.520

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$1.430

47

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$1.430

Verical

USA . 6 parts In-Stock

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6

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Distributors (In-Stock)

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Digiode

USA . 3,437 parts In-Stock

1+ parts

$1.682

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3,437

$1.682

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Nova Conductors

Japan . 50 parts In-Stock

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$2.230

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50

$2.230

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Chip Stock

USA . 13,810 parts In-Stock

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13,810

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Vyrian

USA . 13,768 parts In-Stock

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Sensible Micro Corp

USA . 6,431 parts In-Stock

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6,431

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Bristol Electronics

USA . 488 parts In-Stock

1+ parts

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100+ parts

$1.232

1k+ parts

$1.010

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488

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$1.232

$1.010

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Microfarads

USA . 471 parts In-Stock

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471

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Prism Electronics

USA . 48 parts In-Stock

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48

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NexGen Digital

USA . 1 parts In-Stock

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1

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Cyclops Electronics Ltd

UK . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 13,586 parts In-Stock

1+ parts

$1.470

100+ parts

-

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13,586

$1.470

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Semicontronic

India . 13,361 parts In-Stock

1+ parts

$1.470

100+ parts

$1.433

1k+ parts

$1.426

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13,361

$1.470

$1.433

$1.426

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Corphita

USA . 4,037 parts In-Stock

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$1.593

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$1.593

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Argo Parts USA

USA . 4,856 parts In-Stock

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$1.943

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$1.943

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Continental Prestige Electronics

USA . 1,480 parts In-Stock

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$1.943

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$1.904

1,480

$1.943

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$1.904

Advanced Electronics

New Zealand . 46 parts In-Stock

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$2.275

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$2.275

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$2.275

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46

$2.275

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Andel Nordic

Denmark . 4,622 parts In-Stock

1+ parts

$2.878

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$2.763

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$2.763

4,622

$2.878

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$2.763

$2.763

Corohmni

South Africa . 758 parts In-Stock

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$22.932

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Parana Technologies

USA . 1,674 parts In-Stock

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$25.780

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$26.383

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$25.780

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IDEA Electronic Components Group

UK . 1,487 parts In-Stock

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$28.966

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$27.518

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$26.069

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1,487

$28.966

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$26.069

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ChromeModa Solutions

Germany . 686 parts In-Stock

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$28.966

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$23.752

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Perfect Parts

USA . 15,431 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,741 parts In-Stock

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Lixinc

USA . 5,913 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,494 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,389 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 413 parts In-Stock

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$26.116

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413

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Kepictronics

USA . 368 parts In-Stock

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368

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Overview

Experience the superior performance and reliability of Texas Instruments with the CDCLVC1102PW Clock Drivers & Buffers. This innovative product offers a fast propagation delay of 2 ns, ensuring accurate timing in a wide range of applications. With a compact small outline package and industrial-grade temperature range, this clock driver is designed to meet your needs. Trust Texas Instruments for high-quality solutions that deliver exceptional value and precision for your projects. Elevate your designs with the CDCLVC1102PW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing the overall weight of the product while maintaining durability.

Propagation Delay At Nominal Supply: 2 ns

Provides quick response times for clock signal distribution.

Surface Mount: YES

Allows for easy installation and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently within a low voltage range.

Maximum I (ol): 12 Amp

Can handle high output currents, making it suitable for various applications.

Technology: CMOS

Utilizes low power consumption and high noise immunity.

Technical Specifications

Clock Drivers & Buffers CDCLVC1102PW attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2 ns

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

250 MHz

Trade Compliance

CDCLVC1102PW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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