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CDCM61002RHBR

Texas Instruments

CDCM61002RHBR by Texas Instruments

The Texas Instruments CDCM61002RHBR clock driver features 32 terminals, 3.3V nominal voltage, and 5pF load capacitance. It is used in industrial applications with a temperature range of -40 to 85°C, offering MUX input conditioning for precise timing requirements. The package style is chip carrier with a very thin profile, suitable for surface mount assembly.

Median Price

$6.700

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 32,567 parts In-Stock

1+ parts

$4.534

100+ parts

$3.696

1k+ parts

$2.464

10k+ parts

-

32,567

$4.534

$3.696

$2.464

-

Mouser Electronics

USA . 506 parts In-Stock

1+ parts

$6.700

100+ parts

$4.350

1k+ parts

$3.930

10k+ parts

$3.790

506

$6.700

$4.350

$3.930

$3.790

DigiKey

USA . 7,668 parts In-Stock

1+ parts

$6.970

100+ parts

$4.522

1k+ parts

$4.336

10k+ parts

$3.952

7,668

$6.970

$4.522

$4.336

$3.952

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 21 parts In-Stock

1+ parts

$3.246

100+ parts

-

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-

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21

$3.246

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.696

100+ parts

-

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-

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100

$3.696

-

-

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Digiode

USA . 179 parts In-Stock

1+ parts

$4.307

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-

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179

$4.307

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Chip Stock

USA . 25,300 parts In-Stock

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25,300

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Cyclops Electronics Ltd

UK . 13,176 parts In-Stock

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13,176

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Vyrian

USA . 12,538 parts In-Stock

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12,538

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ComSIT Distribution GmbH

Germany . 680 parts In-Stock

1+ parts

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680

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Bristol Electronics

USA . 60 parts In-Stock

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60

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Flex Direct, LLC

USA . 60 parts In-Stock

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60

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Contempo Components LLC

USA . 30 parts In-Stock

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30

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Semtec, LLC

USA . 5 parts In-Stock

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5

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$3.696

100+ parts

$3.511

1k+ parts

$3.336

10k+ parts

$3.289

10

$3.696

$3.511

$3.336

$3.289

Argo Parts USA

USA . 3,613 parts In-Stock

1+ parts

$3.696

100+ parts

-

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3,613

$3.696

-

-

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Continental Prestige Electronics

USA . 2,588 parts In-Stock

1+ parts

$3.696

100+ parts

-

1k+ parts

-

10k+ parts

$3.622

2,588

$3.696

-

-

$3.622

Ampacity Inc.

Singapore . 12,509 parts In-Stock

1+ parts

$3.850

100+ parts

-

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12,509

$3.850

-

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Semicontronic

India . 12,375 parts In-Stock

1+ parts

$3.850

100+ parts

$3.754

1k+ parts

$3.734

10k+ parts

-

12,375

$3.850

$3.754

$3.734

-

Corphita

USA . 3,630 parts In-Stock

1+ parts

$4.081

100+ parts

-

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3,630

$4.081

-

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Andel Nordic

Denmark . 793 parts In-Stock

1+ parts

$5.823

100+ parts

-

1k+ parts

$5.590

10k+ parts

$5.590

793

$5.823

-

$5.590

$5.590

Corohmni

South Africa . 1,095 parts In-Stock

1+ parts

$14.602

100+ parts

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1,095

$14.602

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Parana Technologies

USA . 176 parts In-Stock

1+ parts

$18.039

100+ parts

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$18.189

10k+ parts

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176

$18.039

-

$18.189

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ChromeModa Solutions

Germany . 2,437 parts In-Stock

1+ parts

$20.269

100+ parts

$16.621

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2,437

$20.269

$16.621

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$20.269

100+ parts

$19.256

1k+ parts

$18.242

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1,283

$20.269

$19.256

$18.242

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$33.379

100+ parts

$31.710

1k+ parts

$31.710

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2,000

$33.379

$31.710

$31.710

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Perfect Parts

USA . 70,398 parts In-Stock

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70,398

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Lixinc

USA . 8,263 parts In-Stock

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8,263

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A-Z Elektronik GmbH

Germany . 6,793 parts In-Stock

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6,793

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Assy Fe

Spain . 2,950 parts In-Stock

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DigiPath Technology Company

USA . 2,257 parts In-Stock

1+ parts

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$18.275

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2,257

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$18.275

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Alle Elektronik GmbH

Germany . 1,045 parts In-Stock

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1,045

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GreenTree Electronics

Israel . 971 parts In-Stock

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971

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S.R.D Solutions

India . 100 parts In-Stock

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100

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Overview

Experience unparalleled precision and reliability with the Texas Instruments CDCM61002RHBR Clock Drivers & Buffers. Crafted with the highest quality materials and cutting-edge technology, this product offers seamless integration and optimal performance in a wide range of applications. From telecommunications to data centers, trust Texas Instruments to deliver unmatched value and efficiency. Upgrade your systems today with the CDCM61002RHBR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB.

Input Conditioning: MUX

The input conditioning MUX feature enhances signal integrity and reduces noise, ensuring accurate clock synchronization.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is a common standard, making this product compatible with many systems.

Load Capacitance (CL): 5 pF

The low load capacitance of 5 pF ensures fast and efficient signal transmission.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

The product can operate efficiently in low temperature conditions down to -40°C, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish of nickel, palladium, gold, and silver ensures excellent conductivity and corrosion resistance.

Width: 5 mm

The compact width of 5 mm allows for efficient use of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for use in rugged industrial environments.

No. of True Outputs: 2

Having 2 true outputs provides flexibility in clock signal distribution and synchronization.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the product is less prone to moisture damage during storage and handling.

Technical Specifications

Clock Drivers & Buffers CDCM61002RHBR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

61002

Input Conditioning:

MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

683.28 MHz

Trade Compliance

CDCM61002RHBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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