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CDCM1804RGETG4

Texas Instruments

CDCM1804RGETG4 by Texas Instruments

CDCM1804RGETG4 clock driver by Texas Instruments features a propagation delay of 0.6ns, operates at a supply voltage of 3.3V, and offers differential input conditioning. Ideal for industrial applications requiring precise timing synchronization in compact spaces due to its small chip carrier package style with a width and length of 4mm each.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,382 parts In-Stock

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4,382

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Chip Stock

USA . 3,334 parts In-Stock

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3,334

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Vyrian

USA . 2,286 parts In-Stock

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2,286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 217 parts In-Stock

1+ parts

$0.435

100+ parts

-

1k+ parts

-

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$0.418

217

$0.435

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$0.418

Northwest PG Solutions

USA . 680 parts In-Stock

1+ parts

$0.479

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-

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$0.422

680

$0.479

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-

$0.422

Andel Nordic

Denmark . 4,158 parts In-Stock

1+ parts

$2.781

100+ parts

-

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$2.670

10k+ parts

$2.670

4,158

$2.781

-

$2.670

$2.670

AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$15.346

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888

$15.346

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Parana Technologies

USA . 2,245 parts In-Stock

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$24.172

100+ parts

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$24.830

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2,245

$24.172

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$24.830

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DigiPath Technology Company

USA . 1,958 parts In-Stock

1+ parts

$26.616

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1,958

$26.616

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IDEA Electronic Components Group

UK . 2,351 parts In-Stock

1+ parts

$27.159

100+ parts

$25.801

1k+ parts

$24.443

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2,351

$27.159

$25.801

$24.443

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ChromeModa Solutions

Germany . 1,640 parts In-Stock

1+ parts

$27.159

100+ parts

$22.270

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1,640

$27.159

$22.270

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One Stop Electronics

USA . 334 parts In-Stock

1+ parts

$51.000

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334

$51.000

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A-Z Elektronik GmbH

Germany . 5,028 parts In-Stock

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5,028

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Alle Elektronik GmbH

Germany . 3,352 parts In-Stock

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Microchip USA

USA . 1,670 parts In-Stock

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1,670

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Corphita

USA . 68 parts In-Stock

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68

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Overview

Elevate your electronic designs with the CDCM1804RGETG4 by Texas Instruments, a top-tier Clock Drivers & Buffers solution that delivers precision and reliability. Crafted by renowned manufacturer Texas Instruments, this clock driver offers unparalleled quality and performance for a wide range of applications. Its innovative design ensures fast propagation delays and efficient power management, making it an ideal choice for industrial-grade projects. Trust in the CDCM1804RGETG4 to optimize your system's timing needs while providing value and peace of mind to customers seeking excellence in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.6 ns

The low propagation delay ensures fast and efficient operation of the clock driver, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature makes installation and integration of the clock driver easier, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, leading to reliable and accurate clock signals.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, making this clock driver compatible with a wide range of applications.

Power Supplies (V): 3.3

Having a consistent power supply voltage of 3.3V ensures stable performance of the clock driver under varying load conditions.

No. of Terminals: 24

The 24 terminals provide sufficient connectivity options for interfacing with other components in the system, enhancing flexibility in circuit design.

Maximum I (ol): 12 Amp

The high output current capacity of 12A allows the clock driver to drive multiple loads simultaneously without overheating or performance degradation.

Propagation Delay (tpd): 2.6 ns

The low propagation delay ensures minimal delay in signal transmission, enabling precise synchronization of clock signals in the system.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this clock driver can withstand high temperature environments, increasing its reliability in industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows the clock driver to effectively control the signal flow, providing flexibility in signal routing and management.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions, making this clock driver suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides corrosion resistance and better conductivity, ensuring long-term reliability of the connections.

Maximum Supply Voltage (Vsup): 3.6 V

Having a maximum supply voltage of 3.6V allows for some margin of safety, protecting the clock driver from potential overvoltage situations.

Technical Specifications

Clock Drivers & Buffers CDCM1804RGETG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

3 LVPECL DIFFERENTIAL CLOCK OUTPUTS AND SINGLE ENDED LVCMOS OUTPUT

Family:

1803

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCM1804RGETG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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