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CDCM1804RTHT

Texas Instruments

CDCM1804RTHT by Texas Instruments

CDCM1804RTHT clock driver by Texas Instruments features a 2.6 ns propagation delay, operates at 3.3V, and offers 24 terminals in a square package shape. Ideal for industrial applications requiring differential input conditioning and 800 MHz min fmax with a temperature range of -40 to 85 °C.

Median Price

$9.380

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 585 parts In-Stock

1+ parts

-

100+ parts

$8.120

1k+ parts

$7.270

10k+ parts

$6.840

585

-

$8.120

$7.270

$6.840

DigiKey

USA . 585 parts In-Stock

1+ parts

-

100+ parts

$9.380

1k+ parts

-

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585

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$9.380

-

-

Verical

USA . 475 parts In-Stock

1+ parts

-

100+ parts

$10.150

1k+ parts

$9.088

10k+ parts

$8.550

475

-

$10.150

$9.088

$8.550

Distributors (In-Stock)

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Digiode

USA . 1,948 parts In-Stock

1+ parts

$8.569

100+ parts

-

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1,948

$8.569

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Vyrian

USA . 3,940 parts In-Stock

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Bristol Electronics

USA . 220 parts In-Stock

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Atlantic Semiconductor

USA . 220 parts In-Stock

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220

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Prism Electronics

USA . 41 parts In-Stock

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Sea View Technologies

USA . 5 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 5,236 parts In-Stock

1+ parts

$3.285

100+ parts

-

1k+ parts

$3.154

10k+ parts

$3.154

5,236

$3.285

-

$3.154

$3.154

Corphita

USA . 2,926 parts In-Stock

1+ parts

$8.118

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-

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2,926

$8.118

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Parana Technologies

USA . 835 parts In-Stock

1+ parts

$28.149

100+ parts

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$44.231

10k+ parts

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835

$28.149

-

$44.231

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ChromeModa Solutions

Germany . 5,762 parts In-Stock

1+ parts

$31.628

100+ parts

$25.935

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5,762

$31.628

$25.935

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IDEA Electronic Components Group

UK . 165 parts In-Stock

1+ parts

$31.628

100+ parts

$30.047

1k+ parts

$28.465

10k+ parts

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165

$31.628

$30.047

$28.465

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Native Components

USA . 897 parts In-Stock

1+ parts

$1,400.300

100+ parts

$1,372.294

1k+ parts

$1,358.291

10k+ parts

$1,344.288

897

$1,400.300

$1,372.294

$1,358.291

$1,344.288

Northwest PG Solutions

USA . 337 parts In-Stock

1+ parts

$1,540.330

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337

$1,540.330

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A-Z Elektronik GmbH

Germany . 6,726 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,484 parts In-Stock

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Microchip USA

USA . 245 parts In-Stock

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DigiPath Technology Company

USA . 172 parts In-Stock

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$28.516

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Kepictronics

USA . 99 parts In-Stock

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Perfect Parts

USA . 46 parts In-Stock

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Overview

Enhance your electronic designs with the CDCM1804RTHT clock driver and buffer by Texas Instruments, a trusted manufacturer known for top-quality components. This versatile product falls under the clock drivers and buffers category, offering precise timing solutions for a wide range of applications. With minimal propagation delay and differential input conditioning, this chip carrier with a heat sink/slug is ideal for industrial use. Experience the benefits of improved signal integrity, reduced skew, and reliable performance with the CDCM1804RTHT, providing exceptional value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body ensures the longevity and reliability of the product.

Propagation Delay At Nominal Supply: 2.6 ns

Low propagation delay ensures quick response time, making this product suitable for applications requiring fast signal processing.

Surface Mount: YES

Surface mount capability enables easy installation and space-saving design in compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it versatile for a variety of applications.

Maximum I (ol): 12 Amp

High output current capability allows driving multiple loads with ease, making it suitable for demanding applications.

Output Characteristics: 3-STATE

3-STATE output feature provides flexibility in controlling the output signal, enhancing the product's versatility.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum fmax: 800 MHz

High maximum frequency ensures compatibility with high-speed applications, making it a suitable choice for demanding tasks.

Technical Specifications

Clock Drivers & Buffers CDCM1804RTHT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

3 LVPECL DIFFERENTIAL CLOCK OUTPUTS AND SINGLE ENDED LVCMOS OUTPUT

Family:

1803

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2.6 ns

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

.9 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCM1804RTHT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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