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CDCLVD1216RGZT

Texas Instruments

CDCLVD1216RGZT by Texas Instruments

CDCLVD1216RGZT by Texas Instruments is a clock driver with 2.5ns propagation delay, suitable for industrial applications. It features differential mux input conditioning, 32 true outputs, and operates at a max frequency of 800MHz. This chip carrier package has a very thin profile and can withstand temperatures from -40 to 85°C.

Median Price

$16.870

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 705 parts In-Stock

1+ parts

$10.491

100+ parts

$9.164

1k+ parts

$6.320

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705

$10.491

$9.164

$6.320

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DigiKey

USA . 702 parts In-Stock

1+ parts

$16.870

100+ parts

$11.567

1k+ parts

$10.699

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702

$16.870

$11.567

$10.699

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Mouser Electronics

USA . 78 parts In-Stock

1+ parts

$16.870

100+ parts

$11.570

1k+ parts

$10.690

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78

$16.870

$11.570

$10.690

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Distributors (In-Stock)

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Nova Conductors

Japan . 95 parts In-Stock

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$9.439

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95

$9.439

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Digiode

USA . 2,688 parts In-Stock

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$9.966

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2,688

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Chip Stock

USA . 6,800 parts In-Stock

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Vyrian

USA . 692 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 133 parts In-Stock

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A2Z Electronics, Inc.

USA . 46 parts In-Stock

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Cyclops Electronics Ltd

UK . 37 parts In-Stock

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Velocity Electronics

USA . 32 parts In-Stock

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Bristol Electronics

USA . 9 parts In-Stock

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Sensible Micro Corp

USA . 2 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,384 parts In-Stock

1+ parts

$1.789

100+ parts

-

1k+ parts

$1.718

10k+ parts

$1.718

2,384

$1.789

-

$1.718

$1.718

Ampacity Inc.

Singapore . 669 parts In-Stock

1+ parts

$7.660

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669

$7.660

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Continental Prestige Electronics

USA . 4,018 parts In-Stock

1+ parts

$9.439

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$9.250

4,018

$9.439

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$9.250

Netroflash

USA . 50 parts In-Stock

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$9.439

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$9.439

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Corphita

USA . 1,959 parts In-Stock

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$9.442

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$9.442

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Parana Technologies

USA . 2,151 parts In-Stock

1+ parts

$15.485

100+ parts

$1,438.027

1k+ parts

$13.937

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2,151

$15.485

$1,438.027

$13.937

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DigiPath Technology Company

USA . 1,019 parts In-Stock

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$17.051

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$17.051

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ChromeModa Solutions

Germany . 6,238 parts In-Stock

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$17.399

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$14.267

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6,238

$17.399

$14.267

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IDEA Electronic Components Group

UK . 99 parts In-Stock

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$17.399

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$16.529

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$15.659

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99

$17.399

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$15.659

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iodParts Technologies Inc.

India . 15,250 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,455 parts In-Stock

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Lixinc

USA . 5,555 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,970 parts In-Stock

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Argo Parts USA

USA . 3,597 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 112 parts In-Stock

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112

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Enhance your electronic designs with the CDCLVD1216RGZT clock driver and buffer from Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers reliable products that meet industry standards. Clock drivers are essential components in various applications such as telecommunications, networking, and industrial equipment. The CDCLVD1216RGZT offers customers precise timing control, low propagation delay, and versatile input conditioning. Upgrade your projects with this innovative solution and experience superior performance and efficiency. Trust Texas Instruments for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 2.5 ns

Low propagation delay ensures fast and efficient signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Ease of installation and integration into PCB designs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, ensuring compatibility with other components in the system.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making it suitable for harsh environments.

Minimum fmax: 800 MHz

Supports high-frequency operations, making it ideal for applications that require fast clock signals.

Technical Specifications

Clock Drivers & Buffers CDCLVD1216RGZT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

2.5 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.055 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCLVD1216RGZT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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