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CDCM61004RHBR

Texas Instruments

CDCM61004RHBR by Texas Instruments

CDCM61004RHBR clock driver by Texas Instruments operates at 3.3V, with 32 terminals and load capacitance of 5pF. It features input conditioning MUX for industrial applications, with a max operating temperature of 85°C and package style in CHIP CARRIER form.

Median Price

$9.790

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,272 parts In-Stock

1+ parts

$6.609

100+ parts

$5.388

1k+ parts

$3.592

10k+ parts

-

10,272

$6.609

$5.388

$3.592

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Mouser Electronics

USA . 2,052 parts In-Stock

1+ parts

$9.790

100+ parts

$6.510

1k+ parts

$6.030

10k+ parts

$5.730

2,052

$9.790

$6.510

$6.030

$5.730

DigiKey

USA . 2,725 parts In-Stock

1+ parts

$10.190

100+ parts

$6.763

1k+ parts

$6.594

10k+ parts

$5.966

2,725

$10.190

$6.763

$6.594

$5.966

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$4.490

100+ parts

-

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41

$4.490

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Digiode

USA . 4,109 parts In-Stock

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$6.279

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4,109

$6.279

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Chip Stock

USA . 5,560 parts In-Stock

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Vyrian

USA . 4,905 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

$4.224

10k+ parts

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2,000

$4.400

-

$4.224

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Continental Prestige Electronics

USA . 5,503 parts In-Stock

1+ parts

$4.490

100+ parts

-

1k+ parts

-

10k+ parts

$4.400

5,503

$4.490

-

-

$4.400

Argo Parts USA

USA . 2,704 parts In-Stock

1+ parts

$4.490

100+ parts

-

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2,704

$4.490

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-

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Andel Nordic

Denmark . 3,949 parts In-Stock

1+ parts

$5.476

100+ parts

-

1k+ parts

$5.257

10k+ parts

$5.257

3,949

$5.476

-

$5.257

$5.257

Ampacity Inc.

Singapore . 5,193 parts In-Stock

1+ parts

$5.620

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-

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5,193

$5.620

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Semicontronic

India . 4,824 parts In-Stock

1+ parts

$5.620

100+ parts

$5.480

1k+ parts

$5.451

10k+ parts

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4,824

$5.620

$5.480

$5.451

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Corphita

USA . 3,870 parts In-Stock

1+ parts

$5.948

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3,870

$5.948

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$25.742

100+ parts

$25.485

1k+ parts

$24.455

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800

$25.742

$25.485

$24.455

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Parana Technologies

USA . 853 parts In-Stock

1+ parts

$26.105

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$26.690

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853

$26.105

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$26.690

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Corohmni

South Africa . 41 parts In-Stock

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$27.898

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41

$27.898

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DigiPath Technology Company

USA . 144 parts In-Stock

1+ parts

$28.745

100+ parts

$26.446

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144

$28.745

$26.446

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IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$29.332

100+ parts

$27.865

1k+ parts

$26.399

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499

$29.332

$27.865

$26.399

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ChromeModa Solutions

Germany . 89 parts In-Stock

1+ parts

$29.332

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$24.052

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89

$29.332

$24.052

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Perfect Parts

USA . 107,744 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Lixinc

USA . 18,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,899 parts In-Stock

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Kepictronics

USA . 12,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,984 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Overview

Enhance your electronic designs with the CDCM61004RHBR by Texas Instruments, a top-quality clock driver & buffer that offers precision and reliability. Manufactured by industry leader Texas Instruments, this chip carrier is ideal for a wide range of applications, from telecommunications to industrial automation. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this clock driver provides excellent performance under various conditions. Trust Texas Instruments to deliver cutting-edge technology that meets your needs for efficiency and accuracy in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring reliable performance and longevity.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and stable supply voltage, making it compatible with a wide variety of systems.

Minimum Operating Temperature: -40 °C

Can function in harsh environments or during temperature fluctuations without performance degradation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a factor.

No. of True Outputs: 4

Provides multiple output signals, allowing for more flexibility in connecting to other components or systems.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture damage, making it suitable for use in humid or damp conditions.

Technical Specifications

Clock Drivers & Buffers CDCM61004RHBR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

61004

Input Conditioning:

MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

683.264 MHz

Trade Compliance

CDCM61004RHBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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