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NBSG14BA

Onsemi

NBSG14BA by Onsemi

NBSG14BA clock driver by Onsemi features a propagation delay of 0.15 ns, operates at a nominal voltage of 2.5V, and offers differential input conditioning. This ECL technology device with 16 terminals is ideal for applications requiring high-speed signal transmission in electronic systems.

Median Price

$35.607

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Freelance Electronics

USA . 1 parts In-Stock

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$35.607

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Vyrian

USA . 3,507 parts In-Stock

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Digiode

USA . 1,772 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,281 parts In-Stock

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$12.799

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AZTECH Wire

Italy . 841 parts In-Stock

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$17.667

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Corohmni

South Africa . 254 parts In-Stock

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$35.607

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Ampacity Inc.

Singapore . 442 parts In-Stock

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$64.000

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TANS Electronics

Latvia . 7,664 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,372 parts In-Stock

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Kulean Microsystems

USA . 4,622 parts In-Stock

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Problanco Electronics

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Aranea Global

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SupplyDigital Components

Austria . 705 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 396 parts In-Stock

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Montclair Electronics, Inc.

USA . 6 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NBSG14BA clock driver by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and advanced technology in all their products. The NBSG14BA is perfect for a wide range of applications in clock drivers & buffers, offering customers seamless operation and precision timing. With its high-speed propagation delay, low profile package style, and differential input conditioning, this product provides unmatched value and efficiency for your electronic projects. Upgrade your systems with the NBSG14BA and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the clock driver and buffer.

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures efficient signal processing and synchronization in the circuit.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in noise reduction and improves signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage ensures consistent performance of the clock driver and buffer.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Versatile power supply options make the product suitable for a variety of applications and configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The low profile grid array package style saves space and allows for efficient PCB layout.

Output Characteristics: SERIES-RESISTOR

Series-resistor output characteristics help in impedance matching and signal stability.

Technology: ECL

The ECL technology offers high speed and low power consumption, making the product ideal for demanding applications.

Minimum fmax: 10700 MHz

High maximum frequency allows for fast signal processing and high-performance clock synchronization.

Technical Specifications

Clock Drivers & Buffers NBSG14BA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

RSNECL MODE: VCC = 0 V WITH VEE = -2.375 V TO -3.465 V

Family:

14

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

SERIES-RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.4 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Minimum fmax:

10700 MHz

Trade Compliance

NBSG14BA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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