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NBSG11MNG

Onsemi

NBSG11MNG by Onsemi

NBSG11MNG by Onsemi is a Clock Driver & Buffer with 0.16 ns Propagation Delay, Differential Input Conditioning, and 2.5V Nominal Voltage. Ideal for high-speed applications in industrial settings due to its ECL technology, 10500 MHz min fmax, and compact square package design.

Median Price

$35.335

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$28.000

100+ parts

$25.400

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-

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2

$28.000

$25.400

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Rochester

USA . 8,038 parts In-Stock

1+ parts

-

100+ parts

$36.660

1k+ parts

$32.800

10k+ parts

$30.870

8,038

-

$36.660

$32.800

$30.870

Verical

USA . 7,768 parts In-Stock

1+ parts

-

100+ parts

$45.825

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$41.000

10k+ parts

$38.587

7,768

-

$45.825

$41.000

$38.587

DigiKey

USA . 6,562 parts In-Stock

1+ parts

-

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$34.010

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$34.010

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Flip Electronics (Authorized)

USA . 6,562 parts In-Stock

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6,562

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Distributors (In-Stock)

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Digiode

USA . 542 parts In-Stock

1+ parts

$25.555

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-

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542

$25.555

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-

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Bristol Electronics

USA . 6 parts In-Stock

1+ parts

$28.800

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6

$28.800

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$36.440

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50

$36.440

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Flip Electronics

USA . 6,441 parts In-Stock

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6,441

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Vyrian

USA . 5,647 parts In-Stock

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5,647

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ComSIT Distribution GmbH

Germany . 52 parts In-Stock

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ComSIT USA

USA . 52 parts In-Stock

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52

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Semi Source

USA . 10 parts In-Stock

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10

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Classic Components Corporation

USA . 7 parts In-Stock

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Microfarads

USA . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,237 parts In-Stock

1+ parts

$24.210

100+ parts

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1,237

$24.210

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Corohmni

South Africa . 221 parts In-Stock

1+ parts

$26.600

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$26.600

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Netroflash

USA . 50 parts In-Stock

1+ parts

$36.440

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50

$36.440

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Ampacity Inc.

Singapore . 5,547 parts In-Stock

1+ parts

$51.800

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5,547

$51.800

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Continental Prestige Electronics

USA . 8,038 parts In-Stock

1+ parts

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$30.530

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8,038

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$30.530

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A-Z Elektronik GmbH

Germany . 6,500 parts In-Stock

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Problanco Electronics

Mexico . 6,280 parts In-Stock

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SupplyDigital Components

Austria . 5,494 parts In-Stock

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Kulean Microsystems

USA . 5,445 parts In-Stock

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Perfect Parts

USA . 2,857 parts In-Stock

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TANS Electronics

Latvia . 1,893 parts In-Stock

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UHIMA Technologies

Türkiye . 543 parts In-Stock

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Microchip USA

USA . 400 parts In-Stock

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Kepictronics

USA . 278 parts In-Stock

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GreenTree Electronics

Israel . 278 parts In-Stock

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Authorized Procurement Solutions

USA . 116 parts In-Stock

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Overview

Upgrade your clock drivers and buffers with the NBSG11MNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. Perfect for applications requiring precise timing, this product offers unmatched value with its fast propagation delay and differential input conditioning. With its compact square package and wide operating temperature range, the NBSG11MNG ensures optimal performance in any industrial setting. Trust Onsemi to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.16 ns

Low propagation delay ensures fast and efficient signal transmission.

Surface Mount: YES

Surface mount packaging is compact and allows for easy integration onto PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps improve noise immunity and signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage of 2.5V ensures reliable performance.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Support for multiple power supply voltages provides flexibility in system design.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easy placement on PCB.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the system.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for soldering without damage.

Technology: ECL

ECL technology provides high-speed performance suitable for clock driver applications.

Technical Specifications

Clock Drivers & Buffers NBSG11MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

10500 MHz

Trade Compliance

NBSG11MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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