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NBSG11BAG

Onsemi

NBSG11BAG by Onsemi

NBSG11BAG clock driver by Onsemi features a propagation delay of 0.16 ns, operating temperature range from -40 to 70 °C, and a max frequency of 10709 MHz. Ideal for applications requiring differential input conditioning, this device comes in a low-profile grid array package with 16 terminals for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,744 parts In-Stock

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Digiode

USA . 1,718 parts In-Stock

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Problanco Electronics

Mexico . 5,797 parts In-Stock

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TANS Electronics

Latvia . 4,085 parts In-Stock

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Kulean Microsystems

USA . 2,070 parts In-Stock

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SupplyDigital Components

Austria . 1,843 parts In-Stock

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Corphita

USA . 1,067 parts In-Stock

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Corohmni

South Africa . 496 parts In-Stock

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UHIMA Technologies

Türkiye . 86 parts In-Stock

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Overview

Enhance your electronic designs with the NBSG11BAG clock driver and buffer by Onsemi. Crafted with precision and quality, this versatile component is perfect for a wide range of applications in the tech industry. With its differential input conditioning and ultra-fast propagation delay, this product ensures optimal performance and reliability. Trust in the expertise of Onsemi to deliver top-notch products that meet your needs. Upgrade your projects today with the NBSG11BAG for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and allowing for efficient assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage: 2.5V

Optimal supply voltage for efficient performance and power consumption.

Propagation Delay: 0.16 ns

Fast propagation delay allows for precise timing in clock distribution applications.

Maximum Operating Temperature: 70 °C

Wide operating temperature range makes it suitable for various environments and applications.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperature conditions ensures reliability in challenging environments.

Minimum Supply Voltage: 2.375V

Low minimum supply voltage requirement allows for flexibility in power supply options.

No. of True Outputs: 2

Having multiple true outputs provides versatility in clock signal distribution.

Minimum fmax: 10709 MHz

High maximum frequency allows for fast data processing and signal transmission.

Maximum Supply Voltage: 3.465V

High maximum supply voltage tolerance ensures protection against voltage spikes and fluctuations.

Technical Specifications

Clock Drivers & Buffers NBSG11BAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Minimum fmax:

10709 MHz

Trade Compliance

NBSG11BAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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