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NBSG111BA

Onsemi

NBSG111BA by Onsemi

NBSG111BA clock driver by Onsemi features a low profile grid array package, with 49 terminals and differential mux input conditioning. Operating b/w -40 to 70 °C, it offers a propagation delay of 0.35 ns and supports supply voltages ranging from -3.3V to 3.3V. Ideal for applications requiring precise timing control in electronic systems.

Median Price

$21.660

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,714 parts In-Stock

1+ parts

-

100+ parts

$18.710

1k+ parts

$16.740

10k+ parts

$15.750

1,714

-

$18.710

$16.740

$15.750

DigiKey

USA . 1,714 parts In-Stock

1+ parts

-

100+ parts

$21.660

1k+ parts

$21.660

10k+ parts

$21.660

1,714

-

$21.660

$21.660

$21.660

Verical

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$23.387

1k+ parts

$20.925

10k+ parts

$19.688

1,700

-

$23.387

$20.925

$19.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,153 parts In-Stock

1+ parts

$18.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,153

$18.830

-

-

-

Digiode

USA . 2,296 parts In-Stock

1+ parts

$19.788

100+ parts

-

1k+ parts

-

10k+ parts

-

2,296

$19.788

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 4 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$1.750

-

-

-

Ampacity Inc.

Singapore . 1,645 parts In-Stock

1+ parts

$16.010

100+ parts

-

1k+ parts

-

10k+ parts

-

1,645

$16.010

-

-

-

Corphita

USA . 2,162 parts In-Stock

1+ parts

$18.747

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

$18.747

-

-

-

Corohmni

South Africa . 354 parts In-Stock

1+ parts

$18.830

100+ parts

-

1k+ parts

-

10k+ parts

-

354

$18.830

-

-

-

Component Stockers USA

USA . 2,093 parts In-Stock

1+ parts

$21.390

100+ parts

$20.100

1k+ parts

$18.180

10k+ parts

-

2,093

$21.390

$20.100

$18.180

-

Problanco Electronics

Mexico . 8,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,370

-

-

-

-

Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,500

-

-

-

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TANS Electronics

Latvia . 3,232 parts In-Stock

1+ parts

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3,232

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SupplyDigital Components

Austria . 2,188 parts In-Stock

1+ parts

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2,188

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Continental Prestige Electronics

USA . 1,714 parts In-Stock

1+ parts

-

100+ parts

$17.740

1k+ parts

-

10k+ parts

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1,714

-

$17.740

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-

Microchip USA

USA . 428 parts In-Stock

1+ parts

-

100+ parts

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428

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UHIMA Technologies

Türkiye . 218 parts In-Stock

1+ parts

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218

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Kepictronics

USA . 194 parts In-Stock

1+ parts

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194

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Kulean Microsystems

USA . 143 parts In-Stock

1+ parts

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100+ parts

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143

-

-

-

-

Overview

Unlock seamless performance and precision with the NBSG111BA clock driver & buffer by Onsemi. Crafted with top-tier materials and cutting-edge technology, this product ensures unparalleled reliability and efficiency. Ideal for a wide range of applications, this powerful component empowers you to optimize your systems with ease. Experience the seamless integration, enhanced functionality, and unmatched value that the NBSG111BA brings to the table. Elevate your projects and elevate your results with this exceptional solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable, it can be easily integrated into PCB designs for compact and space-saving applications.

Input Conditioning: DIFFERENTIAL MUX

The use of a differential multiplexer ensures accurate signal processing and noise rejection.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V makes it suitable for low power applications.

Propagation Delay (tpd): 0.35 ns

With a low propagation delay of 0.35ns, it ensures fast and efficient signal transmission.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C allows for reliable performance in various environmental conditions.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption.

Technical Specifications

Clock Drivers & Buffers NBSG111BA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL OPERATING RANGE: VCC = 0 V WITH VEE = -2.375 V TO -3.465 V

Family:

111

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e0

Length:

8 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

49

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.4 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NBSG111BA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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