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NBSG11MAHTBG

Onsemi

NBSG11MAHTBG by Onsemi

NBSG11MAHTBG clock driver by Onsemi features a propagation delay of 0.16ns, operating temperature range of -40 to 70 °C, and a max supply voltage of 3.465V. Ideal for applications requiring differential input conditioning, this device comes in a square package with 16 terminals and is suitable for high-speed data transmission systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,681 parts In-Stock

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Digiode

USA . 623 parts In-Stock

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Problanco Electronics

Mexico . 7,292 parts In-Stock

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SupplyDigital Components

Austria . 6,117 parts In-Stock

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TANS Electronics

Latvia . 4,820 parts In-Stock

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Kulean Microsystems

USA . 2,337 parts In-Stock

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Corphita

USA . 941 parts In-Stock

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Corohmni

South Africa . 381 parts In-Stock

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UHIMA Technologies

Türkiye . 104 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NBSG11MAHTBG by Onsemi. Designed with precision and reliability in mind, this clock driver offers seamless integration for a wide range of applications. With its high-quality construction and advanced features, customers can experience improved efficiency and accuracy in their systems. Trust Onsemi's expertise in clock drivers & buffers to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on a PCB, saving space and providing a clean and professional appearance.

Input Conditioning: DIFFERENTIAL

Enables accurate and stable signal processing, reducing noise and interference in the output signal.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for efficient and stable operation of the clock driver.

Propagation Delay (tpd): 0.16 ns

Provides fast signal processing, minimizing delays in the output signal for precise timing applications.

Maximum Operating Temperature: 70 °C

Ensures reliable operation in a wide range of temperature environments, making it suitable for various applications.

Minimum Supply Voltage (Vsup): 2.375 V

Allows for flexibility in power supply requirements while maintaining optimal performance.

Minimum fmax: 10709 MHz

Supports high-frequency operation, making it suitable for demanding clocking applications that require fast signal processing.

Technical Specifications

Clock Drivers & Buffers NBSG11MAHTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

Length:

4 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.03 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Minimum fmax:

10709 MHz

Trade Compliance

NBSG11MAHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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