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NB3L553DR2G

Onsemi

NB3L553DR2G by Onsemi

NB3L553DR2G clock driver by Onsemi features a 5 ns propagation delay at 2.5V, with 4 true outputs and 3-STATE output characteristics. It is ideal for applications requiring precise timing control in industrial settings, offering a small outline package style suitable for surface mount assembly.

Median Price

$2.010

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$1.090

100+ parts

$1.020

1k+ parts

$0.926

10k+ parts

-

2,500

$1.090

$1.020

$0.926

-

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

$1.950

100+ parts

$1.230

1k+ parts

$1.070

10k+ parts

$1.050

2,500

$1.950

$1.230

$1.070

$1.050

DigiKey

USA . 17,066 parts In-Stock

1+ parts

$2.340

100+ parts

$1.692

1k+ parts

$1.152

10k+ parts

$1.033

17,066

$2.340

$1.692

$1.152

$1.033

Element14

Singapore . 10,803 parts In-Stock

1+ parts

$2.670

100+ parts

$2.160

1k+ parts

$1.660

10k+ parts

$1.420

10,803

$2.670

$2.160

$1.660

$1.420

Mouser Electronics

USA . 6,788 parts In-Stock

1+ parts

-

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$1.020

6,788

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$1.020

Verical

USA . 2,071 parts In-Stock

1+ parts

-

100+ parts

$2.070

1k+ parts

$1.910

10k+ parts

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2,071

-

$2.070

$1.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,059 parts In-Stock

1+ parts

$0.880

100+ parts

-

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-

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2,059

$0.880

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.442

100+ parts

-

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300

$2.442

-

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Mobius Materials

USA . 119 parts In-Stock

1+ parts

$3.430

100+ parts

$2.750

1k+ parts

-

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119

$3.430

$2.750

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Chip Stock

USA . 10,980 parts In-Stock

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Vyrian

USA . 5,516 parts In-Stock

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5,516

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Flip Electronics

USA . 4,983 parts In-Stock

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4,983

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Component Sense

UK . 3,624 parts In-Stock

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3,624

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Sensible Micro Corp

USA . 2,400 parts In-Stock

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2,400

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ComSIT Distribution GmbH

Germany . 1,560 parts In-Stock

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1,560

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Prism Electronics

USA . 144 parts In-Stock

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144

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Lantek

USA . 144 parts In-Stock

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144

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Speed Components Ltd

Israel . 127 parts In-Stock

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127

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Contempo Components LLC

USA . 43 parts In-Stock

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43

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Bristol Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 880 parts In-Stock

1+ parts

$0.833

100+ parts

-

1k+ parts

-

10k+ parts

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880

$0.833

-

-

-

Semicontronic

India . 6,333 parts In-Stock

1+ parts

$0.870

100+ parts

$0.848

1k+ parts

$0.844

10k+ parts

-

6,333

$0.870

$0.848

$0.844

-

Ampacity Inc.

Singapore . 5,601 parts In-Stock

1+ parts

$0.870

100+ parts

-

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-

10k+ parts

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5,601

$0.870

-

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Corohmni

South Africa . 368 parts In-Stock

1+ parts

$0.926

100+ parts

-

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368

$0.926

-

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Argo Parts USA

USA . 3,302 parts In-Stock

1+ parts

$1.460

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3,302

$1.460

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.442

100+ parts

$2.393

1k+ parts

-

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100

$2.442

$2.393

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Microchip USA

USA . 4,170 parts In-Stock

1+ parts

$7.316

100+ parts

-

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4,170

$7.316

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Advanced Electronics

New Zealand . 39 parts In-Stock

1+ parts

$18.654

100+ parts

$17.722

1k+ parts

$17.722

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39

$18.654

$17.722

$17.722

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Aztec Data Supply Inc.

USA . 299 parts In-Stock

1+ parts

$30.410

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299

$30.410

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Perfect Parts

USA . 308,635 parts In-Stock

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308,635

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Kepictronics

USA . 8,000 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Kulean Microsystems

USA . 5,214 parts In-Stock

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5,214

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A-Z Elektronik GmbH

Germany . 5,175 parts In-Stock

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5,175

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Alle Elektronik GmbH

Germany . 4,095 parts In-Stock

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4,095

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Lixinc

USA . 3,238 parts In-Stock

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SupplyDigital Components

Austria . 2,517 parts In-Stock

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2,517

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GreenTree Electronics

Israel . 2,080 parts In-Stock

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2,080

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Speed Components Ltd (Excess)

Israel . 1,649 parts In-Stock

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1,649

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Assy Fe

Spain . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 966 parts In-Stock

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966

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TANS Electronics

Latvia . 735 parts In-Stock

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735

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UHIMA Technologies

Türkiye . 421 parts In-Stock

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421

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

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$1.480

1k+ parts

$1.020

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3

-

$1.480

$1.020

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Overview

Enhance the performance of your electronic devices with the NB3L553DR2G clock driver and buffer by Onsemi. Crafted with precision and expertise, this product delivers impeccable quality and reliability that Onsemi is renowned for. Ideal for a wide range of applications, this small outline package offers customers seamless integration and improved functionality. Experience the value and benefits of faster propagation delay, 3-state output characteristics, and dual terminal position. Upgrade your devices today with the NB3L553DR2G and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay ensures fast and efficient signal processing, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface-mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V makes this clock driver energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this clock driver can withstand harsh environmental conditions and maintain stable performance.

Technical Specifications

Clock Drivers & Buffers NB3L553DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3V OR 5V SUPPLY

Family:

3L

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum I (ol):

35 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NB3L553DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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