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NB3L8504SDTR2G

Onsemi

NB3L8504SDTR2G by Onsemi

NB3L8504SDTR2G clock driver by Onsemi has a propagation delay of 1.3 ns, operates at 2.5V/3.3V, and offers 4 true outputs. Ideal for applications requiring differential input conditioning and a small outline package style with a thin profile, such as industrial temperature grade systems needing precise clock signal distribution.

Median Price

$6.940

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,142 parts In-Stock

1+ parts

$6.940

100+ parts

$4.512

1k+ parts

$4.075

10k+ parts

$3.965

3,142

$6.940

$4.512

$4.075

$3.965

Mouser Electronics

USA . 2,991 parts In-Stock

1+ parts

$6.940

100+ parts

$4.410

1k+ parts

$3.830

10k+ parts

$3.780

2,991

$6.940

$4.410

$3.830

$3.780

Chip1Stop

Japan . 1,569 parts In-Stock

1+ parts

$24.700

100+ parts

$10.300

1k+ parts

$7.030

10k+ parts

-

1,569

$24.700

$10.300

$7.030

-

Flip Electronics (Authorized)

USA . 84,000 parts In-Stock

1+ parts

-

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84,000

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Verical

USA . 22,500 parts In-Stock

1+ parts

-

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$1.512

22,500

-

-

-

$1.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,502 parts In-Stock

1+ parts

$1.512

100+ parts

-

1k+ parts

-

10k+ parts

-

1,502

$1.512

-

-

-

Digiode

USA . 2,098 parts In-Stock

1+ parts

$7.590

100+ parts

-

1k+ parts

-

10k+ parts

-

2,098

$7.590

-

-

-

Flip Electronics

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

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84,000

-

-

-

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Martec Srl

Italy . 2,114 parts In-Stock

1+ parts

-

100+ parts

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2,114

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 301 parts In-Stock

1+ parts

$1.512

100+ parts

-

1k+ parts

-

10k+ parts

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301

$1.512

-

-

-

Corphita

USA . 2,245 parts In-Stock

1+ parts

$7.191

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$7.191

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$21.299

100+ parts

$19.382

1k+ parts

$17.465

10k+ parts

-

5,000

$21.299

$19.382

$17.465

-

Microchip USA

USA . 5,189 parts In-Stock

1+ parts

$26.380

100+ parts

$26.220

1k+ parts

$26.140

10k+ parts

$26.060

5,189

$26.380

$26.220

$26.140

$26.060

Perfect Parts

USA . 41,222 parts In-Stock

1+ parts

-

100+ parts

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41,222

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Kepictronics

USA . 17,500 parts In-Stock

1+ parts

-

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17,500

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-

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Lixinc

USA . 16,274 parts In-Stock

1+ parts

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16,274

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Kulean Microsystems

USA . 2,180 parts In-Stock

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2,180

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Problanco Electronics

Mexico . 1,606 parts In-Stock

1+ parts

-

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1,606

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-

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SupplyDigital Components

Austria . 801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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801

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TANS Electronics

Latvia . 336 parts In-Stock

1+ parts

-

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336

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UHIMA Technologies

Türkiye . 313 parts In-Stock

1+ parts

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313

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Overview

Enhance your electronic projects with the NB3L8504SDTR2G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This clock driver & buffer boasts a range of applications, making it a versatile choice for your circuit needs. With minimal propagation delay and precise differential input conditioning, this product ensures seamless performance. Experience the value of quick signal transmission, efficient power usage, and consistent functionality with the NB3L8504SDTR2G. Elevate your projects with this cutting-edge component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting.

Propagation Delay At Nominal Supply: 1.3 ns

Ensures fast signal processing, making the product efficient for time-sensitive applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Ensures accurate signal transmission and reduces noise interference, improving overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

Provides a stable power source for the product, ensuring consistent operation.

No. of Functions: 4

Offers versatility and multiple functions in a single package, making the product versatile and cost-effective.

Maximum Operating Temperature: 85 °C

Allows the product to operate reliably in a wide range of temperature conditions, providing flexibility in usage.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold environments, enhancing the product's durability.

Technical Specifications

Clock Drivers & Buffers NB3L8504SDTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATE ON 3.3V SUPPLY

Family:

NB3

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

1.3 ns

Propagation Delay (tpd):

1.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.5625 V

Minimum Supply Voltage (Vsup):

2.4375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

700 MHz

Trade Compliance

NB3L8504SDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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