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NB3L202KMNTXG

Onsemi

NB3L202KMNTXG by Onsemi

NB3L202KMNTXG clock driver by Onsemi features 1.4ns propagation delay, 350MHz min fmax, and 4 true outputs. Ideal for industrial applications requiring differential input conditioning and a supply voltage range of 2.375V to 2.625V in a compact square package with quad terminals.

Median Price

$3.482

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,785 parts In-Stock

1+ parts

$4.450

100+ parts

$2.816

1k+ parts

$2.521

10k+ parts

$2.434

1,785

$4.450

$2.816

$2.521

$2.434

Mouser Electronics

USA . 1,109 parts In-Stock

1+ parts

$4.450

100+ parts

$2.820

1k+ parts

$2.530

10k+ parts

$2.420

1,109

$4.450

$2.820

$2.530

$2.420

Chip1Stop

Japan . 2,490 parts In-Stock

1+ parts

$14.200

100+ parts

$5.850

1k+ parts

$3.760

10k+ parts

-

2,490

$14.200

$5.850

$3.760

-

Farnell

UK . 35,286 parts In-Stock

1+ parts

-

100+ parts

-

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$2.450

35,286

-

-

-

$2.450

Rochester

USA . 32,091 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

32,091

-

$2.240

$2.010

$1.890

Verical

USA . 19,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.513

10k+ parts

$2.362

19,572

-

-

$2.513

$2.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 440 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

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-

440

$2.375

-

-

-

Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$2.621

100+ parts

-

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-

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83

$2.621

-

-

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Vyrian

USA . 15,192 parts In-Stock

1+ parts

-

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15,192

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Prism Electronics

USA . 1,699 parts In-Stock

1+ parts

-

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1,699

-

-

-

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Cyclops Electronics Ltd

UK . 252 parts In-Stock

1+ parts

-

100+ parts

-

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252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,072 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

-

15,072

$2.080

-

-

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Corphita

USA . 729 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

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10k+ parts

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729

$2.250

-

-

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Corohmni

South Africa . 381 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

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381

$2.450

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.568

100+ parts

-

1k+ parts

$2.466

10k+ parts

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1,000

$2.568

-

$2.466

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Argo Parts USA

USA . 218 parts In-Stock

1+ parts

$2.621

100+ parts

-

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218

$2.621

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Microchip USA

USA . 7,159 parts In-Stock

1+ parts

$16.490

100+ parts

$16.390

1k+ parts

$16.340

10k+ parts

$16.290

7,159

$16.490

$16.390

$16.340

$16.290

Continental Prestige Electronics

USA . 35,281 parts In-Stock

1+ parts

-

100+ parts

$3.000

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35,281

-

$3.000

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Perfect Parts

USA . 13,160 parts In-Stock

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13,160

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SupplyDigital Components

Austria . 6,440 parts In-Stock

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6,440

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Problanco Electronics

Mexico . 6,013 parts In-Stock

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6,013

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Kulean Microsystems

USA . 6,000 parts In-Stock

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TANS Electronics

Latvia . 3,368 parts In-Stock

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3,368

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GreenTree Electronics

Israel . 2,590 parts In-Stock

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2,590

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Speed Components Ltd (Excess)

Israel . 348 parts In-Stock

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348

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Legend Electronics Inc. (Excess)

USA . 98 parts In-Stock

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98

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UHIMA Technologies

Türkiye . 11 parts In-Stock

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11

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Overview

Experience unparalleled performance and reliability with the NB3L202KMNTXG clock driver by Onsemi. As a leader in clock drivers & buffers, Onsemi delivers cutting-edge technology that ensures seamless operation and precision timing for your applications. Ideal for industries requiring differential input conditioning and 3-state output characteristics, this product offers a wide temperature range and high-speed operation. Trust Onsemi to provide top-quality solutions that exceed expectations and elevate your projects to new heights. Elevate your designs with the NB3L202KMNTXG and unlock unparalleled efficiency and performance.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on the surface of a PCB, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Enables reliable signal processing and noise rejection for improved performance in high-speed data applications.

Propagation Delay (tpd): 1.4 ns

Provides fast signal propagation, ensuring timely and accurate clock distribution.

Output Characteristics: 3-STATE

Allows the outputs to be in a high-impedance state when disabled, offering flexibility in signal routing and system design.

Minimum fmax: 350 MHz

Supports high-frequency clock signals, making it suitable for demanding applications that require precise timing.

Technical Specifications

Clock Drivers & Buffers NB3L202KMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY

Family:

NB3

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.4 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

350 MHz

Trade Compliance

NB3L202KMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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