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NB3L8533DTR2G

Onsemi

NB3L8533DTR2G by Onsemi

NB3L8533DTR2G clock driver by Onsemi features a propagation delay of 1.55 ns, operates at a nominal voltage of 2.5V, and offers differential mux input conditioning. This device is ideal for applications requiring precise clock signal distribution in industrial settings with operating temperatures ranging from -40 to 85°C.

Median Price

$8.220

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,728 parts In-Stock

1+ parts

$5.440

100+ parts

$5.110

1k+ parts

$4.620

10k+ parts

-

1,728

$5.440

$5.110

$4.620

-

Mouser Electronics

USA . 1,449 parts In-Stock

1+ parts

$11.000

100+ parts

$7.040

1k+ parts

$5.330

10k+ parts

$5.140

1,449

$11.000

$7.040

$5.330

$5.140

Chip1Stop

Japan . 2,400 parts In-Stock

1+ parts

$31.100

100+ parts

$12.900

1k+ parts

$8.840

10k+ parts

-

2,400

$31.100

$12.900

$8.840

-

DigiKey

USA . 14,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.380

10k+ parts

-

14,850

-

-

$5.380

-

Flip Electronics (Authorized)

USA . 14,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,850

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 64 parts In-Stock

1+ parts

$5.168

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$5.168

-

-

-

Vyrian

USA . 1,969 parts In-Stock

1+ parts

$5.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,969

$5.380

-

-

-

Flip Electronics

USA . 14,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,850

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,995 parts In-Stock

1+ parts

$4.896

100+ parts

-

1k+ parts

-

10k+ parts

-

1,995

$4.896

-

-

-

Corohmni

South Africa . 76 parts In-Stock

1+ parts

$5.380

100+ parts

-

1k+ parts

-

10k+ parts

-

76

$5.380

-

-

-

Component Stockers USA

USA . 4,243 parts In-Stock

1+ parts

$9.770

100+ parts

$7.310

1k+ parts

$4.950

10k+ parts

-

4,243

$9.770

$7.310

$4.950

-

Microchip USA

USA . 5,204 parts In-Stock

1+ parts

$15.110

100+ parts

$14.900

1k+ parts

$14.790

10k+ parts

$14.680

5,204

$15.110

$14.900

$14.790

$14.680

Perfect Parts

USA . 8,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,288

-

-

-

-

SupplyDigital Components

Austria . 6,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,253

-

-

-

-

Kulean Microsystems

USA . 5,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,879

-

-

-

-

TANS Electronics

Latvia . 3,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,729

-

-

-

-

Problanco Electronics

Mexico . 3,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,252

-

-

-

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UHIMA Technologies

Türkiye . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12

-

-

-

-

Overview

Enhance the efficiency and performance of your electronic devices with the NB3L8533DTR2G Clock Driver & Buffer from Onsemi. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Perfect for a wide range of applications, this clock driver ensures seamless operation and smooth functioning of your devices. Upgrade your systems today and experience the value and benefits that only Onsemi can provide. Trust in the excellence of Onsemi and elevate your electronics to new heights with the NB3L8533DTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight, durable, and resistant to external factors, ensuring the reliability and longevity of the product.

Propagation Delay At Nominal Supply: 1.55 ns

The low propagation delay ensures fast signal transmission, making this product suitable for time-sensitive applications where timing accuracy is crucial.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic designs where space is limited.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage allows for compatibility with a wide range of systems and components, making it a versatile choice for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring stable connections and long-term performance.

Technical Specifications

Clock Drivers & Buffers NB3L8533DTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

1.55 ns

Propagation Delay (tpd):

1.55 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NB3L8533DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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