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NB3L208KMNG

Onsemi

NB3L208KMNG by Onsemi

NB3L208KMNG clock driver by Onsemi features 1.4ns propagation delay, 16 true outputs, and operates in industrial temperature range (-40 to 85 °C). It is used for differential input conditioning in applications requiring a square package style with 32 terminals.

Median Price

$5.445

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

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$2.342

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1

$2.342

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Chip1Stop

Japan . 1 parts In-Stock

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$4.670

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$4.670

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DigiKey

USA . 44 parts In-Stock

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$8.520

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$8.520

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Farnell

UK . 35,873 parts In-Stock

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$65.500

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$47.800

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$45.790

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35,873

$65.500

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$45.790

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Rochester

USA . 35,582 parts In-Stock

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$4.840

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$4.330

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$4.070

35,582

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$4.840

$4.330

$4.070

Verical

USA . 24,304 parts In-Stock

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$6.050

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$5.412

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$5.088

24,304

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$5.412

$5.088

Avnet

USA . 227 parts In-Stock

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Digiode

USA . 1,455 parts In-Stock

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$2.280

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$2.280

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Flip Electronics

USA . 40,700 parts In-Stock

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Vyrian

USA . 5,468 parts In-Stock

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Semtec, LLC

USA . 929 parts In-Stock

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Corphita

USA . 1,476 parts In-Stock

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$2.160

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Corohmni

South Africa . 228 parts In-Stock

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$2.400

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$2.400

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Continental Prestige Electronics

USA . 35,551 parts In-Stock

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$7.720

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$5.630

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$7.720

$5.630

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Microchip USA

USA . 320 parts In-Stock

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$24.612

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Kulean Microsystems

USA . 5,704 parts In-Stock

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SupplyDigital Components

Austria . 4,645 parts In-Stock

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TANS Electronics

Latvia . 3,193 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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UHIMA Technologies

Türkiye . 959 parts In-Stock

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Problanco Electronics

Mexico . 208 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronics projects with the NB3L208KMNG clock driver & buffer by Onsemi. Known for their top-quality components, Onsemi delivers reliability and performance. This versatile chip carrier is perfect for applications requiring differential input conditioning and 3-state output characteristics. With a nominal supply voltage of 2.5V and a propagation delay of just 1.4ns, this industrial-grade clock driver offers precision timing for your designs. Trust Onsemi to provide you with the tools you need for success in your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for mass production.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, resulting in a more reliable clock signal output.

Package Shape: SQUARE

Square package shape ensures efficient use of space on the circuit board and allows for easy integration with other components.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is commonly available and compatible with many standard power sources, making this product versatile.

Propagation Delay (tpd): 1.4 ns

Low propagation delay ensures quick response times, making this clock driver suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock driver can withstand harsh environmental conditions and maintain stability.

Output Characteristics: 3-STATE

3-STATE output allows the driver to control the output signal, providing flexibility in circuit design and reducing power consumption when the output is not needed.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 to 85 °C ensures reliable operation in both extreme cold and hot environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection with the circuit board.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and secure attachment to the circuit board, enhancing the overall durability of the product.

Width: 5 mm

Compact width of 5mm saves space on the circuit board and enables easy integration into tight layouts or designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with consistent operation over a wide temperature range.

Technical Specifications

Clock Drivers & Buffers NB3L208KMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.97 TO 3.63

Family:

NB3

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.4 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB3L208KMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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