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NB3L14SMNTXG

Onsemi

NB3L14SMNTXG by Onsemi

NB3L14SMNTXG clock driver by Onsemi features a propagation delay of 0.6ns, operates in industrial temperature range (-40 to 85 °C), and has 8 true outputs with a max frequency of 300MHz. Ideal for applications requiring differential input conditioning, this chip carrier package with very thin profile is surface mountable.

Median Price

$5.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,375,150 parts In-Stock

1+ parts

-

100+ parts

$5.050

1k+ parts

$5.050

10k+ parts

$5.050

1,375,150

-

$5.050

$5.050

$5.050

Rochester

USA . 1,374,650 parts In-Stock

1+ parts

-

100+ parts

$4.360

1k+ parts

$3.900

10k+ parts

$3.670

1,374,650

-

$4.360

$3.900

$3.670

Verical

USA . 1,265,540 parts In-Stock

1+ parts

-

100+ parts

$5.450

1k+ parts

$4.875

10k+ parts

$4.588

1,265,540

-

$5.450

$4.875

$4.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,864 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$4.390

-

-

-

Digiode

USA . 1,336 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

1,336

$4.617

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 449 parts In-Stock

1+ parts

$3.849

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$3.849

-

-

-

Corphita

USA . 1,370 parts In-Stock

1+ parts

$4.374

100+ parts

-

1k+ parts

-

10k+ parts

-

1,370

$4.374

-

-

-

Component Stockers USA

USA . 1,792,694 parts In-Stock

1+ parts

$5.040

100+ parts

$4.740

1k+ parts

$4.280

10k+ parts

$4.280

1,792,694

$5.040

$4.740

$4.280

$4.280

Continental Prestige Electronics

USA . 1,379,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.140

10k+ parts

-

1,379,150

-

-

$4.140

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,000

-

-

-

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TANS Electronics

Latvia . 7,705 parts In-Stock

1+ parts

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100+ parts

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7,705

-

-

-

-

Kulean Microsystems

USA . 5,273 parts In-Stock

1+ parts

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5,273

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QUARKTWIN TECHNOLOGY LTD

USA . 4,545 parts In-Stock

1+ parts

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4,545

-

-

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A-Z Elektronik GmbH

Germany . 1,586 parts In-Stock

1+ parts

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1,586

-

-

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Problanco Electronics

Mexico . 1,569 parts In-Stock

1+ parts

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1,569

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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SupplyDigital Components

Austria . 814 parts In-Stock

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814

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UHIMA Technologies

Türkiye . 251 parts In-Stock

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251

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Microchip USA

USA . 210 parts In-Stock

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210

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Overview

Enhance your electronic designs with the NB3L14SMNTXG clock driver and buffer from Onsemi. With its top-notch quality and reliable performance, this surface-mount device is perfect for applications requiring differential input conditioning. The compact square package shape and wide temperature range make it ideal for industrial use. Benefit from its quick propagation delay of 0.6 ns and high maximum fmax of 300 MHz. Trust Onsemi to deliver exceptional products that provide value and efficiency to your projects. Elevate your designs with the NB3L14SMNTXG today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability provides ease of assembly and allows for compact design, making it suitable for space-constrained applications.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps to improve noise immunity and signal integrity, ensuring reliable operation in noisy environments.

Nominal Supply Voltage / Vsup (V): 2.5

Nominal supply voltage of 2.5V is commonly used in many electronic systems, providing compatibility with a wide range of applications.

Propagation Delay (tpd): 0.6 ns

Low propagation delay of 0.6ns ensures fast signal processing, making this product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows for reliable operation in elevated temperature environments, increasing product durability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures operation in cold environments, making this product suitable for a wide range of temperature conditions.

No. of True Outputs: 8

Having 8 true outputs allows for driving multiple signals simultaneously, increasing the versatility and functionality of the product.

Minimum fmax: 300 MHz

Having a minimum fmax frequency of 300MHz indicates the high-speed performance of this clock driver/buffer, making it suitable for demanding applications requiring fast signal processing.

Technical Specifications

Clock Drivers & Buffers NB3L14SMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Propagation Delay (tpd):

.6 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

300 MHz

Trade Compliance

NB3L14SMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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