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NB3L208KMNTXG

Onsemi

NB3L208KMNTXG by Onsemi

NB3L208KMNTXG clock driver by Onsemi features 1.4ns propagation delay, 16 true outputs, and operates in industrial temperature range. Ideal for applications requiring differential input conditioning and 3-STATE output characteristics in a compact square package with quad terminals.

Median Price

$8.520

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 734 parts In-Stock

1+ parts

$8.520

100+ parts

$5.609

1k+ parts

$5.084

10k+ parts

$4.982

734

$8.520

$5.609

$5.084

$4.982

Mouser Electronics

USA . 163 parts In-Stock

1+ parts

$8.520

100+ parts

$5.610

1k+ parts

$4.850

10k+ parts

-

163

$8.520

$5.610

$4.850

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Chip1Stop

Japan . 1,895 parts In-Stock

1+ parts

$29.500

100+ parts

$12.300

1k+ parts

$8.400

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1,895

$29.500

$12.300

$8.400

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Flip Electronics (Authorized)

USA . 16,372 parts In-Stock

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Verical

USA . 12,000 parts In-Stock

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$4.648

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12,000

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-

$4.648

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Rochester

USA . 10,415 parts In-Stock

1+ parts

-

100+ parts

$4.710

1k+ parts

$4.220

10k+ parts

$3.970

10,415

-

$4.710

$4.220

$3.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 934 parts In-Stock

1+ parts

$4.874

100+ parts

-

1k+ parts

-

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934

$4.874

-

-

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Vyrian

USA . 816 parts In-Stock

1+ parts

$5.130

100+ parts

-

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-

10k+ parts

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816

$5.130

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Flip Electronics

USA . 27,372 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,372

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,234 parts In-Stock

1+ parts

$4.617

100+ parts

-

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2,234

$4.617

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-

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Corohmni

South Africa . 81 parts In-Stock

1+ parts

$5.130

100+ parts

-

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81

$5.130

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Microchip USA

USA . 2,864 parts In-Stock

1+ parts

$14.810

100+ parts

$14.590

1k+ parts

$14.490

10k+ parts

$14.380

2,864

$14.810

$14.590

$14.490

$14.380

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$31.990

100+ parts

$29.111

1k+ parts

$26.232

10k+ parts

-

500

$31.990

$29.111

$26.232

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QUARKTWIN TECHNOLOGY LTD

USA . 16,479 parts In-Stock

1+ parts

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16,479

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SupplyDigital Components

Austria . 5,269 parts In-Stock

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5,269

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Problanco Electronics

Mexico . 4,278 parts In-Stock

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4,278

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Kulean Microsystems

USA . 3,459 parts In-Stock

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3,459

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GreenTree Electronics

Israel . 1,995 parts In-Stock

1+ parts

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1,995

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TANS Electronics

Latvia . 254 parts In-Stock

1+ parts

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254

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UHIMA Technologies

Türkiye . 245 parts In-Stock

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245

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Overview

Unlock the potential of your electronic designs with the NB3L208KMNTXG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch Clock Drivers & Buffers that are essential for ensuring precise timing in your applications. With its differential input conditioning and 3-state output characteristics, this product offers unparalleled reliability and performance. Whether you're working on telecommunications, networking, or consumer electronics projects, the NB3L208KMNTXG provides the value, benefits, and advantages you need to bring your designs to life. Experience the quality and innovation of Onsemi with this cutting-edge clock driver.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a PCB, making it convenient for assembly in electronic devices.

Input Conditioning: DIFFERENTIAL

The use of a differential input conditioning ensures reliable signal processing and noise reduction in the system.

Propagation Delay (tpd): 1.4 ns

With a very low propagation delay, this clock driver enables fast and efficient signal transmission, crucial for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this clock driver to be used in industrial environments without risk of overheating.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style with heat sink and thin profile ensures efficient heat dissipation and space-saving design in electronic devices.

No. of True Outputs: 16

Having 16 true outputs provides flexibility and scalability in designing clock distribution networks.

Technical Specifications

Clock Drivers & Buffers NB3L208KMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.97 TO 3.63

Family:

NB3

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.4 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB3L208KMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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