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NB3L8504SDTG

Onsemi

NB3L8504SDTG by Onsemi

NB3L8504SDTG clock driver by Onsemi features a propagation delay of 1.3 ns, operates at a nominal voltage of 2.5V, and offers differential input conditioning. With a package style of small outline and thin profile, it is ideal for industrial applications requiring precise timing synchronization in electronic systems.

Median Price

$4.110

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 24 parts In-Stock

1+ parts

$2.925

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$2.925

-

-

-

Chip1Stop

Japan . 35 parts In-Stock

1+ parts

$4.240

100+ parts

$3.710

1k+ parts

$3.690

10k+ parts

$3.350

35

$4.240

$3.710

$3.690

$3.350

Mouser Electronics

USA . 389 parts In-Stock

1+ parts

$6.440

100+ parts

$4.520

1k+ parts

$3.860

10k+ parts

$3.820

389

$6.440

$4.520

$3.860

$3.820

DigiKey

USA . 199 parts In-Stock

1+ parts

$6.940

100+ parts

$4.523

1k+ parts

$4.155

10k+ parts

$4.067

199

$6.940

$4.523

$4.155

$4.067

Flip Electronics (Authorized)

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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84,000

-

-

-

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Verical

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

$3.705

1k+ parts

-

10k+ parts

-

1,536

-

$3.705

-

-

Avnet

USA . 191 parts In-Stock

1+ parts

-

100+ parts

$3.981

1k+ parts

$3.791

10k+ parts

$3.682

191

-

$3.981

$3.791

$3.682

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$4.081

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$4.081

-

-

-

Digiode

USA . 2,082 parts In-Stock

1+ parts

$4.199

100+ parts

-

1k+ parts

-

10k+ parts

-

2,082

$4.199

-

-

-

Flip Electronics

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

84,000

-

-

-

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Vyrian

USA . 13,993 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,993

-

-

-

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Semtec, LLC

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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235

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,091 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

14,091

$3.600

-

-

-

Corphita

USA . 1,922 parts In-Stock

1+ parts

$3.978

100+ parts

-

1k+ parts

-

10k+ parts

-

1,922

$3.978

-

-

-

Bastille Electronics

Australia . 1,607 parts In-Stock

1+ parts

$4.081

100+ parts

$3.877

1k+ parts

$3.683

10k+ parts

$3.632

1,607

$4.081

$3.877

$3.683

$3.632

Corohmni

South Africa . 258 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

-

10k+ parts

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258

$4.420

-

-

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Kulean Microsystems

USA . 7,226 parts In-Stock

1+ parts

-

100+ parts

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7,226

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TANS Electronics

Latvia . 5,542 parts In-Stock

1+ parts

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100+ parts

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5,542

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-

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Problanco Electronics

Mexico . 2,343 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,343

-

-

-

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SupplyDigital Components

Austria . 2,278 parts In-Stock

1+ parts

-

100+ parts

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2,278

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UHIMA Technologies

Türkiye . 934 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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934

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Overview

Discover the cutting-edge NB3L8504SDTG clock driver and buffer by Onsemi, crafted with precision and quality in mind. This innovative product from the Clock Drivers & Buffers category offers unparalleled reliability and performance. Ideal for a range of applications, this advanced technology ensures seamless operation and efficiency. Elevate your projects with the value and benefits that this top-tier product brings to the table - experience the advantage of choosing Onsemi for all your clock driver needs.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/epoxy body material makes the product lightweight and durable, ideal for applications where weight and sturdiness are important.

Propagation Delay At Nominal Supply 1.3 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount YES

Surface mount capability allows for easy installation on PCBs, saving space and making the product suitable for compact designs.

Input Conditioning DIFFERENTIAL

Differential input conditioning helps in noise cancellation and signal integrity, making the product reliable in noisy environments.

No. of Functions 4

Having multiple functions in a single device simplifies circuit design and reduces component count, leading to cost savings.

Nominal Supply Voltage / Vsup (V) 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with standard power supply configurations.

Power Supplies (V) 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows flexibility in system integration and compatibility with different voltage standards.

No. of Terminals 16

Having 16 terminals provides sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter) SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a small outline and thin profile saves space on the PCB and allows for high-density mounting, ideal for miniaturized electronic devices.

Maximum Operating Temperature 85 °C

High maximum operating temperature of 85°C ensures reliability in harsh environmental conditions and extends the product's lifespan.

Minimum Operating Temperature -40 °C

Low minimum operating temperature of -40°C makes the product suitable for use in cold environments without performance degradation.

Terminal Finish NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections over time.

Terminal Position DUAL

Dual terminal position allows for flexible PCB layout and easy soldering, enhancing ease of assembly and manufacturability.

Maximum Seated Height 1.2 mm

Low maximum seated height of 1.2mm enables compact and slim designs, especially important in space-constrained applications.

Width 4.4 mm

Narrow width of 4.4mm saves PCB real estate and facilitates high-density mounting, making the product suitable for miniaturized electronic devices.

Minimum Supply Voltage (Vsup) 2.4375 V

Support for a low minimum supply voltage of 2.4375V allows the product to operate in energy-efficient and low-power applications.

Maximum Time At Peak Reflow Temperature (s) 30

Support for a maximum reflow time of 30 seconds ensures reliable and consistent soldering during PCB assembly processes.

Peak Reflow Temperature °C 260

High peak reflow temperature of 260°C ensures proper soldering and component attachment during PCB assembly, preventing solder joint defects.

Length 5 mm

Short length of 5mm saves space on the PCB and allows for compact and space-efficient designs.

Temperature Grade INDUSTRIAL

Industrial temperature grade makes the product suitable for rugged and demanding operating conditions, ensuring reliable performance in harsh environments.

Terminal Form GULL WING

Gull wing terminal form offers mechanical strength and robustness during soldering, improving reliability and durability in the field.

Packing Method TUBE

Tubular packing method provides protection during shipping and storage, ensuring the product reaches the end user in optimal condition.

Terminal Pitch 0.65 mm

Fine terminal pitch of 0.65mm enables high-density packaging and miniaturization, making the product suitable for compact electronic devices.

Maximum Same Edge Skew (tskwd) 0.05 ns

Low maximum same edge skew of 0.05ns ensures accurate timing and signal synchronization, crucial for high-speed data applications.

No. of True Outputs 4

Having four true outputs provides flexibility in routing signals and interfacing with multiple components, enhancing system functionality.

Minimum fmax 700 MHz

High minimum fmax of 700MHz allows for fast signal processing and high-speed data transmission, making the product suitable for advanced digital applications.

Maximum Supply Voltage (Vsup) 2.5625 V

Support for a maximum supply voltage of 2.5625V ensures compatibility with a wide range of power supply configurations and voltage levels.

Maximum Power Supply Current (ICC) 50 mA

Support for a maximum power supply current of 50mA ensures efficient power consumption and prevents overloading of the device, enhancing overall system reliability.

Technical Specifications

Clock Drivers & Buffers NB3L8504SDTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATE ON 3.3V SUPPLY

Family:

NB3

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

1.3 ns

Propagation Delay (tpd):

1.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.5625 V

Minimum Supply Voltage (Vsup):

2.4375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

700 MHz

Trade Compliance

NB3L8504SDTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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