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NB3L853141DTR2G

Onsemi

NB3L853141DTR2G by Onsemi

NB3L853141DTR2G clock driver by Onsemi features 1.5 ns propagation delay, 10 true outputs, and 700 MHz min fmax. Ideal for applications requiring differential mux input conditioning in a small outline package with a thin profile. Operating temperature range from -40 to 85 °C.

Median Price

$6.920

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,828 parts In-Stock

1+ parts

$5.210

100+ parts

$4.900

1k+ parts

$4.430

10k+ parts

-

6,828

$5.210

$4.900

$4.430

-

DigiKey

USA . 2,268 parts In-Stock

1+ parts

$8.630

100+ parts

$5.687

1k+ parts

$5.156

10k+ parts

-

2,268

$8.630

$5.687

$5.156

-

Chip1Stop

Japan . 1,495 parts In-Stock

1+ parts

$30.000

100+ parts

$12.500

1k+ parts

$7.590

10k+ parts

-

1,495

$30.000

$12.500

$7.590

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Mouser Electronics

USA . 1,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.620

1,723

-

-

-

$4.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 442 parts In-Stock

1+ parts

$4.620

100+ parts

-

1k+ parts

-

10k+ parts

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442

$4.620

-

-

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Digiode

USA . 600 parts In-Stock

1+ parts

$4.950

100+ parts

-

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-

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600

$4.950

-

-

-

Flip Electronics

USA . 12,500 parts In-Stock

1+ parts

-

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12,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 61 parts In-Stock

1+ parts

$4.620

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$4.620

-

-

-

Corphita

USA . 1,568 parts In-Stock

1+ parts

$4.689

100+ parts

-

1k+ parts

-

10k+ parts

-

1,568

$4.689

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$10.766

100+ parts

$9.797

1k+ parts

$8.828

10k+ parts

-

10

$10.766

$9.797

$8.828

-

Microchip USA

USA . 5,434 parts In-Stock

1+ parts

$14.460

100+ parts

$14.260

1k+ parts

$14.150

10k+ parts

$14.050

5,434

$14.460

$14.260

$14.150

$14.050

SupplyDigital Components

Austria . 8,373 parts In-Stock

1+ parts

-

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8,373

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Perfect Parts

USA . 8,187 parts In-Stock

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8,187

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Kulean Microsystems

USA . 8,115 parts In-Stock

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8,115

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TANS Electronics

Latvia . 7,566 parts In-Stock

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7,566

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Problanco Electronics

Mexico . 6,260 parts In-Stock

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6,260

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Authorized Procurement Solutions

USA . 2,380 parts In-Stock

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2,380

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GreenTree Electronics

Israel . 2,190 parts In-Stock

1+ parts

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2,190

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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312

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Overview

Enhance your electronic designs with the NB3L853141DTR2G by Onsemi, a top-tier clock driver and buffer that delivers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product ensures precision and efficiency in all your applications. With a nominal supply voltage of 2.5V and a propagation delay of just 1.5ns, this clock driver and buffer provides seamless operation and optimal functionality. Elevate your projects with the quality and excellence of Onsemi's NB3L853141DTR2G, offering customers unmatched value and benefits for all their electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat, making this product reliable for long-term use.

Propagation Delay At Nominal Supply: 1.5 ns

This low propagation delay ensures efficient and fast signal transmission, making this product ideal for high-performance applications.

Surface Mount: YES

The surface mount feature allows for easy and compact integration onto circuit boards, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL MUX

The input conditioning capability ensures accurate and stable signal processing, making this product suitable for data-intensive applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is a common and widely supported voltage level, ensuring compatibility with a wide range of systems.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the chip to various components and peripherals, allowing for versatile usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, ensuring reliability in different conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in cold environments without any issues, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Width: 4.4 mm

The compact width of 4.4mm allows for a space-efficient design, making this product suitable for applications with limited board space.

Minimum Supply Voltage (Vsup): 2.375 V

The minimum supply voltage of 2.375V ensures compatibility with systems that require lower voltage levels, enhancing the product's versatility.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on circuit boards, allowing for more connections in a limited space.

No. of True Outputs: 10

Having 10 true outputs provides ample output options for data processing and distribution, making this product suitable for complex signal routing.

Maximum Power Supply Current (ICC): 55 mA

The maximum power supply current of 55mA indicates low power consumption, making this product energy-efficient and cost-effective to operate.

Technical Specifications

Clock Drivers & Buffers NB3L853141DTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

NB3

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

1.5 ns

Propagation Delay (tpd):

1.5 ns

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

700 MHz

Trade Compliance

NB3L853141DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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