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NB3L14SMNG

Onsemi

NB3L14SMNG by Onsemi

NB3L14SMNG clock driver by Onsemi features 8 true outputs with a max frequency of 300 MHz. It operates at an industrial temperature grade range from -40 to 85 °C and has a propagation delay of 0.6 ns. Ideal for applications requiring differential input conditioning, this chip carrier package with a very thin profile is surface mountable.

Median Price

$4.880

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 18,216 parts In-Stock

1+ parts

-

100+ parts

$4.800

1k+ parts

$4.390

10k+ parts

-

18,216

-

$4.800

$4.390

-

DigiKey

USA . 18,216 parts In-Stock

1+ parts

-

100+ parts

$4.960

1k+ parts

-

10k+ parts

-

18,216

-

$4.960

-

-

Rochester

USA . 18,188 parts In-Stock

1+ parts

-

100+ parts

$4.280

1k+ parts

$3.830

10k+ parts

$3.600

18,188

-

$4.280

$3.830

$3.600

Verical

USA . 18,188 parts In-Stock

1+ parts

-

100+ parts

$5.350

1k+ parts

$4.787

10k+ parts

$4.500

18,188

-

$5.350

$4.787

$4.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,465 parts In-Stock

1+ parts

$4.532

100+ parts

-

1k+ parts

-

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1,465

$4.532

-

-

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Vyrian

USA . 1,071 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$4.770

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,080 parts In-Stock

1+ parts

$4.293

100+ parts

-

1k+ parts

-

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2,080

$4.293

-

-

-

Corohmni

South Africa . 196 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

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196

$4.770

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 23,048 parts In-Stock

1+ parts

-

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23,048

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-

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Continental Prestige Electronics

USA . 18,371 parts In-Stock

1+ parts

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18,371

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-

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TANS Electronics

Latvia . 8,350 parts In-Stock

1+ parts

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8,350

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Problanco Electronics

Mexico . 7,426 parts In-Stock

1+ parts

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7,426

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Microchip USA

USA . 4,983 parts In-Stock

1+ parts

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4,983

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SupplyDigital Components

Austria . 3,786 parts In-Stock

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3,786

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Kulean Microsystems

USA . 1,806 parts In-Stock

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1,806

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UHIMA Technologies

Türkiye . 432 parts In-Stock

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432

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Overview

Enhance your electronic designs with the NB3L14SMNG clock driver by Onsemi! This top-notch product is designed to provide superior performance and reliability in a wide range of applications. With its differential input conditioning and quick propagation delay, this chip carrier boasts exceptional quality and precision. Whether you're working on industrial automation, telecommunications, or networking projects, this clock driver will deliver unmatched value and efficiency. Trust Onsemi to bring you cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on a PCB, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL

Provides better noise immunity and signal integrity, making it suitable for high-speed data transmission applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard voltage level, ensuring compatibility with most systems.

Propagation Delay (tpd): 0.6 ns

Offers fast signal processing speed, suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ideal for industrial applications.

Terminal Finish: Tin (Sn)

Provides good solderability and corrosion resistance, ensuring reliable connections.

Minimum Supply Voltage (Vsup): 2.375 V

Allows for operation at lower voltage levels, conserving power and extending battery life.

Temperature Grade: INDUSTRIAL

Designed to meet the stringent operating conditions of industrial environments.

Minimum fmax: 300 MHz

Supports high-frequency operation, suitable for demanding clocking applications.

Maximum Supply Voltage (Vsup): 2.625 V

Can handle higher voltage levels without damage, providing flexibility in power supply options.

Technical Specifications

Clock Drivers & Buffers NB3L14SMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Propagation Delay (tpd):

.6 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

300 MHz

Trade Compliance

NB3L14SMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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