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NB3L204KMNTXG

Onsemi

NB3L204KMNTXG by Onsemi

NB3L204KMNTXG clock driver by Onsemi features 1.4ns propagation delay, 8 true outputs, and 350MHz min fmax. Ideal for industrial applications requiring differential input conditioning and 3-STATE output characteristics in a compact square package.

Median Price

$5.330

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,059 parts In-Stock

1+ parts

$5.330

100+ parts

$3.408

1k+ parts

$3.061

10k+ parts

$2.960

5,059

$5.330

$3.408

$3.061

$2.960

Chip1Stop

Japan . 2,079 parts In-Stock

1+ parts

$5.370

100+ parts

$3.830

1k+ parts

$3.320

10k+ parts

-

2,079

$5.370

$3.830

$3.320

-

Mouser Electronics

USA . 6,635 parts In-Stock

1+ parts

$7.330

100+ parts

$4.410

1k+ parts

$3.160

10k+ parts

$3.030

6,635

$7.330

$4.410

$3.160

$3.030

Rochester

USA . 49,585 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

49,585

-

$2.800

$2.510

$2.360

Verical

USA . 43,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.087

10k+ parts

$2.900

43,700

-

-

$3.087

$2.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 3,300 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,300

$1.850

-

-

-

DF Sales Co.

USA . 3,300 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,300

$1.850

-

-

-

Digiode

USA . 566 parts In-Stock

1+ parts

$2.898

100+ parts

-

1k+ parts

-

10k+ parts

-

566

$2.898

-

-

-

Vyrian

USA . 1,148 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,148

$3.050

-

-

-

Chip Stock

USA . 811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

811

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 478 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

478

$1.850

-

-

-

Corphita

USA . 1,036 parts In-Stock

1+ parts

$2.745

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

$2.745

-

-

-

Microchip USA

USA . 4,094 parts In-Stock

1+ parts

$20.140

100+ parts

$20.010

1k+ parts

$19.950

10k+ parts

$19.890

4,094

$20.140

$20.010

$19.950

$19.890

Problanco Electronics

Mexico . 4,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,406

-

-

-

-

TANS Electronics

Latvia . 4,304 parts In-Stock

1+ parts

-

100+ parts

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-

10k+ parts

-

4,304

-

-

-

-

Continental Prestige Electronics

USA . 3,041 parts In-Stock

1+ parts

-

100+ parts

$3.670

1k+ parts

-

10k+ parts

-

3,041

-

$3.670

-

-

SupplyDigital Components

Austria . 2,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,221

-

-

-

-

Alle Elektronik GmbH

Germany . 1,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,644

-

-

-

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UHIMA Technologies

Türkiye . 568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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568

-

-

-

-

Kulean Microsystems

USA . 460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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460

-

-

-

-

Overview

Discover the NB3L204KMNTXG by Onsemi, a high-quality clock driver & buffer that offers unparalleled performance and reliability. With a focus on precision and efficiency, Onsemi has developed a product that is perfect for a wide range of applications, from telecommunications to industrial automation. The NB3L204KMNTXG provides customers with fast propagation delays, 3-state output characteristics, and a wide temperature range, making it an ideal choice for demanding environments. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Ease of installation on circuit boards, saves space, and allows for efficient heat dissipation.

Input Conditioning: DIFFERENTIAL

Provides better noise immunity and signal integrity in data transmission.

Package Shape: SQUARE

Space-efficient design for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 2.5

Suitable voltage for various applications without requiring any external voltage regulation.

Propagation Delay (tpd): 1.4 ns

Fast signal propagation for efficient data processing.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges.

Output Characteristics: 3-STATE

Allows for high impedance states which can help reduce power consumption in the circuit.

Width: 4 mm

Compact size for integration into small electronic devices or tight spaces.

Minimum Supply Voltage (Vsup): 2.375 V

Ensures proper functionality even at lower supply voltage levels.

Peak Reflow Temperature °C: 260

Can withstand high temperature reflow processes during manufacturing.

Technical Specifications

Clock Drivers & Buffers NB3L204KMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY

Family:

NB3

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.4 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

350 MHz

Trade Compliance

NB3L204KMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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