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MC10EL34DG

Onsemi

MC10EL34DG by Onsemi

MC10EL34DG by Onsemi is a clock driver/buffer with a propagation delay of 1.21 ns and operates at a nominal voltage of 5V. It is commonly used in industrial applications that require high-speed signal transmission and precise timing control.

Median Price

$6.042

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

1+ parts

$3.803

100+ parts

-

1k+ parts

-

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11

$3.803

-

-

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Chip1Stop

Japan . 7 parts In-Stock

1+ parts

$5.010

100+ parts

$4.950

1k+ parts

$4.940

10k+ parts

-

7

$5.010

$4.950

$4.940

-

Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$9.070

100+ parts

$6.340

1k+ parts

$5.710

10k+ parts

$5.580

63

$9.070

$6.340

$5.710

$5.580

DigiKey

USA . 133 parts In-Stock

1+ parts

$9.750

100+ parts

$6.753

1k+ parts

$6.006

10k+ parts

$5.877

133

$9.750

$6.753

$6.006

$5.877

Rochester

USA . 16,673 parts In-Stock

1+ parts

-

100+ parts

$5.370

1k+ parts

$4.800

10k+ parts

$4.520

16,673

-

$5.370

$4.800

$4.520

Verical

USA . 7,220 parts In-Stock

1+ parts

-

100+ parts

$6.713

1k+ parts

$6.000

10k+ parts

$5.650

7,220

-

$6.713

$6.000

$5.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 944 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

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944

$4.760

-

-

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Vyrian

USA . 6,854 parts In-Stock

1+ parts

-

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6,854

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-

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Flip Electronics

USA . 5,568 parts In-Stock

1+ parts

-

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5,568

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-

-

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Nova Conductors

Japan . 49 parts In-Stock

1+ parts

-

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49

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ComSIT Distribution GmbH

Germany . 48 parts In-Stock

1+ parts

-

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48

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ComSIT USA

USA . 48 parts In-Stock

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48

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Speed Components Ltd

Israel . 48 parts In-Stock

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-

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 19,369 parts In-Stock

1+ parts

$3.830

100+ parts

$6.060

1k+ parts

$5.480

10k+ parts

$5.480

19,369

$3.830

$6.060

$5.480

$5.480

Ampacity Inc.

Singapore . 3,833 parts In-Stock

1+ parts

$4.260

100+ parts

-

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3,833

$4.260

-

-

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Corphita

USA . 2,391 parts In-Stock

1+ parts

$4.509

100+ parts

-

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10k+ parts

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2,391

$4.509

-

-

-

Corohmni

South Africa . 186 parts In-Stock

1+ parts

$5.180

100+ parts

-

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-

10k+ parts

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186

$5.180

-

-

-

Microchip USA

USA . 2,720 parts In-Stock

1+ parts

$30.270

100+ parts

$29.840

1k+ parts

$29.620

10k+ parts

$29.400

2,720

$30.270

$29.840

$29.620

$29.400

Aztec Data Supply Inc.

USA . 206 parts In-Stock

1+ parts

$30.363

100+ parts

-

1k+ parts

-

10k+ parts

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206

$30.363

-

-

-

Continental Prestige Electronics

USA . 16,813 parts In-Stock

1+ parts

-

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16,813

-

-

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Kulean Microsystems

USA . 7,777 parts In-Stock

1+ parts

-

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7,777

-

-

-

-

TANS Electronics

Latvia . 6,768 parts In-Stock

1+ parts

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6,768

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-

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Problanco Electronics

Mexico . 6,730 parts In-Stock

1+ parts

-

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6,730

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SupplyDigital Components

Austria . 2,747 parts In-Stock

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2,747

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Argo Parts USA

USA . 2,700 parts In-Stock

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2,700

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UHIMA Technologies

Türkiye . 792 parts In-Stock

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792

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Aranea Global

USA . 50 parts In-Stock

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50

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Experience the power of precision with the MC10EL34DG clock driver by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in every product they produce. The MC10EL34DG is designed to provide seamless clocking solutions for your applications, ensuring optimal performance and accuracy. With its differential input conditioning and small outline package style, this clock driver offers convenience and versatility. Whether you're working on telecommunications, networking, or high-speed computing projects, the MC10EL34DG is the perfect choice. Trust Onsemi to deliver exceptional value, benefits, and advantages with the MC10EL34DG clock driver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the clock driver/buffer, making it a reliable choice.

Propagation Delay At Nominal Supply: 1.21 ns

With a low propagation delay of 1.21 ns, this clock driver/buffer ensures fast and efficient signal transmission, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable, this clock driver/buffer offers easy and convenient installation, saving valuable time during circuit assembly.

Input Conditioning: DIFFERENTIAL

The differential input conditioning of this clock driver/buffer enables noise cancellation and enhances signal integrity, ensuring accurate and reliable data transmission.

No. of Functions: 1

This clock driver/buffer with a single function simplifies the design and integration process, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient space utilization on the circuit board, allowing for compact and space-saving designs.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this clock driver/buffer operates within standard voltage ranges, making it compatible with common power supply configurations.

Power Supplies (V): -5.2

The -5.2V power supply option ensures compatibility with systems that require negative power sources, expanding the range of applications for this clock driver/buffer.

No. of Terminals: 16

With 16 terminals, this clock driver/buffer offers versatile connectivity options, facilitating integration into different circuit layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the product's versatility, making it suitable for use in various devices and systems without sacrificing space.

Propagation Delay (tpd): 1.2 ns

This clock driver/buffer's low propagation delay of 1.2 ns ensures minimal signal delay, enabling efficient and synchronous operations in time-sensitive applications.

Maximum Operating Temperature: 85 °C

The clock driver/buffer's maximum operating temperature of 85°C allows it to withstand high-temperature environments, ensuring reliable operation even under demanding conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this clock driver/buffer performs reliably in harsh and extreme temperature conditions, increasing its suitability for various industrial settings.

Terminal Finish: MATTE TIN

The terminal finish of matte tin provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection and extended product lifespan.

Terminal Position: DUAL

With a dual terminal position, this clock driver/buffer offers increased flexibility in circuit board layout and component placement, accommodating different design requirements.

Maximum Seated Height: 1.75 mm

The clock driver/buffer's maximum seated height of 1.75 mm allows for compact device design without compromising functionality or performance.

Width: 3.9 mm

With a width of 3.9 mm, this clock driver/buffer is space-efficient, making it ideal for applications where board space is limited.

Minimum Supply Voltage (Vsup): 4.2 V

With a minimum supply voltage of 4.2V, this clock driver/buffer can operate on lower power sources while maintaining its performance, increasing energy efficiency in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

The clock driver/buffer's ability to withstand a peak reflow temperature for up to 30 seconds simplifies the manufacturing process, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The clock driver/buffer's peak reflow temperature of 260°C allows for reliable soldering during assembly, ensuring robust electrical connections.

Length: 9.9 mm

With a length of 9.9 mm, this clock driver/buffer offers a compact form factor, enabling space-saving design and efficient circuit board layout.

Temperature Grade: INDUSTRIAL

The clock driver/buffer's industrial-grade temperature rating makes it suitable for use in rugged industrial environments, providing reliable performance in demanding conditions.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology used in this clock driver/buffer ensures high-speed and low-power operation, making it a suitable choice for applications requiring precise timing and high-performance.

Terminal Form: GULL WING

The gull-wing terminal form enhances the clock driver/buffer's mechanical strength and reliability, ensuring secure solder connections and improved durability.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this clock driver/buffer allows for precise and easy soldering during assembly, contributing to efficient manufacturing processes.

Maximum Same Edge Skew (tskwd): 0.05 ns

The clock driver/buffer's maximum same-edge skew of 0.05 ns ensures balanced signal timing, reducing signal distortion and improving overall system performance.

No. of True Outputs: 3

With three true outputs, this clock driver/buffer provides multiple paths for signal distribution, facilitating complex timing and data distribution applications.

Minimum fmax: 1100 MHz

The clock driver/buffer's minimum fmax of 1100 MHz ensures compatibility with high-frequency applications, delivering accurate and reliable timing signals.

Moisture Sensitivity Level (MSL): 1

This clock driver/buffer has a moisture sensitivity level of 1, indicating it can withstand ambient moisture without compromising its functionality or performance.

Maximum Supply Voltage (Vsup): 5.7 V

With a maximum supply voltage of 5.7V, this clock driver/buffer operates within a safe voltage range, ensuring reliable performance and protection for the device.

Technical Specifications

Clock Drivers & Buffers MC10EL34DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

1.21 ns

Propagation Delay (tpd):

1.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC10EL34DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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