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MC100LVEP11DG

Onsemi

MC100LVEP11DG by Onsemi

MC100LVEP11DG clock driver by Onsemi features 0.36ns propagation delay, 2.5V nominal voltage, and ECL technology. Ideal for applications requiring high-speed signal transmission in industrial environments with differential input conditioning and small outline package style.

Median Price

$5.700

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 84 parts In-Stock

1+ parts

$3.510

100+ parts

-

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84

$3.510

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$7.730

100+ parts

$5.320

1k+ parts

$5.010

10k+ parts

$5.000

2

$7.730

$5.320

$5.010

$5.000

DigiKey

USA . 62 parts In-Stock

1+ parts

$8.430

100+ parts

$5.552

1k+ parts

$5.118

10k+ parts

$5.014

62

$8.430

$5.552

$5.118

$5.014

Chip1Stop

Japan . 88 parts In-Stock

1+ parts

$17.100

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-

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88

$17.100

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Rochester

USA . 23,836 parts In-Stock

1+ parts

-

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$4.560

1k+ parts

$4.080

10k+ parts

$3.840

23,836

-

$4.560

$4.080

$3.840

Verical

USA . 17,188 parts In-Stock

1+ parts

-

100+ parts

$5.700

1k+ parts

$5.100

10k+ parts

$4.800

17,188

-

$5.700

$5.100

$4.800

Flip Electronics (Authorized)

USA . 2,488 parts In-Stock

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2,488

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Avnet

USA . 588 parts In-Stock

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$4.415

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588

-

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$4.415

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,640 parts In-Stock

1+ parts

$3.413

100+ parts

-

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1,640

$3.413

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Vyrian

USA . 3,746 parts In-Stock

1+ parts

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3,746

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Flip Electronics

USA . 2,488 parts In-Stock

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2,488

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Speed Components Ltd

Israel . 361 parts In-Stock

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361

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EMSNET

USA . 311 parts In-Stock

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311

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Prism Electronics

USA . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,917 parts In-Stock

1+ parts

$3.050

100+ parts

$2.974

1k+ parts

$2.958

10k+ parts

-

3,917

$3.050

$2.974

$2.958

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Ampacity Inc.

Singapore . 3,878 parts In-Stock

1+ parts

$3.050

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3,878

$3.050

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Corphita

USA . 187 parts In-Stock

1+ parts

$3.234

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187

$3.234

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Corohmni

South Africa . 393 parts In-Stock

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$3.593

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393

$3.593

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Aztec Data Supply Inc.

USA . 2,276 parts In-Stock

1+ parts

$22.410

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2,276

$22.410

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Microchip USA

USA . 1,303 parts In-Stock

1+ parts

$25.790

100+ parts

$25.420

1k+ parts

$25.240

10k+ parts

$25.050

1,303

$25.790

$25.420

$25.240

$25.050

Continental Prestige Electronics

USA . 22,230 parts In-Stock

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Problanco Electronics

Mexico . 8,185 parts In-Stock

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SupplyDigital Components

Austria . 7,805 parts In-Stock

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TANS Electronics

Latvia . 6,658 parts In-Stock

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Kulean Microsystems

USA . 3,752 parts In-Stock

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Kepictronics

USA . 3,642 parts In-Stock

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Perfect Parts

USA . 1,790 parts In-Stock

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Argo Parts USA

USA . 1,679 parts In-Stock

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UHIMA Technologies

Türkiye . 400 parts In-Stock

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Bastille Electronics

Australia . 97 parts In-Stock

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GreenTree Electronics

Israel . 88 parts In-Stock

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88

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Overview

Enhance your clocking applications with the MC100LVEP11DG from Onsemi, a leading manufacturer in the industry. This clock driver and buffer offers unparalleled quality and reliability, ensuring precise signal propagation and synchronization. Ideal for a wide range of applications, this product provides customers with enhanced performance and efficiency. With its advanced technology and industrial-grade design, the MC100LVEP11DG guarantees excellent value and benefits, making it a must-have for all your clocking needs. Elevate your projects with this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while providing protection to the internal components.

Propagation Delay At Nominal Supply: 0.36 ns

The low propagation delay ensures efficient and fast signal transmission, making this product ideal for high-speed clocking applications.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB, improving overall design flexibility.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and crosstalk, ensuring reliable and accurate signal processing.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V makes it compatible with a wide range of systems and devices, offering versatility in application.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in various industrial settings.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the product suitable for demanding clock driver applications.

Technical Specifications

Clock Drivers & Buffers MC100LVEP11DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.36 ns

Propagation Delay (tpd):

.31 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100LVEP11DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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