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MC100LVEL13DWG

Onsemi

MC100LVEL13DWG by Onsemi

MC100LVEL13DWG by Onsemi is a clock driver/buffer with 2 functions. It has a differential input conditioning and operates at a nominal voltage of 3.3V. This device, which uses ECL technology, is commonly used in industrial applications requiring precise timing control.

Median Price

$11.025

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 191 parts In-Stock

1+ parts

$15.250

100+ parts

$13.160

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191

$15.250

$13.160

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Rochester

USA . 4,032 parts In-Stock

1+ parts

-

100+ parts

$8.820

1k+ parts

$7.890

10k+ parts

$7.420

4,032

-

$8.820

$7.890

$7.420

DigiKey

USA . 4,032 parts In-Stock

1+ parts

-

100+ parts

$9.650

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4,032

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$9.650

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Farnell

UK . 4,032 parts In-Stock

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$12.829

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4,032

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$12.829

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Verical

USA . 3,686 parts In-Stock

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$11.025

1k+ parts

$9.863

10k+ parts

$9.275

3,686

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$11.025

$9.863

$9.275

Flip Electronics (Authorized)

USA . 836 parts In-Stock

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836

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Distributors (In-Stock)

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Digiode

USA . 1,373 parts In-Stock

1+ parts

$9.329

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1,373

$9.329

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Vyrian

USA . 2,459 parts In-Stock

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2,459

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Flip Electronics

USA . 836 parts In-Stock

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836

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Bristol Electronics

USA . 44 parts In-Stock

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44

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Speed Components Ltd

Israel . 20 parts In-Stock

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20

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PC Components Company LLC

USA . 5 parts In-Stock

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5

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Sunrise Surplus Inc.

USA . 5 parts In-Stock

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5

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Elcom Components

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Semicontronic

India . 2,547 parts In-Stock

1+ parts

$8.350

100+ parts

$8.141

1k+ parts

$8.100

10k+ parts

-

2,547

$8.350

$8.141

$8.100

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Corphita

USA . 86 parts In-Stock

1+ parts

$8.838

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86

$8.838

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Corohmni

South Africa . 176 parts In-Stock

1+ parts

$9.820

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176

$9.820

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Aztec Data Supply Inc.

USA . 1,950 parts In-Stock

1+ parts

$11.658

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1,950

$11.658

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Ampacity Inc.

Singapore . 2,489 parts In-Stock

1+ parts

$18.170

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2,489

$18.170

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Microchip USA

USA . 1,621 parts In-Stock

1+ parts

$44.070

100+ parts

$43.440

1k+ parts

$43.130

10k+ parts

$42.810

1,621

$44.070

$43.440

$43.130

$42.810

Lixinc

USA . 9,656 parts In-Stock

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9,656

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Kulean Microsystems

USA . 7,918 parts In-Stock

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7,918

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Continental Prestige Electronics

USA . 4,032 parts In-Stock

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4,032

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SupplyDigital Components

Austria . 2,470 parts In-Stock

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Problanco Electronics

Mexico . 1,870 parts In-Stock

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TANS Electronics

Latvia . 1,510 parts In-Stock

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Argo Parts USA

USA . 1,462 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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870

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Speed Components Ltd (Excess)

Israel . 867 parts In-Stock

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867

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UHIMA Technologies

Türkiye . 493 parts In-Stock

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493

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Perfect Parts

USA . 127 parts In-Stock

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127

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ChipTracer

USA . 39 parts In-Stock

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39

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Overview

Experience superior clock driving performance with the MC100LVEL13DWG by Onsemi. As a leading manufacturer in the industry, Onsemi is known for its exceptional quality and reliability. The MC100LVEL13DWG belongs to the clock drivers & buffers category, offering versatile applications and seamless functionality. With its differential input conditioning and open-emitter output characteristics, this product delivers unbeatable precision and efficiency. Its small outline package style and wide operating temperature range make it perfect for industrial use. Upgrade your clock driving experience with the MC100LVEL13DWG and enjoy enhanced performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and facilitating automated assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, compatible with many electronic systems.

Propagation Delay (tpd): 0.62 ns

Offers fast signal propagation, aiding in precise timing operations.

Maximum Operating Temperature: 85 °C

Can withstand relatively high temperatures, suitable for industrial environments.

Width: 7.5 mm

Compact size allows for efficient use of space on circuit boards.

Technology: ECL

Uses emitter-coupled logic technology, known for high-speed operation and low power consumption.

Technical Specifications

Clock Drivers & Buffers MC100LVEL13DWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: 0V VCC WITH VEE = -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay (tpd):

.62 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC100LVEL13DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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