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MC100EP139DTG

Onsemi

MC100EP139DTG by Onsemi

MC100EP139DTG clock driver by Onsemi features 1.1ns propagation delay, operates at -40 to 85°C, and supports differential input conditioning. Ideal for industrial applications requiring precise timing synchronization in a compact thin profile package with 20 terminals.

Median Price

$15.712

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,618 parts In-Stock

1+ parts

$63.600

100+ parts

$29.800

1k+ parts

$19.800

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-

1,618

$63.600

$29.800

$19.800

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Rochester

USA . 9,858 parts In-Stock

1+ parts

-

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$12.250

1k+ parts

$10.960

10k+ parts

$10.310

9,858

-

$12.250

$10.960

$10.310

DigiKey

USA . 9,858 parts In-Stock

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-

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$16.110

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9,858

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$16.110

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Verical

USA . 6,778 parts In-Stock

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-

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$15.313

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$13.700

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$12.887

6,778

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$15.313

$13.700

$12.887

Distributors (In-Stock)

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Bristol Electronics

USA . 17 parts In-Stock

1+ parts

$9.750

100+ parts

$6.581

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17

$9.750

$6.581

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Digiode

USA . 283 parts In-Stock

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$12.948

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283

$12.948

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Nova Conductors

Japan . 21 parts In-Stock

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$13.310

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21

$13.310

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NAC Semi

USA . 60 parts In-Stock

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$15.010

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60

$15.010

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Flip Electronics

USA . 6,975 parts In-Stock

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6,975

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Vyrian

USA . 4,691 parts In-Stock

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4,691

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Semi Source

USA . 338 parts In-Stock

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338

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Resion

USA . 96 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 75 parts In-Stock

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75

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Prism Electronics

USA . 46 parts In-Stock

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46

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Microfarads

USA . 26 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 23 parts In-Stock

1+ parts

$10.240

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23

$10.240

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Ampacity Inc.

Singapore . 4,682 parts In-Stock

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$11.590

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4,682

$11.590

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Corphita

USA . 1,173 parts In-Stock

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$12.267

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1,173

$12.267

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$13.310

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$12.645

10k+ parts

$12.378

2,000

$13.310

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$12.645

$12.378

Corohmni

South Africa . 199 parts In-Stock

1+ parts

$13.630

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199

$13.630

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Microchip USA

USA . 2,575 parts In-Stock

1+ parts

$50.230

100+ parts

$49.360

1k+ parts

$48.920

10k+ parts

$48.480

2,575

$50.230

$49.360

$48.920

$48.480

Lixinc

USA . 17,702 parts In-Stock

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Perfect Parts

USA . 14,262 parts In-Stock

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Kulean Microsystems

USA . 4,910 parts In-Stock

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Argo Parts USA

USA . 4,646 parts In-Stock

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TANS Electronics

Latvia . 3,770 parts In-Stock

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SupplyDigital Components

Austria . 1,767 parts In-Stock

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GreenTree Electronics

Israel . 1,723 parts In-Stock

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Authorized Procurement Solutions

USA . 1,623 parts In-Stock

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Problanco Electronics

Mexico . 73 parts In-Stock

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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Overview

Elevate your clock signal performance with the MC100EP139DTG by Onsemi. Designed with precision and reliability in mind, this clock driver offers unparalleled quality and efficiency for a wide range of applications. With its advanced technology and industrial-grade construction, this product ensures optimal functionality and seamless operation. Experience the value and benefits of Onsemi's clock drivers and buffers, and elevate your electronic designs to new heights. Choose the MC100EP139DTG for superior performance and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, increasing the longevity of the product.

Propagation Delay At Nominal Supply: 1.1 ns

Offers fast signal propagation, ensuring efficient and timely clock distribution.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Enhances noise immunity and signal integrity, enabling reliable performance in high-frequency applications.

Nominal Supply Voltage / Vsup (V): 3.3

Matches common voltage requirements in electronic systems, ensuring compatibility with various power sources.

Power Supplies (V): -3.0/-5.5/3.3/5.0

Supports a wide range of power supply options, providing flexibility in system design.

No. of Terminals: 20

Allows for multiple connection points, facilitating integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables space-efficient packaging and easy PCB layout, optimizing the overall design of the system.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a variety of environmental conditions, making it suitable for industrial applications.

Minimum Supply Voltage (Vsup): 3 V

Has a low minimum supply voltage requirement, allowing for power-efficient operation.

Technical Specifications

Clock Drivers & Buffers MC100EP139DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC100EP139DTG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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