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MC10EL11DG

Onsemi

MC10EL11DG by Onsemi

MC10EL11DG clock driver by Onsemi features 0.385ns propagation delay, 5V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring differential input conditioning and small outline package style.

Median Price

$2.674

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 29 parts In-Stock

1+ parts

$4.410

100+ parts

$2.820

1k+ parts

$2.600

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$2.520

29

$4.410

$2.820

$2.600

$2.520

DigiKey

USA . 19 parts In-Stock

1+ parts

$4.770

100+ parts

$3.031

1k+ parts

$2.769

10k+ parts

$2.634

19

$4.770

$3.031

$2.769

$2.634

Flip Electronics (Authorized)

USA . 14,798 parts In-Stock

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Verical

USA . 10,976 parts In-Stock

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$2.442

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Avnet

USA . 258 parts In-Stock

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$2.624

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$2.499

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$2.427

258

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$2.499

$2.427

Arrow

USA . 24 parts In-Stock

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$2.674

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$2.467

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24

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$2.674

$2.467

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$2.754

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10

$2.754

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Digiode

USA . 1,862 parts In-Stock

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$4.930

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$4.930

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Flip Electronics

USA . 9,800 parts In-Stock

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Vyrian

USA . 4,315 parts In-Stock

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Quantum Digital Technology

USA . 3,924 parts In-Stock

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Sensible Micro Corp

USA . 3,567 parts In-Stock

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J2 Sourcing AB

Sweden . 1,332 parts In-Stock

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Elcom Components

USA . 250 parts In-Stock

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NAC Semi

USA . 196 parts In-Stock

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$13.650

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$12.410

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196

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$13.650

$12.410

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,157 parts In-Stock

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$2.754

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$2.699

6,157

$2.754

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$2.699

Argo Parts USA

USA . 2,975 parts In-Stock

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$2.754

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2,975

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Netroflash

USA . 500 parts In-Stock

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$2.754

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$2.754

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Ampacity Inc.

Singapore . 3,736 parts In-Stock

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$4.410

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Corphita

USA . 1,163 parts In-Stock

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$4.671

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Corohmni

South Africa . 138 parts In-Stock

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$5.190

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Microchip USA

USA . 1,514 parts In-Stock

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$15.260

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$22.924

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$20.861

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$18.798

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$22.924

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$18.798

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Aztec Data Supply Inc.

USA . 1,864 parts In-Stock

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$25.187

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TANS Electronics

Latvia . 7,353 parts In-Stock

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Kulean Microsystems

USA . 7,163 parts In-Stock

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Problanco Electronics

Mexico . 7,043 parts In-Stock

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SupplyDigital Components

Austria . 3,356 parts In-Stock

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UHIMA Technologies

Türkiye . 482 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Overview

Enhance your electronic designs with the MC10EL11DG clock driver by Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by professionals worldwide. The MC10EL11DG is a versatile solution for clock distribution and signal buffering applications, offering fast propagation delay and differential input conditioning for optimal performance. With its compact package style and industrial temperature grade, this product provides value through efficient operation and long-term durability. Upgrade your projects with the MC10EL11DG and experience the benefits of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, making it suitable for various applications.

Propagation Delay At Nominal Supply: 0.385 ns

This low propagation delay ensures efficient signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable, this product offers easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL

The use of differential input conditioning helps in reducing noise and interference, enhancing the overall signal quality.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption, making this product efficient for various applications.

Technical Specifications

Clock Drivers & Buffers MC10EL11DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -4.2V TO -5.7V

Family:

10EL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

.385 ns

Propagation Delay (tpd):

.34 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL11DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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