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MC100LVEP14DTG

Onsemi

MC100LVEP14DTG by Onsemi

MC100LVEP14DTG clock driver by Onsemi features 0.525ns propagation delay, 2.5V nominal voltage, and 2000MHz min fmax. Ideal for industrial applications requiring differential mux input conditioning in a small outline package with -40 to 85°C operating temperature range.

Median Price

$7.034

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Rochester

USA . 158 parts In-Stock

1+ parts

$6.420

100+ parts

$6.030

1k+ parts

$5.460

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$6.420

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$5.460

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Mouser Electronics

USA . 161 parts In-Stock

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$10.430

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$6.810

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$6.460

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$6.260

161

$10.430

$6.810

$6.460

$6.260

DigiKey

USA . 100 parts In-Stock

1+ parts

$10.430

100+ parts

$7.063

1k+ parts

$6.462

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$6.316

100

$10.430

$7.063

$6.462

$6.316

Verical

USA . 975 parts In-Stock

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$5.811

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$5.811

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Avnet

USA . 75 parts In-Stock

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Arrow

USA . 75 parts In-Stock

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$7.034

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$6.252

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$6.050

75

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$6.252

$6.050

Distributors (In-Stock)

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Digiode

USA . 2,038 parts In-Stock

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$6.099

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$6.099

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Nova Conductors

Japan . 15 parts In-Stock

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$6.611

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$6.611

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TEDSS.com

USA . 19 parts In-Stock

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$10.000

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$10.000

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Chip Stock

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Vyrian

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Flip Electronics

USA . 750 parts In-Stock

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750

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Speed Components Ltd

Israel . 310 parts In-Stock

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310

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NAC Semi

USA . 150 parts In-Stock

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$13.490

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$12.140

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150

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$13.490

$12.140

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ACDS - Activité Composants Distribution Service

France . 61 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 49 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 32 parts In-Stock

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Connect4Technologies Inc.

Canada . 21 parts In-Stock

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Semi Source

USA . 20 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 11 parts In-Stock

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Semtec, LLC

USA . 10 parts In-Stock

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Flex Direct, LLC

USA . 10 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 228 parts In-Stock

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$5.460

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Semicontronic

India . 193 parts In-Stock

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$5.460

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$5.324

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$5.296

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Corphita

USA . 2,186 parts In-Stock

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$5.778

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Corohmni

South Africa . 475 parts In-Stock

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$6.145

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475

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Continental Prestige Electronics

USA . 2,589 parts In-Stock

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$6.401

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$6.273

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Aranea Global

USA . 100 parts In-Stock

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$6.479

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$6.220

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$6.479

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Aztec Data Supply Inc.

USA . 282 parts In-Stock

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$8.030

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Microchip USA

USA . 2,344 parts In-Stock

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$32.650

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$32.180

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$31.950

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$31.720

2,344

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$32.180

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$31.720

iodParts Technologies Inc.

India . 15,000 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 8,085 parts In-Stock

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Problanco Electronics

Mexico . 6,298 parts In-Stock

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Kulean Microsystems

USA . 3,708 parts In-Stock

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SupplyDigital Components

Austria . 2,918 parts In-Stock

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Argo Parts USA

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UHIMA Technologies

Türkiye . 759 parts In-Stock

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Kepictronics

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Overview

The MC100LVEP14DTG by Onsemi is a top-of-the-line Clock Driver & Buffer that offers unparalleled quality and performance. With a wide range of applications, this product provides customers with reliable and efficient clock distribution solutions. Designed with precision and expertise, Onsemi ensures that every aspect of the MC100LVEP14DTG meets the highest industry standards. Experience the benefits of fast propagation delay, low power consumption, and exceptional temperature tolerance. Trust Onsemi to deliver cutting-edge technology that enhances your projects and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 0.525 ns

Low propagation delay ensures fast signal processing and high-speed operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning provides accurate and reliable signal transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for efficient and stable performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for various environments.

Maximum Seated Height: 1.2 mm

Low profile design allows for compact and space-saving installations.

Width: 4.4 mm

Compact width enables easy integration into tight spaces or crowded circuit boards.

Technology: ECL

ECL technology offers high-speed and low-power consumption benefits.

No. of True Outputs: 5

Multiple true outputs provide flexibility in signal routing and processing.

Technical Specifications

Clock Drivers & Buffers MC100LVEP14DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.525 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

2000 MHz

Trade Compliance

MC100LVEP14DTG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-590-9896, 5962015909896, 5962-01-576-9019, 5962015769019

NIIN

015909896, 015769019

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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