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MC100LVEP34DTG

Onsemi

MC100LVEP34DTG by Onsemi

MC100LVEP34DTG clock driver by Onsemi offers 0.8 ns propagation delay, 3 true outputs at 2800 MHz. Ideal for industrial applications requiring differential input conditioning and a supply voltage range of +-2.375V to +-3.8V in a small outline package with dual terminals.

Median Price

$11.722

Lifecycle Status

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Chip1Stop

Japan . 6 parts In-Stock

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$9.470

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Arrow

USA . 50 parts In-Stock

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$11.722

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$8.191

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$11.722

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Mouser Electronics

USA . 158 parts In-Stock

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$14.030

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$10.090

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$9.650

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$14.030

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DigiKey

USA . 54 parts In-Stock

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$15.220

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$10.394

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$9.660

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Flip Electronics (Authorized)

USA . 6,336 parts In-Stock

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Verical

USA . 576 parts In-Stock

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$8.805

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Digiode

USA . 1,170 parts In-Stock

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$8.350

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Nova Conductors

Japan . 15 parts In-Stock

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$10.424

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$10.424

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NAC Semi

USA . 54 parts In-Stock

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$11.400

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Flip Electronics

USA . 6,336 parts In-Stock

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Vyrian

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Cyclops Electronics Ltd

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LWI Electronics Inc

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Inventory MP

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Bristol Electronics

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Corphita

USA . 2,101 parts In-Stock

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$7.911

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Semicontronic

India . 1,174 parts In-Stock

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$8.050

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$7.849

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$7.808

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$7.808

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Ampacity Inc.

Singapore . 927 parts In-Stock

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$8.050

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Corohmni

South Africa . 138 parts In-Stock

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$8.380

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Continental Prestige Electronics

USA . 6,580 parts In-Stock

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$9.869

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$9.671

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Netroflash

USA . 100 parts In-Stock

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$10.424

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Aztec Data Supply Inc.

USA . 1,418 parts In-Stock

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Advanced Electronics

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$37.749

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$34.352

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$30.954

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Microchip USA

USA . 2,483 parts In-Stock

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Problanco Electronics

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TANS Electronics

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Argo Parts USA

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Lixinc

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Perfect Parts

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SupplyDigital Components

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GreenTree Electronics

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UHIMA Technologies

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Kepictronics

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Overview

Unlock the power of precision clocking with the MC100LVEP34DTG by Onsemi. Crafted with superior quality and expertise, this clock driver offers unparalleled performance in clock distribution applications. With ultra-fast propagation delay of just 0.8 ns and differential input conditioning, this device ensures precise synchronization in your systems. Perfect for industrial-grade environments, the MC100LVEP34DTG guarantees reliable operation from -40 to 85°C. Experience seamless integration and enhance the efficiency of your designs with this advanced clock driver from Onsemi. Elevate your projects with the MC100LVEP34DTG today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

This low propagation delay ensures fast and efficient operation of the clock driver.

Surface Mount

Surface mount design allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V)

Operates at a standard voltage level, compatible with many systems.

Maximum Operating Temperature

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature

Operates reliably even in extreme cold temperatures.

Technology

Uses Emitter-Coupled Logic technology for high-speed and low-power consumption.

Technical Specifications

Clock Drivers & Buffers MC100LVEP34DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Propagation Delay At Nominal Supply:

.85 ns

Propagation Delay (tpd):

.8 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

2800 MHz

Trade Compliance

MC100LVEP34DTG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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