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LMK00301SQ/NOPB

Texas Instruments

LMK00301SQ/NOPB by Texas Instruments

LMK00301SQ/NOPB by Texas Instruments is a Clock Driver & Buffer with 48 terminals, operating at 3.3V. It features a propagation delay of 2.7ns and output characteristics in 3-STATE mode. Ideal for industrial applications requiring differential mux input conditioning and a peak reflow temperature of 260°C.

Median Price

$9.719

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 18,401 parts In-Stock

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$8.268

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$7.222

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$4.981

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18,401

$8.268

$7.222

$4.981

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DigiKey

USA . 2,479 parts In-Stock

1+ parts

$11.170

100+ parts

$7.474

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$6.808

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-

2,479

$11.170

$7.474

$6.808

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Mouser Electronics

USA . 657 parts In-Stock

1+ parts

$11.170

100+ parts

$7.460

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$6.800

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657

$11.170

$7.460

$6.800

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Avnet

USA . 1,000 parts In-Stock

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$6.890

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$5.957

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$5.957

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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$7.470

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$7.470

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Digiode

USA . 4,210 parts In-Stock

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$7.855

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4,210

$7.855

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Chip Stock

USA . 27,610 parts In-Stock

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Vyrian

USA . 7,550 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Andel Nordic

Denmark . 2,825 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

$4.123

10k+ parts

$4.123

2,825

$4.294

-

$4.123

$4.123

Semicontronic

India . 7,631 parts In-Stock

1+ parts

$7.030

100+ parts

$6.854

1k+ parts

$6.819

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7,631

$7.030

$6.854

$6.819

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.321

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-

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$7.028

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100

$7.321

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$7.028

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Corphita

USA . 3,953 parts In-Stock

1+ parts

$7.441

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3,953

$7.441

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Continental Prestige Electronics

USA . 4,804 parts In-Stock

1+ parts

$7.470

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$7.321

4,804

$7.470

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$7.321

Corohmni

South Africa . 199 parts In-Stock

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$7.660

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199

$7.660

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Component Stockers USA

USA . 505 parts In-Stock

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$11.510

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$8.610

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505

$11.510

$8.610

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Parana Technologies

USA . 1,348 parts In-Stock

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$11.608

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$12.006

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$12.006

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DigiPath Technology Company

USA . 1,392 parts In-Stock

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$12.782

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ChromeModa Solutions

Germany . 4,465 parts In-Stock

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$13.043

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$10.695

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$13.043

$10.695

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$13.043

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$12.391

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$11.739

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$13.043

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$11.739

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Ampacity Inc.

Singapore . 7,370 parts In-Stock

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$15.300

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Kepictronics

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A-Z Elektronik GmbH

Germany . 11,525 parts In-Stock

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Lixinc

USA . 10,994 parts In-Stock

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Futuretech Components

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Alle Elektronik GmbH

Germany . 3,915 parts In-Stock

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Argo Parts USA

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Benley Electronics

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S.R.D Solutions

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Perfect Parts

USA . 473 parts In-Stock

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Overview

Enhance your electronic designs with the LMK00301SQ/NOPB clock driver by Texas Instruments. Known for their top-quality components, Texas Instruments delivers reliable products that meet the highest industry standards. Clock drivers and buffers are essential in various applications such as data communications, networking, and industrial automation. With a wide range of features and benefits, this square package chip carrier offers exceptional performance with minimal power consumption, making it the ideal choice for your next project. Elevate your designs with the precision and reliability of Texas Instruments.

Feature Benefit Bullets

Surface Mount : YES

Surface mount technology makes this product easy to integrate into PCB designs, saving space and reducing assembly time.

Input Conditioning : DIFFERENTIAL MUX

The use of a differential multiplexer for input conditioning ensures high signal integrity and noise immunity, enhancing the performance of the clock driver.

Nominal Supply Voltage / Vsup (V) : 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic systems, making this clock driver compatible with a wide range of applications.

Propagation Delay (tpd) : 2.7 ns

The low propagation delay of 2.7 ns ensures fast and efficient signal transmission, making this clock driver suitable for high-speed applications.

Maximum Operating Temperature : 85 °C

With a maximum operating temperature of 85°C, this clock driver can withstand harsh environmental conditions, increasing its reliability and longevity.

Minimum Operating Temperature : -40 °C

The clock driver can operate in extremely cold temperatures as low as -40°C, making it suitable for a wide range of industrial and automotive applications.

Maximum Power Supply Current (ICC) : 13.5 mA

This clock driver consumes low power with a maximum supply current of 13.5 mA, making it energy-efficient and reducing overall system power consumption.

Technical Specifications

Clock Drivers & Buffers LMK00301SQ/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

00301

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

13.5 mA

Propagation Delay (tpd):

2.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Minimum fmax:

400 MHz

Trade Compliance

LMK00301SQ/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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