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CDCM61001RHBT

Texas Instruments

CDCM61001RHBT by Texas Instruments

CDCM61001RHBT clock driver by Texas Instruments operates at 3.3V with load capacitance of 5pF. It features a package style of CHIP CARRIER, suitable for industrial applications. With a max frequency of 683.28MHz, it is ideal for high-speed signal conditioning in electronic systems.

Median Price

$4.663

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,215 parts In-Stock

1+ parts

$4.663

100+ parts

$3.801

1k+ parts

$2.534

10k+ parts

-

28,215

$4.663

$3.801

$2.534

-

Mouser Electronics

USA . 620 parts In-Stock

1+ parts

$6.870

100+ parts

$4.910

1k+ parts

$3.920

10k+ parts

-

620

$6.870

$4.910

$3.920

-

DigiKey

USA . 53 parts In-Stock

1+ parts

$7.150

100+ parts

$4.646

1k+ parts

$4.236

10k+ parts

$4.122

53

$7.150

$4.646

$4.236

$4.122

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

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$3.174

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250

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$3.174

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Rochester

USA . 14 parts In-Stock

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-

100+ parts

$3.650

1k+ parts

$3.260

10k+ parts

$3.070

14

-

$3.650

$3.260

$3.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,381 parts In-Stock

1+ parts

$3.344

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-

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2,381

$3.344

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Nova Conductors

Japan . 900 parts In-Stock

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$4.163

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900

$4.163

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Vyrian

USA . 5,972 parts In-Stock

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5,972

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Chip Stock

USA . 1,108 parts In-Stock

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1,108

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Goldney Electronics S.L.

Spain . 80 parts In-Stock

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80

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Speed Components Ltd

Israel . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,753 parts In-Stock

1+ parts

$2.700

100+ parts

$2.632

1k+ parts

$2.619

10k+ parts

-

5,753

$2.700

$2.632

$2.619

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Ampacity Inc.

Singapore . 5,705 parts In-Stock

1+ parts

$2.700

100+ parts

-

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5,705

$2.700

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Corphita

USA . 3,082 parts In-Stock

1+ parts

$3.168

100+ parts

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3,082

$3.168

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Corohmni

South Africa . 871 parts In-Stock

1+ parts

$3.890

100+ parts

-

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871

$3.890

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Continental Prestige Electronics

USA . 2,448 parts In-Stock

1+ parts

$4.163

100+ parts

-

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10k+ parts

$4.080

2,448

$4.163

-

-

$4.080

Argo Parts USA

USA . 370 parts In-Stock

1+ parts

$4.163

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-

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370

$4.163

-

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Andel Nordic

Denmark . 4,399 parts In-Stock

1+ parts

$7.952

100+ parts

-

1k+ parts

$7.634

10k+ parts

$7.634

4,399

$7.952

-

$7.634

$7.634

Parana Technologies

USA . 1,888 parts In-Stock

1+ parts

$16.716

100+ parts

-

1k+ parts

$16.970

10k+ parts

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1,888

$16.716

-

$16.970

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ChromeModa Solutions

Germany . 4,281 parts In-Stock

1+ parts

$18.782

100+ parts

$15.401

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-

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4,281

$18.782

$15.401

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IDEA Electronic Components Group

UK . 2,360 parts In-Stock

1+ parts

$18.782

100+ parts

$17.843

1k+ parts

$16.904

10k+ parts

-

2,360

$18.782

$17.843

$16.904

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Microchip USA

USA . 7,681 parts In-Stock

1+ parts

$28.840

100+ parts

$28.660

1k+ parts

$28.570

10k+ parts

$28.490

7,681

$28.840

$28.660

$28.570

$28.490

Lixinc

USA . 13,411 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,445 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,963 parts In-Stock

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Perfect Parts

USA . 3,737 parts In-Stock

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3,737

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DigiPath Technology Company

USA . 744 parts In-Stock

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$16.934

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744

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$16.934

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Formix International (Excess)

India . 4 parts In-Stock

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4

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Overview

Elevate your electronic designs with the CDCM61001RHBT clock driver & buffer from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable solutions for a wide range of applications. This versatile chip carrier offers seamless integration with its surface mount design and input conditioning capabilities. With a wide temperature range and low supply voltage requirements, this clock driver provides exceptional performance and value to customers looking for precision timing solutions. Trust Texas Instruments to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature enables easy and efficient assembly onto circuit boards, saving time and space.

Input Conditioning: MUX

The input conditioning MUX allows for versatile signal processing, enhancing the product's compatibility with various systems.

Package Shape: SQUARE

The square package shape provides a compact design, making it suitable for space-constrained applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures efficient power consumption and compatibility with common voltage standards.

Load Capacitance (CL): 5 pF

The low load capacitance of 5 pF enhances signal integrity and minimizes delays in signal transmission.

No. of Terminals: 32

The 32 terminals offer ample connectivity options, accommodating multiple input and output channels.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package styles provide effective heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and simplifies installation processes.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for slim and compact device designs.

Width: 5 mm

The width of 5 mm enables the product to fit within narrow spaces and compact layouts.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and efficient soldering processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures thorough soldering and reliable connections.

Length: 5 mm

The length of 5 mm allows for a compact and space-efficient product design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations and enhances the product's sustainability.

Packing Method: TR

The TR packing method provides secure packaging for transportation and storage, preventing damage during handling.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm offers precise and efficient connections, ideal for high-density circuit layouts.

Minimum fmax: 683.28 MHz

The minimum fmax frequency of 683.28 MHz ensures high-speed signal processing and low latency.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates the product's resistance to moisture-related damage, enhancing long-term reliability.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safety margin for voltage fluctuations, ensuring stable operation.

Technical Specifications

Clock Drivers & Buffers CDCM61001RHBT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

61001

Input Conditioning:

MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

683.28 MHz

Trade Compliance

CDCM61001RHBT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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