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CDCM1804RGER

Texas Instruments

CDCM1804RGER by Texas Instruments

CDCM1804RGER clock driver by Texas Instruments features a propagation delay of 0.8ns, operating temperature range of -40 to 85°C, and 3-state output characteristics. Ideal for applications requiring differential input conditioning, this chip carrier with a very thin profile has 24 terminals and supports a max frequency of 800MHz.

Median Price

$9.050

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,143 parts In-Stock

1+ parts

$9.050

100+ parts

$7.905

1k+ parts

$5.452

10k+ parts

-

18,143

$9.050

$7.905

$5.452

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,198 parts In-Stock

1+ parts

$8.598

100+ parts

-

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3,198

$8.598

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Chip Stock

USA . 3,366 parts In-Stock

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3,366

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Vyrian

USA . 2,387 parts In-Stock

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2,387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 400 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

$0.365

400

$0.380

-

-

$0.365

Northwest PG Solutions

USA . 975 parts In-Stock

1+ parts

$0.418

100+ parts

-

1k+ parts

-

10k+ parts

$0.369

975

$0.418

-

-

$0.369

Andel Nordic

Denmark . 3,005 parts In-Stock

1+ parts

$4.272

100+ parts

-

1k+ parts

$4.102

10k+ parts

$4.102

3,005

$4.272

-

$4.102

$4.102

AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$8.030

100+ parts

-

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679

$8.030

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Corphita

USA . 1,246 parts In-Stock

1+ parts

$8.145

100+ parts

-

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1,246

$8.145

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Parana Technologies

USA . 138 parts In-Stock

1+ parts

$21.273

100+ parts

-

1k+ parts

$21.582

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138

$21.273

-

$21.582

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$23.424

100+ parts

$21.550

1k+ parts

-

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1,920

$23.424

$21.550

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ChromeModa Solutions

Germany . 5,978 parts In-Stock

1+ parts

$23.902

100+ parts

$19.600

1k+ parts

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10k+ parts

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5,978

$23.902

$19.600

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$23.902

100+ parts

$22.707

1k+ parts

$21.512

10k+ parts

-

1,557

$23.902

$22.707

$21.512

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QUARKTWIN TECHNOLOGY LTD

USA . 24,383 parts In-Stock

1+ parts

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A-Z Elektronik GmbH

Germany . 5,022 parts In-Stock

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5,022

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Alle Elektronik GmbH

Germany . 3,348 parts In-Stock

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3,348

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Metaverse IC Inc.

Canada . 2,971 parts In-Stock

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2,971

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Kepictronics

USA . 2,905 parts In-Stock

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2,905

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Lixinc

USA . 1,039 parts In-Stock

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1,039

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Discover the CDCM1804RGER clock driver & buffer by Texas Instruments, setting the standard for quality and reliability in the industry. With a wide range of applications, this product offers unmatched precision and performance. Designed with advanced features and cutting-edge technology, it provides customers with the value and benefits they need for their projects. Trust Texas Instruments to deliver excellence, choose the CDCM1804RGER for all your clocking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good protection for the internal components of the clock driver/buffer, ensuring durability and reliability.

Propagation Delay At Nominal Supply: 0.8 ns

The low propagation delay ensures that signals are transmitted quickly and accurately, making this clock driver/buffer suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the clock driver/buffer onto circuit boards, saving time and space during assembly.

Input Conditioning: DIFFERENTIAL

The use of differential input conditioning helps to reduce noise and interference in signal transmission, leading to improved overall signal integrity.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is a common and widely supported power level in many electronic systems, making integration of this clock driver/buffer seamless.

Technical Specifications

Clock Drivers & Buffers CDCM1804RGER attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

3 LVPECL DIFFERENTIAL CLOCK OUTPUTS AND SINGLE ENDED LVCMOS OUTPUT

Family:

1803

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.8 ns

Propagation Delay (tpd):

2.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCM1804RGER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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