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CDCLVD2102RGTR

Texas Instruments

CDCLVD2102RGTR by Texas Instruments

CDCLVD2102RGTR by Texas Instruments is a clock driver with 2.5 ns propagation delay at 2.5V, suitable for industrial applications. It features differential input conditioning, operates at a temperature range of -40 to 85 °C, and has a max supply voltage of 2.625V. This chip carrier package with 16 terminals offers a max operating frequency of 800 MHz and low same edge skew of 0.015 ns for precise timing requirements.

Median Price

$7.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,909 parts In-Stock

1+ parts

$7.450

100+ parts

$4.870

1k+ parts

$4.410

10k+ parts

$4.260

1,909

$7.450

$4.870

$4.410

$4.260

DigiKey

USA . 1,083 parts In-Stock

1+ parts

$7.450

100+ parts

$4.868

1k+ parts

$4.401

10k+ parts

$4.265

1,083

$7.450

$4.868

$4.401

$4.265

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.158

100+ parts

-

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500

$4.158

-

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Digiode

USA . 2,170 parts In-Stock

1+ parts

$6.242

100+ parts

-

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2,170

$6.242

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Vyrian

USA . 1,013 parts In-Stock

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1,013

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Chip Stock

USA . 725 parts In-Stock

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725

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,430 parts In-Stock

1+ parts

$4.158

100+ parts

-

1k+ parts

-

10k+ parts

$4.075

5,430

$4.158

-

-

$4.075

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.158

100+ parts

$4.075

1k+ parts

-

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-

2,000

$4.158

$4.075

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Argo Parts USA

USA . 1,552 parts In-Stock

1+ parts

$4.158

100+ parts

-

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1,552

$4.158

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Ampacity Inc.

Singapore . 798 parts In-Stock

1+ parts

$5.580

100+ parts

-

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798

$5.580

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Corphita

USA . 2,553 parts In-Stock

1+ parts

$5.913

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2,553

$5.913

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Andel Nordic

Denmark . 5,669 parts In-Stock

1+ parts

$9.571

100+ parts

-

1k+ parts

$9.188

10k+ parts

$9.188

5,669

$9.571

-

$9.188

$9.188

Parana Technologies

USA . 1,268 parts In-Stock

1+ parts

$12.570

100+ parts

-

1k+ parts

$13.023

10k+ parts

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1,268

$12.570

-

$13.023

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ChromeModa Solutions

Germany . 869 parts In-Stock

1+ parts

$14.124

100+ parts

$11.582

1k+ parts

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869

$14.124

$11.582

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IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$14.124

100+ parts

$13.418

1k+ parts

$12.712

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610

$14.124

$13.418

$12.712

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Lixinc

USA . 17,578 parts In-Stock

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iodParts Technologies Inc.

India . 12,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 5,464 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,670 parts In-Stock

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4,670

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,113 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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DigiPath Technology Company

USA . 155 parts In-Stock

1+ parts

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100+ parts

$12.734

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155

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$12.734

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Overview

Discover the Texas Instruments CDCLVD2102RGTR, a high-quality clock driver and buffer designed to meet your application needs. Manufactured by industry leader Texas Instruments, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this chip carrier package provides differential input conditioning and 2.5ns propagation delay at nominal supply voltage. Experience the benefits of precise signal timing, minimal skew, and industrial-grade temperature tolerance. Trust Texas Instruments to deliver cutting-edge solutions for your clock driver and buffer requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer product lifespan.

Propagation Delay At Nominal Supply: 2.5 ns

Fast propagation delay ensures efficient performance and accurate timing in clock applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Supports differential signaling, reducing noise and improving signal integrity for reliable operation.

Nominal Supply Voltage / Vsup (V): 2.5

Optimized for a supply voltage of 2.5V, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, providing versatility in various operating environments.

Minimum Supply Voltage (Vsup): 2.375 V

Supports a low supply voltage, saving power and enabling operation in energy-efficient designs.

Maximum fmax: 800 MHz

High maximum frequency allows for fast data processing and timing accuracy in clock applications.

Technical Specifications

Clock Drivers & Buffers CDCLVD2102RGTR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

106 mA

Propagation Delay At Nominal Supply:

2.5 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCLVD2102RGTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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