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NBSG11MN

Onsemi

NBSG11MN by Onsemi

NBSG11MN clock driver by Onsemi features a low propagation delay of 0.16 ns, differential input conditioning, and operates at a wide temperature range from -40 to 85 °C. It is suitable for applications requiring high-speed signal transmission, such as industrial-grade systems needing precise synchronization and fast data processing.

Median Price

$19.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,585 parts In-Stock

1+ parts

-

100+ parts

$17.440

1k+ parts

$15.610

10k+ parts

$14.690

13,585

-

$17.440

$15.610

$14.690

Verical

USA . 7,232 parts In-Stock

1+ parts

-

100+ parts

$21.800

1k+ parts

$19.512

10k+ parts

$18.363

7,232

-

$21.800

$19.512

$18.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,743 parts In-Stock

1+ parts

$18.478

100+ parts

-

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-

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1,743

$18.478

-

-

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Vyrian

USA . 4,161 parts In-Stock

1+ parts

-

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-

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4,161

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-

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Prism Electronics

USA . 137 parts In-Stock

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137

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Distributors (Availability)

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AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$8.210

100+ parts

-

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-

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-

800

$8.210

-

-

-

Corphita

USA . 798 parts In-Stock

1+ parts

$17.505

100+ parts

-

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-

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798

$17.505

-

-

-

Corohmni

South Africa . 256 parts In-Stock

1+ parts

$19.450

100+ parts

-

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10k+ parts

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256

$19.450

-

-

-

Component Stockers USA

USA . 15,531 parts In-Stock

1+ parts

$19.730

100+ parts

$18.540

1k+ parts

$16.780

10k+ parts

$16.780

15,531

$19.730

$18.540

$16.780

$16.780

Continental Prestige Electronics

USA . 13,643 parts In-Stock

1+ parts

-

100+ parts

$16.560

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-

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13,643

-

$16.560

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TANS Electronics

Latvia . 7,790 parts In-Stock

1+ parts

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7,790

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SupplyDigital Components

Austria . 6,212 parts In-Stock

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6,212

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Kulean Microsystems

USA . 4,990 parts In-Stock

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4,990

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Problanco Electronics

Mexico . 2,517 parts In-Stock

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2,517

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Perfect Parts

USA . 156 parts In-Stock

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156

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UHIMA Technologies

Türkiye . 130 parts In-Stock

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130

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Microchip USA

USA . 120 parts In-Stock

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120

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Overview

Unlock the power of precision and reliability with the NBSG11MN by Onsemi. As a leading manufacturer in clock drivers & buffers, Onsemi delivers top-notch quality and performance in every product. This versatile chip carrier is perfect for applications requiring differential input conditioning and a nominal supply voltage of 2.5V. With a propagation delay of just 0.16 ns, this industrial-grade device ensures seamless operation even in extreme temperatures. Experience unparalleled speed and efficiency with the NBSG11MN - your go-to solution for high-speed data transmission and synchronization. Choose Onsemi for superior technology that exceeds expectations.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 0.16 ns

This low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.

Input Conditioning: Differential

Differential input conditioning helps to reject common-mode noise, resulting in improved signal integrity and reliability in noisy environments.

Nominal Supply Voltage / Vsup: 2.5V

Operating at a low nominal supply voltage of 2.5V helps in reducing power consumption and heat dissipation, making it energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this clock driver can withstand harsh industrial environments without compromising performance.

Technical Specifications

Clock Drivers & Buffers NBSG11MN attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

10500 MHz

Trade Compliance

NBSG11MN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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