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NBSG14BAR2

Onsemi

NBSG14BAR2 by Onsemi

NBSG14BAR2 clock driver by Onsemi features a propagation delay of 0.15 ns, operates at a nominal voltage of 2.5V, and offers differential input conditioning. This device is ideal for applications requiring high-speed signal transmission in electronic systems with stringent timing requirements.

Median Price

$48.530

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,753 parts In-Stock

1+ parts

-

100+ parts

$48.530

1k+ parts

$48.530

10k+ parts

$48.530

7,753

-

$48.530

$48.530

$48.530

Rochester

USA . 7,748 parts In-Stock

1+ parts

-

100+ parts

$41.900

1k+ parts

$37.490

10k+ parts

$35.280

7,748

-

$41.900

$37.490

$35.280

Verical

USA . 7,348 parts In-Stock

1+ parts

-

100+ parts

$52.375

1k+ parts

$46.862

10k+ parts

-

7,348

-

$52.375

$46.862

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,271 parts In-Stock

1+ parts

$42.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,271

$42.170

-

-

-

Digiode

USA . 1,797 parts In-Stock

1+ parts

$44.327

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

$44.327

-

-

-

Prism Electronics

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 700 parts In-Stock

1+ parts

$41.994

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$41.994

-

-

-

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$42.170

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$42.170

-

-

-

Component Stockers USA

USA . 7,306 parts In-Stock

1+ parts

$47.630

100+ parts

$44.770

1k+ parts

$40.480

10k+ parts

-

7,306

$47.630

$44.770

$40.480

-

Continental Prestige Electronics

USA . 7,753 parts In-Stock

1+ parts

-

100+ parts

$39.740

1k+ parts

-

10k+ parts

-

7,753

-

$39.740

-

-

Problanco Electronics

Mexico . 7,751 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,751

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

-

Kulean Microsystems

USA . 664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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664

-

-

-

-

Microchip USA

USA . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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495

-

-

-

-

UHIMA Technologies

Türkiye . 447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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447

-

-

-

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SupplyDigital Components

Austria . 432 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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432

-

-

-

-

TANS Electronics

Latvia . 420 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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420

-

-

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Perfect Parts

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12

-

-

-

-

Overview

Elevate your clock signal performance with the NBSG14BAR2 by Onsemi. Crafted with precision and quality, this clock driver & buffer offers unmatched reliability and efficiency for various applications. Say goodbye to signal integrity issues and hello to seamless synchronization. With a low profile grid array package style and differential input conditioning, this product is designed to elevate your system's performance. Trust in Onsemi's expertise and experience in creating cutting-edge solutions for all your clocking needs. Experience the difference with the NBSG14BAR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 0.15 ns

Offers fast signal processing, making it ideal for high-speed clocking applications.

Surface Mount: YES

Facilitates easy and efficient installation onto a PCB, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Enables accurate and reliable signal transmission by minimizing noise and interference.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently within a standard voltage range, ensuring compatibility with various systems and devices.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Supports multiple power supply options, providing flexibility for different system configurations.

No. of Terminals: 16

Offers ample connection points for interfacing with other components, improving integration capabilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Features a compact and space-efficient design, making it suitable for applications with limited board space.

Maximum Operating Temperature: 70 °C

Operates reliably in a wide temperature range, ensuring performance in various environmental conditions.

Output Characteristics: SERIES-RESISTOR

Provides impedance matching and signal conditioning for robust signal output, enhancing signal integrity.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions, ensuring operational stability in harsh environments.

Terminal Finish: TIN LEAD

Offers a reliable and durable finish for the terminals, enabling secure connections and preventing corrosion.

Terminal Position: BOTTOM

Facilitates easy and secure PCB mounting, enhancing the overall stability of the clock driver.

Minimum Supply Voltage (Vsup): 2.375 V

Allows for operation at a low supply voltage, reducing power consumption and heat dissipation.

Peak Reflow Temperature °C: 235

Withstands high-temperature reflow processes during assembly, ensuring reliability and durability.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation, ideal for demanding applications.

No. of True Outputs: 4

Provides multiple synchronized output signals, supporting complex clocking requirements in digital systems.

Minimum fmax: 10700 MHz

Delivers high-frequency operation for rapid signal processing, suitable for advanced digital applications.

Moisture Sensitivity Level (MSL): 3

Meets industry standards for moisture sensitivity, ensuring reliability during storage and operation.

Maximum Supply Voltage (Vsup): 3.465 V

Supports a high supply voltage range, accommodating various system requirements and configurations.

Technical Specifications

Clock Drivers & Buffers NBSG14BAR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

RSNECL MODE: VCC = 0 V WITH VEE = -2.375 V TO -3.465 V

Family:

14

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

SERIES-RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.4 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Minimum fmax:

10700 MHz

Trade Compliance

NBSG14BAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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