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NBSG11MNHTBG

Onsemi

NBSG11MNHTBG by Onsemi

NBSG11MNHTBG by Onsemi is a Clock Driver with 0.16ns Propagation Delay, Differential Input Conditioning, and 2.5V Nominal Voltage. Ideal for high-speed applications in industrial settings due to its ECL technology and 10500MHz min fmax.

Median Price

$36.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,133 parts In-Stock

1+ parts

-

100+ parts

$36.660

1k+ parts

$32.800

10k+ parts

$30.870

24,133

-

$36.660

$32.800

$30.870

Verical

USA . 12,332 parts In-Stock

1+ parts

-

100+ parts

$45.825

1k+ parts

$41.000

10k+ parts

$38.587

12,332

-

$45.825

$41.000

$38.587

DigiKey

USA . 4,200 parts In-Stock

1+ parts

-

100+ parts

$34.010

1k+ parts

-

10k+ parts

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4,200

-

$34.010

-

-

Flip Electronics (Authorized)

USA . 4,200 parts In-Stock

1+ parts

-

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4,200

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-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 871 parts In-Stock

1+ parts

$34.010

100+ parts

-

1k+ parts

-

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871

$34.010

-

-

-

Digiode

USA . 392 parts In-Stock

1+ parts

$38.788

100+ parts

-

1k+ parts

-

10k+ parts

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392

$38.788

-

-

-

Flip Electronics

USA . 4,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 361 parts In-Stock

1+ parts

$34.010

100+ parts

-

1k+ parts

-

10k+ parts

-

361

$34.010

-

-

-

Corphita

USA . 1,713 parts In-Stock

1+ parts

$36.747

100+ parts

-

1k+ parts

-

10k+ parts

-

1,713

$36.747

-

-

-

Component Stockers USA

USA . 36,276 parts In-Stock

1+ parts

$41.870

100+ parts

$39.350

1k+ parts

$35.580

10k+ parts

$35.580

36,276

$41.870

$39.350

$35.580

$35.580

QUARKTWIN TECHNOLOGY LTD

USA . 29,798 parts In-Stock

1+ parts

-

100+ parts

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29,798

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Continental Prestige Electronics

USA . 24,426 parts In-Stock

1+ parts

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100+ parts

$34.770

1k+ parts

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24,426

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$34.770

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Problanco Electronics

Mexico . 7,908 parts In-Stock

1+ parts

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7,908

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SupplyDigital Components

Austria . 6,429 parts In-Stock

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6,429

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TANS Electronics

Latvia . 5,251 parts In-Stock

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Kulean Microsystems

USA . 611 parts In-Stock

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611

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Microchip USA

USA . 223 parts In-Stock

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223

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UHIMA Technologies

Türkiye . 18 parts In-Stock

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18

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Overview

Unlock the power of precise signal transmission with the NBSG11MNHTBG clock driver by Onsemi. Designed for industrial-grade applications, this chip carrier device offers unparalleled performance with a propagation delay of just 0.16 ns. With differential input conditioning and a wide range of power supply options, this clock driver ensures seamless operation in any environment. Trust in Onsemi's reputation for quality and reliability to elevate your projects to new heights of efficiency and accuracy.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.16 ns

Faster propagation delay ensures quick response and efficient operation of the clock driver.

Surface Mount: YES

Surface mount technology makes installation easier and saves space on the circuit board.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Compatible with a standard nominal supply voltage which makes it easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate at low temperatures, ensuring reliability in various environmental conditions.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making it ideal for clock drivers.

Technical Specifications

Clock Drivers & Buffers NBSG11MNHTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

10500 MHz

Trade Compliance

NBSG11MNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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