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ZL40222LDG1

Microchip Technology

ZL40222LDG1 by Microchip Technology

ZL40222LDG1 Clock Driver by Microchip: 2.5V supply, 2ns propagation delay, 16 true outputs. Ideal for industrial applications requiring differential mux input conditioning in a compact square package with quad terminals and low power consumption.

Median Price

$6.180

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 89 parts In-Stock

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$6.180

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Vyrian

USA . 1,246 parts In-Stock

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Continental Prestige Electronics

USA . 397 parts In-Stock

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$6.180

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$6.056

397

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$6.056

AZTECH Wire

Italy . 426 parts In-Stock

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$17.266

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Microchip USA

USA . 1,762 parts In-Stock

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$18.024

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Ampacity Inc.

Singapore . 898 parts In-Stock

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$37.000

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Marpe Global Electronics

Taiwan . 6,438 parts In-Stock

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Perfect Parts

USA . 2,744 parts In-Stock

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XL Components Corporation

Australia . 2,483 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.056

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$5.871

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$5.747

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QualityLine Systems

Poland . 398 parts In-Stock

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Argo Parts USA

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Overview

Enhance your clock driver and buffer performance with the ZL40222LDG1 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality products that guarantee reliability and precision. Ideal for applications requiring differential mux input conditioning, this square-shaped package boasts a nominal supply voltage of 2.5V and a fast propagation delay of just 2ns. With 32 terminals and a compact design, this clock driver offers customers unparalleled value, benefits, and advantages that will elevate their projects to new heights. Choose the ZL40222LDG1 for seamless integration and superior performance.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs, great for compact designs.

Input Conditioning: DIFFERENTIAL MUX

Allows for versatile signal processing capabilities.

Package Shape: SQUARE

Saves space on PCB and allows for efficient layout.

Nominal Supply Voltage / Vsup (V): 2.5

Suitable for a wide range of applications with stable power.

No. of Terminals: 32

Sufficient for connecting multiple components in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides thermal management and compact design options.

Propagation Delay (tpd): 2 ns

Ensures fast signal processing for real-time applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme temperature conditions.

Terminal Position: QUAD

Simplifies PCB layout and connections.

Maximum Seated Height: 1 mm

Low profile design saves space in compact applications.

Width: 5 mm

Compact size for fitting into tight spaces on PCB.

Minimum Supply Voltage (Vsup): 2.375 V

Can operate at low voltages for energy-efficient designs.

Length: 5 mm

Compact size for efficient PCB routing.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: NO LEAD

Easy to solder on PCBs and environmentally friendly.

Packing Method: TRAY

Secure packaging for transportation and storage.

Terminal Pitch: 0.5 mm

Allows for close spacing of terminals for compact design.

Maximum Same Edge Skew (tskwd): 150 ns

Ensures signal integrity and synchronization.

No. of True Outputs: 16

Multiple outputs for driving various components in a system.

Maximum Supply Voltage (Vsup): 2.625 V

Provides headroom for voltage fluctuations in the system.

Technical Specifications

Clock Drivers & Buffers ZL40222LDG1 attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V SUPPLY

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TRAY

Propagation Delay (tpd):

2 ns

Maximum Same Edge Skew (tskwd):

150 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ZL40222LDG1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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