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NBSG11MNR2G

Onsemi

NBSG11MNR2G by Onsemi

NBSG11MNR2G by Onsemi is a Clock Driver with 0.16 ns Propagation Delay, suitable for industrial applications. It features Differential Input Conditioning, operates at 2.5V, and has a max frequency of 10500 MHz. Ideal for high-speed signal transmission in electronic systems.

Median Price

$22.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$33.120

100+ parts

-

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3,000

$33.120

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Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

$33.120

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3,000

$33.120

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Rochester

USA . 14,986 parts In-Stock

1+ parts

-

100+ parts

$17.440

1k+ parts

$15.610

10k+ parts

$14.690

14,986

-

$17.440

$15.610

$14.690

DigiKey

USA . 14,986 parts In-Stock

1+ parts

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$22.950

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14,986

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$22.950

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Verical

USA . 9,000 parts In-Stock

1+ parts

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100+ parts

$21.800

1k+ parts

$19.512

10k+ parts

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9,000

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$21.800

$19.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 65 parts In-Stock

1+ parts

$18.478

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65

$18.478

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Vyrian

USA . 252 parts In-Stock

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$19.450

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252

$19.450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,753 parts In-Stock

1+ parts

$17.505

100+ parts

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1,753

$17.505

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Corohmni

South Africa . 299 parts In-Stock

1+ parts

$19.450

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299

$19.450

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Perfect Parts

USA . 16,864 parts In-Stock

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16,864

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SupplyDigital Components

Austria . 5,229 parts In-Stock

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5,229

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TANS Electronics

Latvia . 5,166 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 2,969 parts In-Stock

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2,969

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Kulean Microsystems

USA . 1,311 parts In-Stock

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Microchip USA

USA . 1,051 parts In-Stock

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1,051

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UHIMA Technologies

Türkiye . 568 parts In-Stock

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568

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Problanco Electronics

Mexico . 143 parts In-Stock

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Overview

Unlock peak performance and precision with the NBSG11MNR2G clock driver & buffer by Onsemi. Crafted with unparalleled quality and expertise, this innovative product delivers lightning-fast propagation delays of just 0.16 ns, ensuring seamless synchronization in your applications. Designed for industrial use, this surface-mount chip carrier boasts differential input conditioning, making it ideal for a variety of high-speed circuits. Elevate your projects with the reliability and efficiency that only Onsemi can provide.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 0.16 ns

Low propagation delay ensures fast signal transmission and efficient performance.

Surface Mount

Easy installation and space-saving design.

Input Conditioning Differential

Enhanced signal integrity and noise immunity.

Nominal Supply Voltage / Vsup (V) 2.5

Suitable for a wide range of applications with a common supply voltage.

Package Shape Square

Compact and efficient use of space in circuit design.

Maximum Operating Temperature 85 °C

Can withstand high temperature environments, suitable for industrial settings.

Technology ECL

ECL technology offers high-speed performance and low power consumption.

Minimum fmax 10500 MHz

High maximum frequency ensures reliable operation in high-speed applications.

No. of True Outputs 2

Multiple true outputs for versatile signal routing.

Technical Specifications

Clock Drivers & Buffers NBSG11MNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

10500 MHz

Trade Compliance

NBSG11MNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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