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NBSG11MNR2

Onsemi

NBSG11MNR2 by Onsemi

NBSG11MNR2 by Onsemi is a Clock Driver & Buffer with 0.16 ns Propagation Delay, Differential Input Conditioning, and 2.5V Nominal Voltage. Ideal for high-speed applications in industrial settings due to its ECL technology and 10500 MHz min fmax.

Median Price

$20.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

$17.470

1k+ parts

$15.630

10k+ parts

$14.710

9,540

-

$17.470

$15.630

$14.710

DigiKey

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

$20.230

1k+ parts

-

10k+ parts

-

9,540

-

$20.230

-

-

Verical

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

$21.837

1k+ parts

$19.538

10k+ parts

-

9,540

-

$21.837

$19.538

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 858 parts In-Stock

1+ parts

$18.478

100+ parts

-

1k+ parts

-

10k+ parts

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858

$18.478

-

-

-

Vyrian

USA . 106 parts In-Stock

1+ parts

$19.450

100+ parts

-

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-

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106

$19.450

-

-

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Semi Source

USA . 45 parts In-Stock

1+ parts

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45

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$16.388

100+ parts

$14.913

1k+ parts

$13.438

10k+ parts

-

1,000

$16.388

$14.913

$13.438

-

Corphita

USA . 2,168 parts In-Stock

1+ parts

$17.505

100+ parts

-

1k+ parts

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10k+ parts

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2,168

$17.505

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-

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Corohmni

South Africa . 157 parts In-Stock

1+ parts

$19.450

100+ parts

-

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10k+ parts

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157

$19.450

-

-

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Continental Prestige Electronics

USA . 9,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$16.560

10k+ parts

-

9,540

-

-

$16.560

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TANS Electronics

Latvia . 3,571 parts In-Stock

1+ parts

-

100+ parts

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3,571

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Kepictronics

USA . 2,720 parts In-Stock

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2,720

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SupplyDigital Components

Austria . 2,412 parts In-Stock

1+ parts

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2,412

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Kulean Microsystems

USA . 1,587 parts In-Stock

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1,587

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UHIMA Technologies

Türkiye . 774 parts In-Stock

1+ parts

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774

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Microchip USA

USA . 119 parts In-Stock

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119

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Problanco Electronics

Mexico . 56 parts In-Stock

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Overview

Unleash the power of precision and reliability with the NBSG11MNR2 by Onsemi. As a leading manufacturer in clock drivers & buffers, Onsemi delivers unmatched quality and performance in every product. The NBSG11MNR2 offers ultra-fast propagation delay, differential input conditioning, and a wide range of power supplies for versatile applications. Experience seamless operation and enhanced efficiency with this cutting-edge chip carrier, heat sink/slug package. Elevate your projects to new heights with the NBSG11MNR2 from Onsemi.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures high speed performance.

Surface Mount

Ability for surface mount installation saves space and allows for compact design.

Input Conditioning

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V)

Compatible with common supply voltages, making it versatile for various applications.

Power Supplies (V)

Supports a wide range of power supply voltages, providing flexibility in system design.

Package Shape

Square package shape makes it easier to mount and integrate into circuit boards.

Technology

ECL technology offers fast switching speeds and high frequency operation.

Maximum Operating Temperature

Wide operating temperature range allows for reliable performance in various environments.

Minimum Operating Temperature

Suitable for use in both extreme cold and hot conditions.

Technical Specifications

Clock Drivers & Buffers NBSG11MNR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Minimum fmax:

10500 MHz

Trade Compliance

NBSG11MNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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