Loading...

NBSG11BAR2

Onsemi

NBSG11BAR2 by Onsemi

NBSG11BAR2 clock driver by Onsemi features a propagation delay of 0.16 ns, operates at a nominal voltage of 2.5V, and has differential input conditioning. This ECL technology device with 16 terminals is ideal for applications requiring high-speed signal synchronization in electronic systems.

Median Price

$39.274

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,645 parts In-Stock

1+ parts

-

100+ parts

$34.910

1k+ parts

$31.240

10k+ parts

$29.400

4,645

-

$34.910

$31.240

$29.400

Verical

USA . 3,045 parts In-Stock

1+ parts

-

100+ parts

$43.638

1k+ parts

$39.050

10k+ parts

-

3,045

-

$43.638

$39.050

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 339 parts In-Stock

1+ parts

$36.936

100+ parts

-

1k+ parts

-

10k+ parts

-

339

$36.936

-

-

-

Vyrian

USA . 7,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,852

-

-

-

-

Bristol Electronics

USA . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

185

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 963 parts In-Stock

1+ parts

$17.310

100+ parts

-

1k+ parts

-

10k+ parts

-

963

$17.310

-

-

-

Corphita

USA . 641 parts In-Stock

1+ parts

$34.992

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$34.992

-

-

-

Corohmni

South Africa . 73 parts In-Stock

1+ parts

$35.140

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$35.140

-

-

-

Kulean Microsystems

USA . 7,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,365

-

-

-

-

TANS Electronics

Latvia . 7,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,104

-

-

-

-

Continental Prestige Electronics

USA . 4,745 parts In-Stock

1+ parts

-

100+ parts

$33.110

1k+ parts

-

10k+ parts

-

4,745

-

$33.110

-

-

Problanco Electronics

Mexico . 4,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,675

-

-

-

-

SupplyDigital Components

Austria . 2,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,804

-

-

-

-

Microchip USA

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

UHIMA Technologies

Türkiye . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

Overview

Elevate your clock signal performance with the NBSG11BAR2 by Onsemi, a top-quality clock driver and buffer designed to meet your precision timing needs. Manufactured by industry leader Onsemi, this innovative product offers unrivaled reliability and performance in a compact package. Ideal for a variety of applications, this clock driver is perfect for ensuring optimal signal integrity and synchronization in your designs. Trust Onsemi's expertise and choose the NBSG11BAR2 for superior clock signal management that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body helps in reducing overall weight of the product while maintaining durability.

Propagation Delay At Nominal Supply: 0.16 ns

The low propagation delay ensures fast switching speeds, making this product suitable for high-speed clocking applications.

Surface Mount: YES

The surface mount capability makes installation and assembly easier, saving time and effort in the manufacturing process.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in minimizing noise interference and improving signal integrity, making this product suitable for sensitive clocking applications.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage makes this product compatible with a wide range of electronic devices and systems.

Technology: ECL

The ECL technology used in this product allows for high-speed operation and low power consumption, making it efficient for clock driver applications.

Technical Specifications

Clock Drivers & Buffers NBSG11BAR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.4 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Minimum fmax:

10709 MHz

Trade Compliance

NBSG11BAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19