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PI6C5921516ZDIEX

Diodes Incorporated

PI6C5921516ZDIEX by Diodes Incorporated

PI6C5921516ZDIEX clock driver by Diodes Inc. features 16 true outputs, 0.7 ns propagation delay, and 1500 MHz min fmax. It is used in applications requiring differential mux input conditioning, with a package style of chip carrier and operating temperature range from -40 to 85 °C.

Median Price

$10.180

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,755 parts In-Stock

1+ parts

$10.180

100+ parts

$6.778

1k+ parts

$6.164

10k+ parts

$5.985

4,755

$10.180

$6.778

$6.164

$5.985

Mouser Electronics

USA . 2,914 parts In-Stock

1+ parts

$10.180

100+ parts

$6.780

1k+ parts

$6.170

10k+ parts

$5.980

2,914

$10.180

$6.780

$6.170

$5.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,640

-

-

-

-

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,963 parts In-Stock

1+ parts

$9.200

100+ parts

-

1k+ parts

-

10k+ parts

-

3,963

$9.200

-

-

-

Andel Nordic

Denmark . 5,061 parts In-Stock

1+ parts

$10.813

100+ parts

-

1k+ parts

$10.380

10k+ parts

$10.380

5,061

$10.813

-

$10.380

$10.380

Corohmni

South Africa . 255 parts In-Stock

1+ parts

$33.675

100+ parts

-

1k+ parts

-

10k+ parts

-

255

$33.675

-

-

-

Continental Prestige Electronics

USA . 5,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,981

-

-

-

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Argo Parts USA

USA . 1,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,155

-

-

-

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10

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-

Overview

Elevate your clock driver and buffer needs with the PI6C5921516ZDIEX by Diodes Incorporated. Known for their top-notch quality and innovation, Diodes Incorporated delivers a product that exceeds expectations in the clock drivers & buffers category. This surface mount device offers differential mux input conditioning and a nominal supply voltage of 2.5V, making it versatile for a variety of applications. With a fast propagation delay of just 0.7 ns and a wide temperature range, this chip carrier is a reliable choice for your electronic designs. Experience the value and benefits that this product brings to your projects and elevate your performance today.

Feature Benefit Bullets

Surface Mount:

YES - This feature allows for easy and convenient installation on a circuit board, saving time and effort.

Input Conditioning:

DIFFERENTIAL MUX - Provides high precision and accuracy in transmitting and receiving signals effectively.

Package Shape:

SQUARE - Offers a compact and space-saving design for efficient integration into various electronic systems.

Nominal Supply Voltage (Vsup):

2.5V - Ensures stable and reliable power supply for optimal performance.

No. of Terminals:

48 - Provides ample connectivity options for versatile configuration possibilities.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Ideal for applications requiring efficient heat dissipation and space constraints.

Propagation Delay (tpd):

0.7 ns - Offers fast signal processing and reduces latency for improved overall performance.

Maximum Operating Temperature:

85 °C - Ensures the product can operate reliably in a wide range of environmental conditions.

Minimum Operating Temperature:

40 °C - Allows for use in extreme cold environments without compromising functionality.

Terminal Position:

QUAD - Facilitates easy connection and compatibility with other components in the system.

Maximum Seated Height:

1 mm - Enables compact and low-profile designs for space-constrained applications.

Width:

7 mm - Provides a compact form factor for easy integration into small electronic devices.

Minimum Supply Voltage (Vsup):

2.375 V - Allows for operation at lower power levels while maintaining efficiency.

Length:

7 mm - Offers a balanced form factor for enhanced compatibility with various circuit layouts.

Technology:

CMOS - Utilizes low power consumption and high-speed operation for energy-efficient performance.

Terminal Form:

NO LEAD - Simplifies the installation process and reduces the risk of damage during handling.

Packing Method:

TR - Ensures secure packaging for safe transportation and storage.

Terminal Pitch:

0.5 mm - Provides precise spacing for efficient connectivity and signal transmission.

Maximum Same Edge Skew (tskwd):

0.05 ns - Minimizes signal skew for improved data integrity and reliability.

No. of True Outputs:

16 - Offers multiple output options for versatile signal processing capabilities.

Minimum fmax:

1500 MHz - Supports high-frequency operation for demanding applications.

Maximum Supply Voltage (Vsup):

2.625 V - Allows for operation at higher voltages without compromising performance.

Maximum Power Supply Current (ICC):

235 mA - Provides sufficient power for consistent and reliable operation under load.

Technical Specifications

Clock Drivers & Buffers PI6C5921516ZDIEX attributes and parameters. Explore more Clock Drivers & Buffers devices from Diodes Incorporated

Specs

Additional Features:

ALSO OPERATE AT 3.3V SUPPLY

Family:

6C

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

235 mA

Propagation Delay (tpd):

.7 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Minimum fmax:

1500 MHz

Trade Compliance

PI6C5921516ZDIEX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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