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MC100LVEP11DTG

Onsemi

MC100LVEP11DTG by Onsemi

MC100LVEP11DTG clock driver by Onsemi features 0.31 ns propagation delay, 2.5V nominal voltage, and 50mA max power supply current. Ideal for industrial applications requiring differential input conditioning and fast signal propagation in a compact thin profile package.

Median Price

$6.849

Lifecycle Status

Suppliers In-Stock

19

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1k+

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Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$6.670

100+ parts

$5.250

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$4.750

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8

$6.670

$5.250

$4.750

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Arrow

USA . 171 parts In-Stock

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$7.028

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$5.235

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$4.672

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171

$7.028

$5.235

$4.672

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DigiKey

USA . 149 parts In-Stock

1+ parts

$9.070

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$5.995

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$5.440

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149

$9.070

$5.995

$5.440

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Mouser Electronics

USA . 34 parts In-Stock

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$9.070

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$5.990

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$5.190

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34

$9.070

$5.990

$5.190

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Rochester

USA . 20,173 parts In-Stock

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-

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$4.950

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$4.430

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$4.170

20,173

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$4.950

$4.430

$4.170

Flip Electronics (Authorized)

USA . 14,988 parts In-Stock

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Verical

USA . 9,300 parts In-Stock

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$4.981

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$4.981

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Distributors (In-Stock)

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Digiode

USA . 409 parts In-Stock

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$5.225

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409

$5.225

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Nova Conductors

Japan . 100 parts In-Stock

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$5.465

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100

$5.465

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NAC Semi

USA . 25 parts In-Stock

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$6.340

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25

$6.340

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Flip Electronics

USA . 24,288 parts In-Stock

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Vyrian

USA . 5,210 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 374 parts In-Stock

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374

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Bristol Electronics

USA . 281 parts In-Stock

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Connector Distribution Corp

USA . 213 parts In-Stock

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Right Parts Inc.

USA . 213 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 88 parts In-Stock

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Elcom Components

USA . 7 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,681 parts In-Stock

1+ parts

$4.660

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5,681

$4.660

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Corphita

USA . 144 parts In-Stock

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$4.950

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$4.950

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Corohmni

South Africa . 449 parts In-Stock

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$5.480

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$5.480

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Aztec Data Supply Inc.

USA . 879 parts In-Stock

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$13.960

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Microchip USA

USA . 2,268 parts In-Stock

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$27.970

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$27.570

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$27.370

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$27.170

2,268

$27.970

$27.570

$27.370

$27.170

Problanco Electronics

Mexico . 8,366 parts In-Stock

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SupplyDigital Components

Austria . 6,201 parts In-Stock

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TANS Electronics

Latvia . 4,503 parts In-Stock

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Continental Prestige Electronics

USA . 3,852 parts In-Stock

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Argo Parts USA

USA . 3,574 parts In-Stock

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Lixinc

USA . 3,284 parts In-Stock

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Kulean Microsystems

USA . 2,581 parts In-Stock

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Perfect Parts

USA . 1,261 parts In-Stock

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UHIMA Technologies

Türkiye . 941 parts In-Stock

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Glotronic Ltd.

UK . 320 parts In-Stock

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Authorized Procurement Solutions

USA . 136 parts In-Stock

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Overview

Experience unparalleled speed and precision with the MC100LVEP11DTG clock driver by Onsemi. As a leading manufacturer in the industry, Onsemi's clock drivers & buffers are designed for optimal performance and reliability. Whether you're looking to enhance the efficiency of your communication systems or streamline your data processing applications, this product offers unmatched value with its fast propagation delay, differential input conditioning, and wide operating temperature range. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 0.36 ns

The low propagation delay ensures fast and efficient operation of the clock drivers, allowing for precise timing in electronic systems.

Surface Mount: YES

Surface mount technology makes installation and assembly easier, saving time and reducing the overall size of the product.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps improve signal integrity and reduce noise, resulting in more accurate clock signals.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is commonly used in many electronic systems, ensuring compatibility with a wide range of applications.

No. of True Outputs: 2

Having multiple true outputs allows for flexibility in connecting to different components, expanding the functionality of the product.

Technical Specifications

Clock Drivers & Buffers MC100LVEP11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.36 ns

Propagation Delay (tpd):

.31 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100LVEP11DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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