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MC100EP210SFA

Onsemi

MC100EP210SFA by Onsemi

MC100EP210SFA clock driver by Onsemi features a propagation delay of 0.65 ns, operates at a nominal voltage of 2.5V, and offers differential input conditioning. This device is ideal for applications requiring precise clock signal distribution in industrial settings due to its ECL technology and low profile flatpack package style.

Median Price

$7.309

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 16 parts In-Stock

1+ parts

$7.309

100+ parts

$7.675

1k+ parts

$7.236

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16

$7.309

$7.675

$7.236

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Vyrian

USA . 4,163 parts In-Stock

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Chip Stock

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Digiode

USA . 1,358 parts In-Stock

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1,358

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Resion

USA . 128 parts In-Stock

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128

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Semi Source

USA . 75 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Zilex Electronics Inc.

Canada . 44 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Cyclops Electronics Ltd

UK . 8 parts In-Stock

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Prism Electronics

USA . 7 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,081 parts In-Stock

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$9.000

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1,081

$9.000

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AZTECH Wire

Italy . 571 parts In-Stock

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$9.239

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571

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Corohmni

South Africa . 288 parts In-Stock

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$15.773

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$21.126

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$19.225

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$17.323

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$17.323

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Aztec Data Supply Inc.

USA . 271 parts In-Stock

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$27.521

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SupplyDigital Components

Austria . 6,894 parts In-Stock

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Problanco Electronics

Mexico . 3,075 parts In-Stock

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Continental Prestige Electronics

USA . 2,605 parts In-Stock

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Argo Parts USA

USA . 1,706 parts In-Stock

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Corphita

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Aranea Global

USA . 1,000 parts In-Stock

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Kulean Microsystems

USA . 796 parts In-Stock

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Microchip USA

USA . 336 parts In-Stock

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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TANS Electronics

Latvia . 81 parts In-Stock

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Overview

Unleash the power of precision with the MC100EP210SFA clock driver & buffer by Onsemi. Crafted with quality and expertise, this product offers unparalleled performance in a variety of applications. With a narrow propagation delay and differential input conditioning, this device ensures seamless operation and reliable signal transmission. Whether you're designing high-speed communication systems or advanced computing solutions, the MC100EP210SFA delivers unmatched precision and efficiency. Trust Onsemi to provide the cutting-edge technology you need to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use

Propagation Delay At Nominal Supply: 0.675 ns

Ensures fast and efficient signal transmission

Surface Mount: YES

Allows for easy integration onto circuit boards

Input Conditioning: DIFFERENTIAL

Enhances signal integrity and reduces noise interference

Nominal Supply Voltage / Vsup (V): 2.5

Compatible with standard power sources

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature requirements

Minimum Supply Voltage (Vsup): 2.375 V

Provides a narrow operating range for optimal performance

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed operation

Technical Specifications

Clock Drivers & Buffers MC100EP210SFA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

.675 ns

Propagation Delay (tpd):

.65 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100EP210SFA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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