Loading...

NBSG11MA1TBG

Onsemi

NBSG11MA1TBG by Onsemi

NBSG11MA1TBG clock driver by Onsemi features a propagation delay of 0.16 ns, operates at a nominal voltage of 2.5V, and has differential input conditioning. This device is suitable for applications requiring precise clock signal distribution in electronic systems with high-speed data processing requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,992

-

-

-

-

Digiode

USA . 811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

811

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,411

-

-

-

-

TANS Electronics

Latvia . 5,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,523

-

-

-

-

SupplyDigital Components

Austria . 1,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,273

-

-

-

-

Corohmni

South Africa . 387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

387

-

-

-

-

Corphita

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

112

-

-

-

-

Kulean Microsystems

USA . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

UHIMA Technologies

Türkiye . 83 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

83

-

-

-

-

Overview

Elevate your electronics with the NBSG11MA1TBG from Onsemi, a leading manufacturer in clock drivers & buffers. With impressive propagation delay and differential input conditioning, this product is perfect for a wide range of applications. From telecommunications to data centers, this square package offers exceptional value and performance. Say goodbye to delays and hello to seamless operation with this high-quality, reliable component. Trust Onsemi to deliver the innovation and precision you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and cost-effective for mass production.

Propagation Delay At Nominal Supply: 0.16 ns

The low propagation delay ensures fast and efficient operation of the clock driver, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto PCBs, saving space and making assembly simpler.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in maintaining signal integrity and reducing noise, ensuring reliable clock signal generation.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage is commonly used in many electronic systems, making this clock driver compatible with various applications.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Support for multiple power supply voltages gives flexibility in operating the clock driver in different systems and environments.

No. of Terminals: 16

With 16 terminals, this clock driver can accommodate multiple connections and signals for complex clock distribution networks.

Package Style (Meter): GRID ARRAY, THIN PROFILE

The grid array and thin profile package style helps in minimizing footprint on the PCB, making it suitable for space-constrained designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this clock driver to function reliably in harsh environmental conditions.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, ideal for demanding clock distribution applications.

Technical Specifications

Clock Drivers & Buffers NBSG11MA1TBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

11

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.16 ns

Propagation Delay (tpd):

.16 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.03 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Minimum fmax:

10709 MHz

Trade Compliance

NBSG11MA1TBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19